NXP MCF5275LCVM166 IC, MPU, 32BIT, COLDFIRE V2, 196BGA
12 Weeks
表面贴装
196-LBGA
YES
61
-40°C~85°C TA
Tray
MCF527x
1997
不用于新设计
3 (168 Hours)
196
5A002.A.1
Tin/Silver/Copper - with Nickel barrier
ALSO REQUIRES 3.3V SUPPLY
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5275
S-PBGA-B196
不合格
1.6V
1.4V
External
166MHz
64K x 8
1.4V~1.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
83MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
32
24
YES
YES
32
固定点
YES
15mm
1.6mm
15mm
ROHS3 Compliant
-
Coldfire V2 MCF527x Microcontroller IC 32-Bit 166MHzROMless 196-MAPBGA (15x15)
10 Weeks
表面贴装
196-LBGA
YES
69
-40°C~85°C TA
Tray
MCF527x
1997
不用于新设计
3 (168 Hours)
196
5A992
Tin/Silver/Copper (Sn/Ag/Cu)
ALSO REQUIRES 3.3V SUPPLY
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5274
S-PBGA-B196
不合格
1.6V
1.4V
External
166MHz
64K x 8
1.4V~1.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
83MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
32
24
YES
YES
32
固定点
YES
15mm
1.6mm
15mm
ROHS3 Compliant
e1
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NXP MCF5275LCVM166 IC, MPU, 32BIT, COLDFIRE V2, 196BGA12 Weeks表面贴装196-LBGAYES61-40°C~85°C TATrayMCF527x1997不用于新设计3 (168 Hours)1965A002.A.1Tin/Silver/Copper - with Nickel barrierALSO REQUIRES 3.3V SUPPLY8542.31.00.01BOTTOMBALL2601.5V1mm40MCF5275S-PBGA-B196不合格1.6V1.4VExternal166MHz64K x 81.4V~1.6VMICROPROCESSOR, RISCColdfire V2DMA, WDT83MHzROMless32-BitEBI/EMI, Ethernet, I2C, SPI, UART/USART, USB3224YESYES32固定点YES15mm1.6mm15mmROHS3 Compliant-
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