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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	越来越多的功能	引脚数	触点形状	外壳材料	供应商器件包装	材料	插入材料	终端数量	材料类型																									厂商																																		操作温度	包装	系列	尺寸/尺寸	容差	JESD-609代码	零件状态	湿度敏感性等级(MSL)	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	端子表面处理	最高工作温度	最小工作温度	组成	颜色	应用	功率(瓦特)	附加功能	HTS代码	紧固类型	子类别	触点类型	额定电流	技术	电压 - 供电	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	额定电流	频率	时间@峰值回流温度-最大值(s)	基本部件号	外壳完成	引脚数量	外壳尺寸-插入	JESD-30代码	输出的数量	资历状况	房屋颜色	输出类型	工作电源电压	失败率	电源	温度等级	注意	速度	内存大小	外壳尺寸，MIL	核心处理器	周边设备	连接方式	电流源	保护措施	建筑学	输入数量	组织结构	座位高度-最大	产品类别	筛选水平	寄存器数量	逻辑块数量
XCZU47DR-L2FSVG1517I	AMD	数据表	814 In Stock	1: ¥242,917.871781 10: ¥234,930.243500 25: ¥233,297.163359 50: ¥231,675.435309 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Free Hanging (In-Line)	1517-BBGA, FCBGA	-	铝合金	1517-FCBGA (40x40)	ITT Cannon, LLC				50V	Bulk	Metal	CA310	活跃	Silver	561						-55°C ~ 125°C		MIL-DTL-5015, CA-B							焊杯		Plug, Female Sockets			5					橄榄色					反向卡口锁						N (Normal)		-		IP67 - Dust Tight, Waterproof			41A, 245A				橄榄色镉		32-1											533MHz, 1.333GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-				-									-
XC7Z045-3FFV676E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	Bulk	Obsolete												130	0°C ~ 100°C (TJ)		Zynq®-7000																																																					1GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Kintex™-7 FPGA, 350K Logic Cells							-
XCVC1502-1MSIVSVA2197	AMD	数据表	611 In Stock	1: ¥132,999.169901 10: ¥128,625.889650 25: ¥127,731.767284 50: ¥126,843.860258 查看所有的价格 -	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃												586			Versal™ AI Core																																																					600MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA												Versal™ AI Core FPGA, 800k Logic Cells							-
BCM33843MRKFSBGB0T	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Broadcom Limited				-	Tray	BCM33843	活跃									-		-																																																					2.4GHz, 5GHz	-		-	-		-			-												-							-
AGFB008R16A2E2V	Intel	数据表	931 In Stock	1: ¥70,606.511783 10: ¥68,284.827644 25: ¥67,810.156547 50: ¥67,338.785050 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206	KOA Speer Electronics, Inc.				Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	RK73G2B	活跃	384									-55°C ~ 155°C		RK73G-RT	0.126 L x 0.063 W (3.20mm x 1.60mm)	±0.5%				2		±50ppm/°C			56.2 Ohms					厚膜			0.25W, 1/4W																														-				1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA												FPGA - 764K Logic Elements							-				Anti-Sulfur, Automotive AEC-Q200						0.028 (0.70mm)					AEC-Q200
A2F500M3G-1PQG208I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	208-BFQFP	YES	Flange	Circular	Composite	208-PQFP (28x28)	Plastic	208	微芯片技术	20	MCU - 22, FPGA - 66	Tray	A2F500	活跃	FQFP, QFP208,1.2SQ,20	FLATPACK, FINE PITCH	3	PLASTIC/EPOXY	QFP208,1.2SQ,20	1.5 V	30	1.425 V	有	A2F500M3G-1PQG208I	100 MHz	FQFP	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.575 V	5.59					--	-65°C ~ 175°C	Bulk	MIL-DTL-38999 Series III, ACT				活跃	--				插座外壳	用于内螺纹插座		10	Pure Matte Tin (Sn)								8542.39.00.01	Threaded	现场可编程门阵列	Crimp		CMOS		QUAD	B	鸥翼	Shielded	245	抗环境干扰	0.5 mm	compliant					Chromate over Cadmium		13-98	S-PQFP-G208	66	不合格	橄榄色				1.5,1.8,2.5,3.3 V		不包括触点	100MHz	64KB	C	ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART			MCU, FPGA	66	11520 CLBS, 500000 GATES	4.1 mm	现场可编程门阵列				--		1		ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		11520	11520			500000	512KB				--						28 mm	28 mm		--
