N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

现场可编程门阵列

N/A

-

YES

1156

ADVANCED MICRO DEVICES INC

FBGA-1156

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

1.05 V

0.95 V

1 V

无

活跃

e0

锡铅

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1156

600

INDUSTRIAL

600

18840 CLBS

3.53 mm

现场可编程门阵列

0.79 ns

18840

241152

35 mm

35 mm

993 In Stock

-

YES

256

3

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.26 V

1.14 V

1.2 V

无

活跃

ADVANCED MICRO DEVICES INC

FTBGA-256

e0

锡铅

BOTTOM

BALL

225

1 mm

compliant

30

S-PBGA-B256

不合格

192 CLBS, 50000 GATES

1.55 mm

现场可编程门阵列

192

50000

17 mm

17 mm

N/A

-

活跃

ADVANCED MICRO DEVICES INC

unknown

现场可编程门阵列

N/A

-

YES

2377

PLASTIC/EPOXY

BGA

BGA2377,49X49,40

SQUARE

网格排列

0.927 V

0.873 V

0.9 V

有

活跃

ADVANCED MICRO DEVICES INC

50 X 50 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-2377

e1

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

1 mm

compliant

S-PBGA-B2377

2880 CLBS

3.83 mm

现场可编程门阵列

2880

50 mm

50 mm

N/A

-

YES

676

有

活跃

ADVANCED MICRO DEVICES INC

FPBGA-676

806 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.14 V

1.2 V

e1

锡银铜

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B676

396

396

11519 CLBS

2.44 mm

现场可编程门阵列

0.26 ns

11519

147443

27 mm

27 mm

N/A

-

YES

900

有

活跃

ADVANCED MICRO DEVICES INC

CSBGA-900

862 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.26 V

1.2 V

1.23 V

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

498

498

7911 CLBS

2.6 mm

现场可编程门阵列

0.21 ns

7911

101261

31 mm

31 mm

N/A

-

YES

676

ADVANCED MICRO DEVICES INC

LEAD FREE, FBGA-676

4

PLASTIC/EPOXY

网格排列

有

活跃

e1

锡银铜

BOTTOM

BALL

250

compliant

30

不合格

现场可编程门阵列

N/A

-

YES

900

ADVANCED MICRO DEVICES INC

LEAD FREE, FBGA-900

4

PLASTIC/EPOXY

网格排列

有

活跃

e1

锡银铜

BOTTOM

BALL

245

compliant

30

不合格

现场可编程门阵列

519 In Stock

-

YES

1156

ADVANCED MICRO DEVICES INC

FBGA-1156

1286 MHz

100 °C

PLASTIC/EPOXY

BGA

BGA1155,34X34,40

SQUARE

网格排列

1.05 V

0.95 V

1 V

无

活跃

e0

Tin/Lead (Sn/Pb)

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1156

440

不合格

440

19800 CLBS

3.5 mm

现场可编程门阵列

0.31 ns

253440

35 mm

35 mm

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

锡银铜

240

compliant

30

现场可编程门阵列

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

Tin/Silver/Copper (Sn/Ag/Cu)

240

compliant

30

现场可编程门阵列

N/A

-

YES

900

无

活跃

ADVANCED MICRO DEVICES INC

CSBGA-900

667 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.26 V

1.2 V

1.23 V

e0

锡铅

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

576

576

11519 CLBS

2.6 mm

现场可编程门阵列

0.26 ns

11519

147443

31 mm

31 mm

N/A

-

YES

484

有

活跃

ADVANCED MICRO DEVICES INC

FPBGA-484

806 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

1.14 V

1.26 V

e1

锡银铜

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B484

280

280

5831 CLBS

2.6 mm

现场可编程门阵列

0.26 ns

5831

74637

23 mm

23 mm

N/A

-

YES

676

SQUARE

网格排列

无

接触制造商

ADVANCED MICRO DEVICES INC

4

PLASTIC/EPOXY

BGA

BGA676,26X26,40

e0

锡铅

BOTTOM

BALL

225

1 mm

not_compliant

30

S-PBGA-B676

320

不合格

320

现场可编程门阵列

12312

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

3

e1

锡银铜

260

compliant

30

现场可编程门阵列

N/A

-

YES

676

SQUARE

网格排列

有

活跃

ADVANCED MICRO DEVICES INC

4

PLASTIC/EPOXY

BGA

BGA676,26X26,40

e1

锡银铜

BOTTOM

BALL

250

1 mm

not_compliant

30

S-PBGA-B676

320

不合格

320

现场可编程门阵列

23040

N/A

-

活跃

ADVANCED MICRO DEVICES INC

无

e0

锡铅

compliant

现场可编程门阵列

N/A

-

YES

1156

ADVANCED MICRO DEVICES INC

357.2 MHz

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

1.89 V

1.71 V

1.8 V

有

活跃

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1156

804

不合格

INDUSTRIAL

804

现场可编程门阵列

18252

73008

35 mm

35 mm

N/A

-

NO

411

HEAT SINK, CERAMIC, PGA-411

111 MHz

85 °C

CERAMIC, METAL-SEALED COFIRED

HIPGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

5.25 V

4.75 V

5 V

无

活跃

ADVANCED MICRO DEVICES INC

e0

锡铅

TYP. GATES = 27000-80000

PERPENDICULAR

PIN/PEG

2.54 mm

compliant

S-CPGA-P411

不合格

1600 CLBS, 27000 GATES

4.318 mm

现场可编程门阵列

1600

27000

52.324 mm

52.324 mm

N/A

-

YES

1156

ADVANCED MICRO DEVICES INC

FBGA-1156

4

85 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

0.93 V

0.87 V

0.9 V

有

活跃

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1156

OTHER

3.35 mm

现场可编程门阵列

0.61 ns

35 mm

35 mm

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

锡银铜

245

compliant

30

现场可编程门阵列

N/A

-

YES

1738

活跃

ADVANCED MICRO DEVICES INC

BGA-1738

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1738,42X42,40

SQUARE

网格排列

1.05 V

0.95 V

1 V

有

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1738

960

INDUSTRIAL

960

25920 CLBS

3.25 mm

现场可编程门阵列

0.9 ns

25920

331776

42.5 mm

42.5 mm

N/A

-

YES

432

PLASTIC/EPOXY

HLBGA

BGA432,31X31,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE

5 V

无

活跃

ADVANCED MICRO DEVICES INC

BG432

3

e0

锡铅

BOTTOM

BALL

225

1.27 mm

compliant

30

S-PBGA-B432

不合格

1.7 mm

现场可编程门阵列

40 mm

40 mm

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

锡银铜

245

compliant

30

现场可编程门阵列