品牌是'ALTERA' (8847)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 外壳材料 | 供应商器件包装 | 质量 | 终端数量 | 表面贴装的焊盘尺寸 | 厂商 | Temperature-Test | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 功率(瓦特) | 附加功能 | HTS代码 | 电容量 | 紧固类型 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 基本部件号 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | ESR(等效串联电阻) | 电路 | 失败率 | 引线间距 | 电源 | 温度等级 | 配置 | 电感,电感 | 极化 | 阻抗 | 内存大小 | 反向泄漏电流@ Vr | 纹波电流@低频 | 不同 If 时电压 - 正向 (Vf) | 电压 - 正向 (Vf) (类型) | 视角 | 功率 - 最大 | 测试电流 | 数据率 | 流明/瓦特@电流 - 测试 | 显色指数 | 输入数量 | 组织结构 | 高/低输出电流 | 座位高度-最大 | 可编程逻辑类型 | 电压 - 齐纳(标准值)(Vz) | 最大电流 | 逻辑元件/单元数 | 镜头类型 | 产品类别 | 通量@电流/温度测试 | 总 RAM 位数 | LABs数量/ CLBs数量 | 发光面(LES) | 波长 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 供电电压源 | 独立电路 | 变压器类型 | 逻辑块数量 | 逻辑单元数 | 转速比--初级:中级 | 通用输入输出数量 | ET(电压时间) | 特征 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 无铅 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | 10AX066H4F34I3SGES | ALTERA | 数据表 | 6 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 0.93 V | 5.62 | 3000K 2-Step MacAdam Ellipse | 492 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX066H4F34I3SGES | BGA | SQUARE | Intel Corporation | 85°C | Obsolete | INTEL CORP | -40°C ~ 100°C (TJ) | Vero® SE 13 Array | 36.20mm Diameter | e1 | 活跃 | Chip On Board (COB) | Tin/Silver/Copper (Sn/Ag/Cu) | White, Warm | 8542.39.00.01 | 0.87 V ~ 0.93 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | Round | 30.9V | 120° | 500mA | 145 lm/W | 80 | 3.65 mm | 现场可编程门阵列 | 1A | 660000 | Flat | 2247 lm (Typ) | 49610752 | 250540 | 13.40mm Diameter | -- | -- | 3.60mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX115N4F40I3SGE2 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | Intel / Altera | Arria 10 FPGA | Details | BGA, | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 100 °C | 10AX115N4F40I3SGE2 | BGA | SQUARE | Obsolete | INTEL CORP | 5.59 | 3000K 2-Step MacAdam Ellipse | 600 | 有 | This product may require additional documentation to export from the United States. | 1150000 LE | 930 mV | 1 | 870 mV | SMD/SMT | 53400 LAB | 85°C | 967094 | Intel | -40°C ~ 100°C (TJ) | Tray | Vero® SE 13 Array | 36.20mm Diameter | 活跃 | Chip On Board (COB) | White, Warm | 8542.39.00.01 | 可编程逻辑集成电路 | 0.87 V ~ 0.93 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | Round | 33.9V | 120° | 450mA | 121 lm/W | 90 | 42720 CLBS | 3.5 mm | 现场可编程门阵列 | 900mA | 1150000 | Flat | FPGA - Field Programmable Gate Array | 1846 lm (Typ) | 68857856 | 427200 | 13.40mm Diameter | -- | 42720 | -- | FPGA - Field Programmable Gate Array | 3.60mm | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M08SCU169I7G | ALTERA | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 底座安装 | Radial, Can - Screw Terminals | YES | 169-UBGA (11x11) | 169 | -- | 有 | 10M08SCU169I7G | 416 MHz | LFBGA | SQUARE | Intel Corporation | 活跃 | FPGA - Field Programmable Gate Array non-volatile FPGA, 130 I/O, 169UBGA | INTEL CORP | 3.15 V | 0.93 | -- | 350V | 6000 Hrs @ 105°C | 130 | LFBGA, BGA169,13X13,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA169,13X13,32 | -40 °C | 3 V | 未说明 | 2.85 V | 100 °C | -- | Bulk | B43740 | 3.028 Dia (76.90mm) | ±20% | 活跃 | -- | 通用型 | OPERATES AT 3.3V NOMINAL VCC | 8542.39.00.01 | 4700µF | 现场可编程门阵列 | 2.85 V ~ 3.465 V | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B169 | 130 | 不合格 | 25 mOhm @ 100Hz | 1.248 (31.70mm) | 3/3.3 V | INDUSTRIAL | Polar | 30 mOhms | 11.5A @ 100Hz | 130 | 500 CLBS | 1.55 mm | 现场可编程门阵列 | 8000 | 387072 | 500 | 500 | 8000 | 4.201 (106.70mm) | 11 mm | 11 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX057K2F35I1HG | ALTERA | 数据表 | 781 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Axial | Axial | 492 | 有 | This product may require additional documentation to export from the United States. | 57000 LE | + 100 C | 930 mV | - 40 C | 24 | 870 mV | SMD/SMT | 27135 LAB | 966285 | Intel | Intel / Altera | Arria 10 FPGA | Details | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.180 Dia x 0.562 L (4.57mm x 14.27mm) | ±1% | 活跃 | 2 | ±100ppm/°C | 16.2 kOhms | Metal Film | 1.5W | 可编程逻辑集成电路 | 0.87 V ~ 0.98 V | 950 mV | -- | 570000 | FPGA - Field Programmable Gate Array | 42082304 | 217080 | Flame Retardant Coating, Moisture Resistant, Safety | FPGA - Field Programmable Gate Array | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M40DCF256I6G | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Axial | YES | Axial | 256 | 1.25 V | 5.26 | 178 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | 10M40DCF256I6G | 450 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.5% | e1 | 活跃 | 2 | ±50ppm/°C | 2.43 kOhms | Tin/Silver/Copper (Sn/Ag/Cu) | Metal Film | 0.5W, 1/2W | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B256 | 178 | -- | INDUSTRIAL | 178 | 2500 CLBS | 1.55 mm | 现场可编程门阵列 | 40000 | 1290240 | 2500 | 2500 | 40000 | Flame Retardant Coating, Moisture Resistant, Safety | -- | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX115R1F40E1SG | ALTERA | 数据表 | 531 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 342 | Compliant | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX115R1F40E1SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.38 | 0°C ~ 100°C (TJ) | * | 活跃 | 100 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.98 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 342 | 不合格 | 0.9 V | OTHER | 8.2 MB | 342 | 3.5 mm | 现场可编程门阵列 | 1150000 | 68857856 | 427200 | 427200 | 1150000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5SGXMABN3F45I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | 1932 | 100-TQFP (14x14) | 840 | Compliant | -40°C ~ 85°C | Tray | 72V | Obsolete | Multiplexer | 100 °C | -40 °C | 3 V ~ 3.6 V | 72V90823 | 880 mV | 1 x 16:16 | 7.8 MB | 14.1 Gbps | -- | 952000 | 65561600 | 359200 | 359200 | 3 | 48 | 单电源 | 1 | 840 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M40DCF484I6G | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 0603 (1608 Metric) | YES | 0603 | 484 | KOA Speer Electronics, Inc. | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.26 | Tape & Reel (TR) | RS73F1JRT | 活跃 | 360 | BGA, BGA484,22X22,40 | 网格排列 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | 10M40DCF484I6G | 450 MHz | -55°C ~ 155°C | RS73-RT | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.1% | e1 | 活跃 | 2 | ±25ppm/°C | 18.2 kOhms | Tin/Silver/Copper (Sn/Ag/Cu) | 厚膜 | 0.2W, 1/5W | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B484 | 360 | - | INDUSTRIAL | 360 | 2500 CLBS | 2 mm | 现场可编程门阵列 | 40000 | 1290240 | 2500 | 2500 | 40000 | Automotive AEC-Q200 | 0.022 (0.55mm) | 23 mm | 23 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M50DCF256I6G | ALTERA | 数据表 | 2529 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | PEI-Genesis | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.26 | Bulk | 活跃 | 178 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | 10M50DCF256I6G | 450 MHz | LBGA | SQUARE | -40°C ~ 100°C (TJ) | * | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B256 | 178 | INDUSTRIAL | 178 | 3125, CLBS | 1.55 mm | 现场可编程门阵列 | 50000 | 1677312 | 3125 | 3125 | 50000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M50DAF672I6G | ALTERA | 数据表 | 2479 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BGA | YES | 672-FBGA (27x27) | - | 672 | Pulse Electronics | 活跃 | INTEL CORP | 1.25 V | 5.26 | Tape & Reel (TR) | 活跃 | 500 | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | 10M50DAF672I6G | 450 MHz | BGA | SQUARE | Intel Corporation | 0°C ~ 70°C | - | 0.495 L x 0.280 W (12.57mm x 7.11mm) | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 500 | INDUSTRIAL | 15µH | 500 | 3125, CLBS | 2 mm | 现场可编程门阵列 | 50000 | 1677312 | 3125 | - | 3125 | 50000 | 1:1 | - | 0.200 (5.08mm) | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX032H2F35E1SG | ALTERA | 数据表 | 500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Glenair | 活跃 | 384 | 零售包装 | 0°C ~ 100°C (TJ) | * | Discontinued at Digi-Key | 0.87 V ~ 0.98 V | 320000 | 21040128 | 119900 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M40DAF484I6G | ALTERA | 数据表 | 2449 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 0402 (1005 Metric) | YES | 402 | 484 | Kamaya Inc. | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.26 | Tape & Reel (TR) | 活跃 | 360 | BGA, BGA484,22X22,40 | 网格排列 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | 10M40DAF484I6G | 450 MHz | BGA | SQUARE | -55°C ~ 155°C | RMC | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | e1 | 活跃 | 2 | ±100ppm/°C | 523 kOhms | Tin/Silver/Copper (Sn/Ag/Cu) | 厚膜 | 0.1W, 1/10W | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B484 | 360 | - | INDUSTRIAL | 360 | 2500 CLBS | 2 mm | 现场可编程门阵列 | 40000 | 1290240 | 2500 | 2500 | 40000 | - | 0.016 (0.40mm) | 23 mm | 23 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M16DCU324I6G | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 324-LFBGA | YES | Flange | Aluminum | 324-UBGA (15x15) | 324 | Glenair | 10M16DCU324I6G | 450 MHz | LFBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.25 