PIMX8QM5AVUDDAA	NXP	数据表	100000 In Stock	-	最小起订量: 1 最小包装量: 1	面板安装	Flange	Circular	Composite	Plastic							--	12 (12), 16 (12)				-65°C ~ 200°C	Bulk	MIL-DTL-38999 Series III, ACT				活跃	--				插座外壳	用于内螺纹插座		24										Threaded		Crimp					A		Shielded		抗环境干扰							化学镍		25-24				Silver						不包括触点			J															--															--										--
10AS022C4U19I3SG	ALTERA	数据表	874 In Stock	1: ¥6,081.535183 10: ¥5,737.297346 100: ¥5,412.544665 500: ¥5,106.174207 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	6-CLCC	YES	484	6-CLCC (7x5)	484	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS022C4U19I3SG	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.46									192	Compliant	-40°C ~ 85°C	Tape & Reel (TR)	FemtoClock® NG				活跃						VCXO				100 °C	-40 °C						8542.39.00.01		现场可编程门阵列			CMOS	2.375 V ~ 2.625 V	BOTTOM		BALL		未说明		0.8 mm	compliant		155.52MHz		IDT8N3SV75LC				S-PBGA-B484	192	不合格			1.8 V		0.9 V	INDUSTRIAL		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	120mA		MCU, FPGA	192		3.25 mm	现场可编程门阵列						3		FPGA - 220K Logic Elements	334920		220000				--						--					19 mm	19 mm
M2S150T-FCG1152I	Microchip	数据表	2607 In Stock	1: ¥3,648.933630 10: ¥3,442.390217 100: ¥3,247.537942 500: ¥3,063.715039 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	有	M2S150T-FCG1152I	BGA	SQUARE	微芯片技术	Microsemi Corporation	5.77	1.26 V	MICROSEMI CORP	活跃									Non-Compliant	574	Tray	M2S150	活跃	-	166 MHz	146124 LE	+ 100 C	- 40 C	SMD/SMT	-	64 kB	BGA, BGA1152,34X34,40	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	1.14 V	-40°C ~ 100°C (TJ)		SmartFusion®2			e1										Tin/Silver/Copper (Sn/Ag/Cu)								8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		250		1 mm	compliant			40					S-PBGA-B1152	574	不合格			1.2 V		1.2 V			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	574		2.9 mm	现场可编程门阵列								FPGA - 150K Logic Modules			146124	1 Core			512KB										35 mm	35 mm
M2S025T-FGG484	Microchip	数据表	2690 In Stock	1: ¥917.930294 10: ¥865.971974 100: ¥816.954695 500: ¥770.711974 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	微芯片技术								1.2000 V	1.14 V	1.26 V	有	-	166 MHz	27696 LE	273 I/O	+ 85 C	0 C	60	SMD/SMT	2308 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB	Tray	M2S025	活跃					0 to 85 °C	Tray	SmartFusion2																							SOC - Systems on a Chip																									1.2 V					166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							SoC FPGA			STD		FPGA - 25K Logic Modules				1 Core			256KB					SoC FPGA
M2S060-1FCSG325	Microchip	数据表	2735 In Stock	1: ¥1,188.657337 10: ¥1,121.374846 100: ¥1,057.900798 500: ¥998.019622 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	微芯片技术										Miscellaneous	1.2000 V	Compliant	200	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB		0 to 85 °C		SmartFusion®2																																																					166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA										1		FPGA - 60K Logic Modules				1 Core			256KB
XCZU4EG-3SFVC784E	AMD	数据表	869 In Stock	1: ¥15,074.529362 10: ¥14,578.848509 25: ¥14,477.505974 50: ¥14,376.867897 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD				139743	Schneider	0.9000 V	0.873 V	0.927 V	252	Tray	XCZU4	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																																					600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA										3		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells							-			Threaded
XCZU7CG-2FBVB900I	AMD	数据表	601 In Stock	1: ¥29,024.267371 10: ¥28,069.891074 25: ¥27,874.767698 50: ¥27,681.000696 查看所有的价格 -	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Turck	0.8500 V	0.808 V	0.892 V	204	Tray	XCZU7	活跃												-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																																																					533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA										2		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells							-
