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BDN10-5CB/A01备选型号: BDN10-3CB/A01

BDN10-5CB/A01

CTS Thermal Management Products

Heat Sink Passive Pin Array Adhesive Tape 20.8C/W Black Anodized

14 Weeks
ALUMINUM
2010
活跃
1 (Unlimited)
BLACK
EXTRUDED
ANODIZED
散热片/散热器
PIN FIN ARRAY
OMNIDIRECT
IC
20.8Ohm
14.1mm
25.65mm
25.65mm
符合RoHS标准
-
-
-
-
-
-
-
-
-
-
BDN10-3CB/A01

CTS Thermal Management Products

Heat Sink Passive Pin Array Adhesive 26.4°C/W Black Anodized

14 Weeks
-
2004
活跃
1 (Unlimited)
-
EXTRUDED
-
-
PIN FIN ARRAY
OMNIDIRECT
IC
-
-
1.010 25.65mm
1.010 25.65mm
符合RoHS标准
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
顶部安装
Thermal Tape, Adhesive (Included)
0.355 9.02mm
8.00°C/W @ 400 LFM
26.40°C/W
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	374124B00035G	Aavid, Thermal Division of Boyd Corporation	热敏 - 散热器	BGA	AAVID THERMALLOY 374124B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 C/W, 18 mm, 23 mm, 23 mm	对比
	BDN10-3CB/A01	CTS Thermal Management Products	热敏 - 散热器		Heat Sink Passive Pin Array Adhesive 26.4°C/W Black Anodized	对比