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HEATSINK CPU W/ADHESIVE 1.51"SQ
14 Weeks
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
2011
活跃
1 (Unlimited)
顶部安装
EXTRUDED
Thermal Tape, Adhesive (Included)
0.355 9.02mm
4.50°C/W @ 400 LFM
15.10°C/W
PIN FIN ARRAY
OMNIDIRECT
IC
1.510 38.35mm
1.510 38.35mm
符合RoHS标准
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HEATSINK CPU W/ADHESIVE 1.61"SQ
14 Weeks
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
2007
活跃
1 (Unlimited)
顶部安装
EXTRUDED
Thermal Tape, Adhesive (Included)
0.355 9.02mm
4.50°C/W @ 400 LFM
13.50°C/W
PIN FIN ARRAY
OMNIDIRECT
IC
1.610 40.89mm
1.610 40.89mm
符合RoHS标准
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HEATSINK CPU W/ADHESIVE 1.51"SQ14 WeeksAluminumSquare, Pin FinsAssorted (BGA, LGA, CPU, ASIC...)黑色阳极氧化BDN2011活跃1 (Unlimited)顶部安装EXTRUDEDThermal Tape, Adhesive (Included)0.355 9.02mm4.50°C/W @ 400 LFM15.10°C/WPIN FIN ARRAYOMNIDIRECTIC1.510 38.35mm1.510 38.35mm符合RoHS标准
HEATSINK CPU W/ADHESIVE 1.61"SQ14 WeeksAluminumSquare, Pin FinsAssorted (BGA, LGA, CPU, ASIC...)黑色阳极氧化BDN2007活跃1 (Unlimited)顶部安装EXTRUDEDThermal Tape, Adhesive (Included)0.355 9.02mm4.50°C/W @ 400 LFM13.50°C/WPIN FIN ARRAYOMNIDIRECTIC1.610 40.89mm1.610 40.89mm符合RoHS标准
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