M2S010-VFG256I	Microchip	数据表	6000 In Stock	1: ¥415.846182 10: ¥392.307716 100: ¥370.101618 500: ¥349.152477 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	有	-	166 MHz	12084 LE	138 I/O	+ 100 C	- 40 C	119	SMD/SMT	1007 LAB	Microchip Technology / Atmel	Details	-	64 kB	Tray	M2S010	微芯片技术	活跃	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	有	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76										UX07628	UL	Turck	TPE	Cat 5e	2.5, 3.3 V	1.14 V	1.26 V	-40 to 100 °C	Tray	SmartFusion2			e1						RJ45				Tin/Silver/Copper (Sn/Ag/Cu)				Teal			LG-MIN, WD-MIN	8542.39.00.01		SOC - Systems on a Chip			CMOS		BOTTOM		BALL	有	250		0.8 mm	compliant								S-PBGA-B256	138	不合格			1.2 V		1.2 V			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	138		1.56 mm	现场可编程门阵列			SoC FPGA			STD		FPGA - 10K Logic Modules		12084	1 Core			256KB		SoC FPGA	无	39 Feet	14 mm
XCZU11EG-L2FFVF1517E	AMD	数据表	722 In Stock	1: ¥45,143.635833 10: ¥43,659.222277 25: ¥43,355.732148 50: ¥43,054.351689 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	FCBGA	0.8500 V	0.808 V	464	0.892 V	表面贴装	464	Tray	XCZU11	活跃												4000-70403-0100220	UR	Murrelektronik	无	653,100	0 to 110 °C		Zynq® UltraScale+™ MPSoC EG																	Black																								1517												533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA									扩展工业	2L		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	597,120						-
XCZU3CG-L1SFVC784I	AMD	数据表	544 In Stock	1: ¥4,722.998402 10: ¥4,455.658869 100: ¥4,203.451767 500: ¥3,965.520529 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD				DH365NDKV	Cutler Hammer, Div of Eaton Corp	0.8500 V	0.808 V	0.892 V	252	Tray	XCZU3	活跃									-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																																																					500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA										1L		Zynq®UltraScale+™ FPGA, 154K+ Logic Cells							-
M2S050-FGG484	Microchip	数据表	6000 In Stock	1: ¥738.016373 10: ¥696.241861 100: ¥656.831945 500: ¥619.652779 查看所有的价格 -	最小起订量: 1 最小包装量: 1	BGA-484	484-FPBGA (23x23)	Polyester	Tray	M2S050	微芯片技术	活跃											125819	Brady	1.2000 V	1.14 V	1.26 V	有	This product may require additional documentation to export from the United States.	-	1.314 Mbit	166 MHz	56340 LE	267 I/O	64 kB	+ 85 C	0 C	60	SMD/SMT	4695 LAB	Microchip Technology / Atmel	Details	-	64 kB	0 to 85 °C	Tray	SmartFusion2										Warning Signs													SOC - Systems on a Chip																									1.2 V					166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA							SoC FPGA			STD	Vinyl Chloride May Cause Cancer Authorized Personnel Only	FPGA - 50K Logic Modules				1 Core	White		256KB		English			SoC FPGA
XCZU19EG-1FFVD1760E	AMD	数据表	751 In Stock	1: ¥50,286.944877 10: ¥48,633.408975 25: ¥48,295.341584 50: ¥47,959.624212 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	3EU30	CE, CSA, UL	Altech	DIN Rail	308	Tray	XCZU19	活跃												0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																			30 A																	500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		Motor	MCU, FPGA						Screw						Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells							-
