类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 标准 | 增益公差-最大 | 线性编码 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 突破比率 | 长度 | 宽度 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TISP61060P | Power Innovations International, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | Transferred | POWER INNOVATIONS LTD | DIP, | 85 °C | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | 不合格 | INDUSTRIAL | 5.08 mm | 浪涌保护电路 | 7.62 mm | |||||||||||||||||||||||||||||||||||||
![]() | S2045B-10 | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 52 | QFP | QFP, QFP52,.52SQ | 70 °C | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | 3.3 V | Obsolete | APPLIED MICRO CIRCUITS CORP | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 52 | S-PQFP-G52 | 不合格 | COMMERCIAL | 267 mA | 2.45 mm | 电信电路 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||
![]() | MT8931BE | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | Obsolete | MICROSEMI CORP | DIP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 28 | R-PDIP-T28 | 不合格 | INDUSTRIAL | 192 Mbps | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.4 V | |||||||||||||||||||||||||||||||
![]() | RF7411 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | 85 °C | -20 °C | UNSPECIFIED | HBCC | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | 3.2 V | Transferred | RF MICRO DEVICES INC | HBCC, | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.6 mm | unknown | S-XBCC-B10 | OTHER | 1.015 mm | 射频和基带电路 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||
![]() | HC1-5504B-5 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | Obsolete | INTERSIL CORP | DIP | CERDIP-24 | 75 °C | CERAMIC, GLASS-SEALED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 12 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | 不合格 | 商业扩展 | 41 mA | SLIC | -48 V | CONSTANT CURRENT | 15 dB | 2-4 CONVERSION | -48 V | 5 dBrnC | ||||||||||||||||||||||||||
![]() | UM91317A | United Microelectronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | -20 °C | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | 2.5 V | Obsolete | UNITED MICROELECTRONICS CORP | , | 70 °C | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 2 mA | 电话拨号电路 | 1:1.5 | |||||||||||||||||||||||||||||||||||||
![]() | S1T8503X01-D0B0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | DIP, | 70 °C | -40 °C | UNSPECIFIED | DIP | RECTANGULAR | IN-LINE | Obsolete | SAMSUNG SEMICONDUCTOR INC | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-XDIP-T18 | 不合格 | OTHER | 5.08 mm | 电话语音电路 | 22.95 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||
![]() | TH72012 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOIC | SOP, | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3 V | Obsolete | MELEXIS N V | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | AUTOMOTIVE | 1.72 mm | 电信电路 | 4.89 mm | 3.9 mm | |||||||||||||||||||||||||||||||||
![]() | MSM6963RS | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | LAPIS SEMICONDUCTOR CO LTD | DIP, DIP16,.3 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 11 mA | PCM 编解码器 | YES | A-LAW | -5 V | 不提供 | ||||||||||||||||||||||||||||||
![]() | MSM6963RS | OKI Electric Industry Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP, | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | OKI ELECTRIC INDUSTRY CO LTD | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 4.55 mm | PCM 编解码器 | YES | A-LAW | -5 V | 19.1 mm | 7.62 mm | |||||||||||||||||||||||||||||
![]() | RFFM8500SQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Transferred | RF MICRO DEVICES INC | QCCN, LCC16,.12SQ,20 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | 3.3 V | 有 | 8542.39.00.01 | QUAD | 无铅 | 0.5 mm | unknown | S-PQCC-N16 | 不合格 | INDUSTRIAL | 260 mA | |||||||||||||||||||||||||||||||||||||
![]() | MX165CLH | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | CML MICROCIRCUITS LTD | LCC | QCCJ, LDCC24,.44SQ | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC24,.44SQ | SQUARE | CHIP CARRIER | 3.3 V | Obsolete | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 24 | S-PQCC-J24 | 不合格 | INDUSTRIAL | 0.0042 mA | 3.7 mm | 电信电路 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||
![]() | R8071J | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 康讯系统 | QCCJ, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 47.6 mA | ||||||||||||||||||||||||||||||||||||
![]() | QN9022 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | 2016-04-14 | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | Transferred | NXP SEMICONDUCTORS | HVQCCN, | 85 °C | QUAD | 无铅 | 1 | 0.4 mm | unknown | S-PQCC-N40 | INDUSTRIAL | 0.9 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||