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 246 | LFBGA, BGA324,18X18,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA324,18X18,32 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | -65°C ~ 175°C | 806 | 活跃 | Solder | Receptacle, Female Sockets | 橄榄色 | ALSO REQUIRES 2.5V OR 3.3V OR 5V SUPPLY | Threaded | 1.15 V ~ 1.25 V | BOTTOM | A | BALL | 未说明 | 0.8 mm | compliant | 橄榄色镉 | 14-20A | S-PBGA-B324 | 246 | INDUSTRIAL | 246 | 1000 CLBS | 1.55 mm | 现场可编程门阵列 | 16000 | 562176 | 1000 | 1000 | 16000 | 15 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M25DAF256I6G | ALTERA | 数据表 | 38 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | ITT Cannon, LLC | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.26 | Bulk | CA310 | 活跃 | 178 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 未说明 | 1.15 V | 100 °C | 有 | 10M25DAF256I6G | 450 MHz | -40°C ~ 100°C (TJ) | MIL-DTL-5015, CA-B | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | OPERATES AT 2.5V NOMINAL VCC | 8542.39.00.01 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B256 | 178 | INDUSTRIAL | 178 | 1563 CLBS | 1.55 mm | 现场可编程门阵列 | 25000 | 691200 | 1563 | 1563 | 25000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX032H2F35I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 0603 (1608 Metric) | YES | 0603 | 1152 | KOA Speer Electronics, Inc. | 5.53 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73R1J | 活跃 | 384 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AX032H2F35I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | -55°C ~ 155°C | RN73R | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.1% | Discontinued at Digi-Key | 2 | ±5ppm/°C | 232 Ohms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | 0.87 V ~ 0.98 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | - | INDUSTRIAL | 3.5 mm | 现场可编程门阵列 | 320000 | 21040128 | 119900 | Automotive AEC-Q200, Moisture Resistant | 0.022 (0.55mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX032H1F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Aluminum | 1152-FBGA (35x35) | 1152 | Glenair | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.53 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 384 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX032H1F35E1SG | BGA | SQUARE | -65°C ~ 175°C | 806 | Discontinued at Digi-Key | Solder | Receptacle, Female Sockets | 橄榄色 | 8542.39.00.01 | Threaded | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.98 V | BOTTOM | B | BALL | 未说明 | 1 mm | compliant | 橄榄色镉 | 22-22 | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 384 | 3.5 mm | 现场可编程门阵列 | 320000 | 21040128 | 119900 | 320000 | Ground | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX027H2F35I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | 不锈钢 | 1152-FBGA (35x35) | 1152 | Glenair | INTEL CORP | 0.93 V | 5.56 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 384 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AX027H2F35I1SG | BGA | SQUARE | Intel Corporation | Obsolete | -65°C ~ 175°C | 806 | Discontinued at Digi-Key | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | 0.87 V ~ 0.98 V | BOTTOM | F | BALL | 1 mm | compliant | Passivated | 33-20A | S-PBGA-B1152 | INDUSTRIAL | 3.5 mm | 现场可编程门阵列 | 270000 | 17870848 | 101620 | Ground | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX027E2F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | Glenair | 5.56 | 零售包装 | 活跃 | 240 | Lead free / RoHS Compliant | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AX027E2F27I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | -40°C ~ 100°C (TJ) | * | Discontinued at Digi-Key | 3 (168 Hours) | 8542.39.00.01 | 0.87 V ~ 0.98 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 3.25 mm | 现场可编程门阵列 | 270000 | 17870848 | 101620 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX022E3F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-213AB, MELF (Glass) | DO-213AB (MELF, LL41) | 微芯片技术 | Bulk | CDLL4492 | 500 Ohms | 活跃 | 240 | -65°C ~ 175°C (TA) | - | ±5% | Discontinued at Digi-Key | 0.87 V ~ 0.93 V | 250 nA @ 104 V | 1 V @ 200 mA | 1.5 W | 130 V | 220000 | 13752320 | 80330 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX016E3F29E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | PEI-Genesis | 5.56 | Bulk | 活跃 | 288 | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX016E3F29E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 0°C ~ 100°C (TJ) | * | Discontinued at Digi-Key | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.98 