A2F200M3F-FGG484	Microchip	数据表	155 In Stock	1: ¥688.080010 10: ¥649.132086 100: ¥612.388758 500: ¥577.725242 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	有	80 MHz	BGA	SQUARE	微芯片技术	活跃	MICROSEMI CORP	1.575 V	1.36										E57LBL30T110	10 mm	Cutler Hammer, Div of Eaton Co	1.5000 V	1.425 V	200000	1.575 V	MCU - 41, FPGA - 94	Tray	A2F200	活跃	BGA, BGA484,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA484,26X26,40	1.5 V	40	1.425 V	85 °C	0 to 85 °C		SmartFusion®			e1										Tin/Silver/Copper (Sn/Ag/Cu)								8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL	Shielded	250		1 mm	compliant								S-PBGA-B484	94	不合格		NC NPN			1.5,1.8,2.5,3.3 V	OTHER		80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART			MCU, FPGA	94	4608 CLBS, 200000 GATES	2.44 mm	现场可编程门阵列						STD		ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops		4608	4608			200000	256KB			Cable Connection				DC	30 mm		23 mm	23 mm
M2S010T-VFG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	256-LBGA	YES	256-FPBGA (17x17)	256	1.14 V	有	M2S010T-VFG256I	LFBGA	微芯片技术	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77									GE - General Electric	1.2000 V	Non-Compliant	138	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	-40 to 100 °C		SmartFusion®2			e1										Tin/Silver/Copper (Sn/Ag/Cu)							LG-MIN, WD-MIN	8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		250		0.8 mm	compliant								S-PBGA-B256	138	不合格					1.2 V			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	138		1.56 mm	现场可编程门阵列						STD		FPGA - 10K Logic Modules			12084	1 Core			256KB										14 mm	14 mm
XCZU5CG-L2FBVB900E	AMD	数据表	785 In Stock	1: ¥20,811.551586 10: ¥20,127.225908 25: ¥19,987.314703 50: ¥19,848.376067 查看所有的价格 -	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD												VH7441CS+3801D	Johnson Controls	204	Tray	XCZU5	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																																					533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Zynq®UltraScale+™ FPGA, 256K+ Logic Cells							-
M2S090TS-FGG676I	Microchip	数据表	2394 In Stock	1: ¥3,496.533547 10: ¥3,298.616557 100: ¥3,111.902408 500: ¥2,935.756991 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	Plastic	微芯片技术	-	64 kB											109252	Brady	1.2000 V	425	Tray	M2S090	活跃	-	166 MHz	86316 LE	SMD/SMT	-40 to 100 °C		SmartFusion®2																		Pipe & Valve Marking																																			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA					有					STD	热水回水	FPGA - 90K Logic Modules				1 Core	Green		512KB	White	English
M2S090-FGG676	Microchip	数据表	2869 In Stock	1: ¥2,341.191351 10: ¥2,208.671086 100: ¥2,083.651967 500: ¥1,965.709403 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	MICROSEMI CORP	1.26 V	5.78	-	微芯片技术	166 MHz	86316 LE	-	64 kB										VH7441GT+3008E	Johnson Controls	1.2000 V	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	BGA	SQUARE	活跃	0 to 85 °C		SmartFusion®2			e1										Tin/Silver/Copper (Sn/Ag/Cu)								8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		250		1 mm	compliant								S-PBGA-B676	425	不合格					1.2 V	OTHER		166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	425		2.44 mm	现场可编程门阵列						STD		FPGA - 90K Logic Modules			86316	1 Core			512KB										27 mm	27 mm
XCZU17EG-2FFVB1517E	AMD	数据表	859 In Stock	1: ¥42,800.462730 10: ¥41,393.097413 25: ¥41,105.359898 50: ¥40,819.622542 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD				644	Tray	XCZU17	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																																					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Zynq®UltraScale+™ FPGA, 926K+ Logic Cells							-
A2F500M3G-PQ208	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	208-PQFP (28x28)	微芯片技术				MCU - 22, FPGA - 66	Tray	A2F500M3G	Obsolete									0°C ~ 85°C (TJ)		SmartFusion®																																																					80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART			MCU, FPGA												ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops							512KB