![]() | SX1308IMLTRT-CUT | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ML4667CQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | Obsolete | MICRO LINEAR CORP | QLCC | QCCJ, LDCC28,.5SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 28 | S-PQCC-J28 | 不合格 | COMMERCIAL | 120 mA | 4.57 mm | 以太网收发器 | 1 | 11.505 mm | 11.505 mm | ||||||||||||||||||||||||||||
![]() | HM9114C | Hualon Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | 接触制造商 | HUALON MICROELECTRONICS CORP | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TEA1067T/C2 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOIC | SOP, | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 2.8 V | Obsolete | NXP SEMICONDUCTORS | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | 不合格 | 商业扩展 | 2.65 mm | 电话语音电路 | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||||||||
![]() | PEB2086HV1.4D | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HI-1568CDI | Holt Integrated Circuits Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 活跃 | HOLT INTEGRATED CIRCUITS INC | DIP | DIP, | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | 5 V | 有 | e4 | 无 | GOLD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2 | 2.54 mm | compliant | 20 | R-CDIP-T20 | 不合格 | INDUSTRIAL | 5.08 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 25.4 mm | 7.62 mm | |||||||||||||||||||||||||||||
![]() | W6810SG | Nuvoton Technology Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 活跃 | NUVOTON TECHNOLOGY CORP | SOP, SOP20,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 5 V | 有 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G20 | 不合格 | INDUSTRIAL | 8 mA | PCM 编解码器 | YES | A/MU-LAW | 1.6 dB | ||||||||||||||||||||||||||||||||
![]() | TDK5110 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 有 | Obsolete | INFINEON TECHNOLOGIES AG | TSSOP | TSSOP, TSSOP16,.25 | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | e3 | 有 | TIN | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 16 | R-PDSO-G16 | 不合格 | AUTOMOTIVE | 0.019 mA | 1.2 mm | 电信电路 | 5 mm | 4.4 mm | |||||||||||||||||||||||||
![]() | 7289-9710-30 | Yazaki Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX3873EGP | Maxim Integrated Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 3.3 V | CHIP CARRIER, VERY THIN PROFILE | SQUARE | LCC20,.16SQ,20 | VQCCN | CERAMIC, METAL-SEALED COFIRED | -40 °C | 85 °C | 1 | 4 X 4 MM, 0.90 MM HEIGHT, EXPOSED PAD, QFN-20 | QFN | MAXIM INTEGRATED PRODUCTS INC | Obsolete | 无 | e0 | 无 | EAR99 | 锡铅 | SDH; SONET | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | not_compliant | 20 | S-CQCC-N20 | 不合格 | INDUSTRIAL | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 4 mm | 4 mm | |||||||||||||||||||||||||
![]() | RF5506SR | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | SQUARE | HVQCCN | UNSPECIFIED | -10 °C | 70 °C | HVQCCN, | RF MICRO DEVICES INC | Transferred | 3.3 V | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5A991.G | 8517.70.00.00 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N16 | COMMERCIAL | 0.58 mm | 电信电路 | 3 mm | 3 mm |
TISP61060P
Power Innovations International, Inc.
分类:Interface - Telecom
S2045B-10
Applied Micro Circuits Corporation
分类:Interface - Telecom
MT8931BE
Microsemi Corporation
分类:Interface - Telecom
RF7411
RF Micro Devices Inc
分类:Interface - Telecom
HC1-5504B-5
Intersil Corporation
分类:Interface - Telecom
UM91317A
United Microelectronics Corporation
分类:Interface - Telecom
S1T8503X01-D0B0
Samsung Semiconductor
分类:Interface - Telecom
TH72012
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
MSM6963RS
LAPIS Semiconductor Co Ltd
分类:Interface - Telecom
MSM6963RS
OKI Electric Industry Co Ltd
分类:Interface - Telecom
RFFM8500SQ
RF Micro Devices Inc
分类:Interface - Telecom
MX165CLH
CML Microcircuits Plc
分类:Interface - Telecom
R8071J
Conexant Systems Inc
分类:Interface - Telecom
QN9022
NXP Semiconductors
分类:Interface - Telecom
SX1308IMLTRT-CUT
Semtech Corporation
分类:Interface - Telecom
ML4667CQ
RF Micro Devices Inc
分类:Interface - Telecom
HM9114C
Hualon Microelectronics Corp
分类:Interface - Telecom
TEA1067T/C2
NXP Semiconductors
分类:Interface - Telecom
PEB2086HV1.4D
Infineon Technologies AG
分类:Interface - Telecom
HI-1568CDI
Holt Integrated Circuits Inc
分类:Interface - Telecom
W6810SG
Nuvoton Technology Corp
分类:Interface - Telecom
TDK5110
Infineon Technologies AG
分类:Interface - Telecom
7289-9710-30
Yazaki Corp
分类:Interface - Telecom
MAX3873EGP
Maxim Integrated Products
分类:Interface - Telecom
RF5506SR
RF Micro Devices Inc
分类:Interface - Telecom
