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XCKU040-2FBVA900E备选型号: XC7Z035-1FFG900I

XCKU040-2FBVA900E

Xilinx Inc.

FPGA Kintex UltraScale 424200 Cells 20nm Technology 0.95V 900-Pin FCBGA

10 Weeks
表面贴装
900-BBGA, FCBGA
YES
900
468
0°C~100°C TJ
Bulk
Kintex® UltraScale™
2012
e1
活跃
4 (72 Hours)
900
3A991.D
Tin/Silver/Copper (Sn/Ag/Cu)
TRAY
0.922V~0.979V
BOTTOM
BALL
未说明
0.95V
1mm
未说明
468
不合格
950mV
0.95V
2.6MB
现场可编程门阵列
530250
21606000
30300
2
484800
31mm
31mm
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
XC7Z035-1FFG900I

Xilinx Inc.

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FCBGA Tray

10 Weeks
-
900-BBGA, FCBGA
YES
900
130
-40°C~100°C TJ
Tray
Zynq®-7000
2010
e1
活跃
4 (72 Hours)
900
-
Tin/Silver/Copper (Sn/Ag/Cu)
-
-
BOTTOM
BALL
245
1V
-
30
-
-
1V
-
256KB
-
-
-
-
1
343800
-
-
ROHS3 Compliant
667MHz
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
130 ps
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
ARM
YES
256000
Kintex™-7 FPGA, 275K Logic Cells
CAN; ETHERNET; I2C; SPI; UART; USB
3.35mm
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集成电路（IC）相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	XCKU040-1FBVA900C	Xilinx Inc.	嵌入式 - FPGA（现场可编程门阵列）	900-BBGA, FCBGA	FPGA Kintex UltraScale 424200 Cells 20nm Technology 0.95V 900-Pin FCBGA	对比
	XC7Z035-1FFG900I	Xilinx Inc.	嵌入式 - 片上系统（SoC）	900-BBGA, FCBGA	FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FCBGA Tray	对比