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 288 | 不合格 | 0.9 V | OTHER | 288 | 3.35 mm | 现场可编程门阵列 | 160000 | 10086400 | 61510 | 160000 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX016E3F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BBGA | YES | 672-FBGA (27x27) | 672 | ITT Cannon, LLC | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.56 | Bulk | KJB6T | 活跃 | 240 | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX016E3F27I1SG | BGA | SQUARE | -40°C ~ 100°C (TJ) | * | Discontinued at Digi-Key | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.98 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 240 | 3.25 mm | 现场可编程门阵列 | 160000 | 10086400 | 61510 | 160000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX066K2F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | Flange | 不锈钢 | 1152-FCBGA (35x35) | Glenair | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 492 | -65°C ~ 175°C | 806 | Discontinued at Digi-Key | Solder | Plug, Male Pins | Silver | Threaded | 0.87 V ~ 0.98 V | C | Passivated | 660000 | 49610752 | 250540 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX066N2F40I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | PEI-Genesis | Bulk | 活跃 | 588 | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AX066N2F40I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.62 | -40°C ~ 100°C (TJ) | * | Discontinued at Digi-Key | 8542.39.00.01 | 0.87 V ~ 0.98 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 3.5 mm | 现场可编程门阵列 | 660000 | 49610752 | 250540 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX066N1F40E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | PEI-Genesis | 5.62 | Bulk | 活跃 | 588 | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX066N1F40E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 0°C ~ 100°C (TJ) | * | Discontinued at Digi-Key | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.98 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | OTHER | 588 | 3.5 mm | 现场可编程门阵列 | 660000 | 49610752 | 250540 | 660000 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX066K1F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 0805 (2012 Metric) | YES | 0805 | 1152 | KOA Speer Electronics, Inc. | 5.62 | Tape & Reel (TR) | 活跃 | 492 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AX066K1F35E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | -55°C ~ 155°C | SG73S-RT | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | Discontinued at Digi-Key | 2 | ±200ppm/°C | 1.02 kOhms | 厚膜 | 0.25W, 1/4W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.98 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | OTHER | 396 | 3.5 mm | 现场可编程门阵列 | 660000 | 49610752 | 250540 | 660000 | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | 0.024 (0.60mm) | 35 mm | 35 mm | - |
10AX066H4F34I3SGES
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX115N4F40I3SGE2
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M08SCU169I7G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
132.966838
10AX057K2F35I1HG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
43,941.796528
10M40DCF256I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX115R1F40E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
104,838.536524
5SGXMABN3F45I3N
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M40DCF484I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M50DCF256I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,541.033652
10M50DAF672I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,941.138904
10AX032H2F35E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M40DAF484I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,189.137217
10M16DCU324I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M25DAF256I6G
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
709.301743
10AX032H2F35I1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX032H1F35E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX027H2F35I1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX027E2F27I1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX022E3F27I1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX016E3F29E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX016E3F27I1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX066K2F35E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX066N2F40I1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX066N1F40E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX066K1F35E1SG
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
