AMD的应用特定微控制器_正品采购_价格信息

品牌是'AMD' (158)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量		厂商																	系列	JESD-609代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	资历状况	温度等级	uPs/uCs/外围ICs类型	电源电流-最大值	座位高度-最大	主时钟/晶体频率-名	输出时钟频率-最大值	总线兼容性
AM29C10API	AMD	数据表	168 In Stock	1: ¥250.405214 10: ¥236.231334 100: ¥222.859750 500: ¥210.245047 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Advanced Micro Devices	活跃			Bulk	*
XQ7Z030-1RF900Q	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	无		活跃	ADVANCED MICRO DEVICES INC	31 X 31 MM, 1 MM PITCH, BGA-900	125 °C		e0		Tin/Lead (Sn/Pb)			BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	不合格	AUTOMOTIVE	PROGRAMMABLE SoC		3.44 mm				31 mm	31 mm
XCZU17EG-1LFFVE1924I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	FCBGA-1924	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL		1 mm	compliant		S-PBGA-B1924		INDUSTRIAL	PROGRAMMABLE SoC		3.71 mm			CAN, I2C, SPI, UART	45 mm	45 mm
XCZU7CG-2LFFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517							BOTTOM	BALL		1 mm	compliant		S-PBGA-B1517		INDUSTRIAL	PROGRAMMABLE SoC		3.51 mm			CAN, I2C, SPI, UART	40 mm	40 mm
XCZU2CG-2LSBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-484							BOTTOM	BALL		0.8 mm	compliant		S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC		2.61 mm			CAN, I2C, SPI, UART	19 mm	19 mm
XCZU3EG-3SBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	100 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有		活跃	ADVANCED MICRO DEVICES INC	FLIPCHIP-484	4		e1		锡银铜			BOTTOM	BALL	250		compliant	30	S-PBGA-B484		OTHER	PROGRAMMABLE SoC
XCZU9CG-1LFFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	FCBGA-1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL		1 mm	compliant		S-PBGA-B1156		INDUSTRIAL	PROGRAMMABLE SoC		3.42 mm			CAN, I2C, SPI, UART	35 mm	35 mm
XCZU5CG-2LFBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-900		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900		OTHER	PROGRAMMABLE SoC		2.88 mm			CAN, I2C, SPI, UART	31 mm	31 mm
XCZU11EG-1LFFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	FCBGA-1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL		1 mm	compliant		S-PBGA-B1156		INDUSTRIAL	PROGRAMMABLE SoC		3.51 mm			CAN, I2C, SPI, UART	35 mm	35 mm
XCZU9CG-2SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有			e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm			I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XCZU15EG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-900		e1		锡银铜			BOTTOM	BALL		1 mm	compliant		S-PBGA-B900		OTHER	PROGRAMMABLE SoC		3.42 mm			CAN, I2C, SPI, UART	31 mm	31 mm
XCZU5EG-2LFBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-900		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900		OTHER	PROGRAMMABLE SoC		2.88 mm			CAN, I2C, SPI, UART	31 mm	31 mm
XCZU9CG-2LFFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156							BOTTOM	BALL		1 mm	compliant		S-PBGA-B1156		INDUSTRIAL	PROGRAMMABLE SoC		3.42 mm			CAN, I2C, SPI, UART	35 mm	35 mm
XCZU9CG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	有			e1		锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm			I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XCZU2EG-2LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm			CAN, I2C, SPI, UART	23 mm	23 mm
XCZU9CG-2LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-900							BOTTOM	BALL		1 mm	compliant		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		3.42 mm			CAN, I2C, SPI, UART	31 mm	31 mm
XCZU6CG-2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有		活跃		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625		OTHER	PROGRAMMABLE SoC		3.43 mm			I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU2CG-2LSFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	4	110 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-625		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant		S-PBGA-B625		OTHER	PROGRAMMABLE SoC		3.43 mm			CAN, I2C, SPI, UART	21 mm	21 mm
XCZU6CG-2LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-900							BOTTOM	BALL		1 mm	compliant		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		3.42 mm			CAN, I2C, SPI, UART	31 mm	31 mm
XCZU17EG-1LFFVD1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	FCBGA-1760	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL		1 mm	compliant		S-PBGA-B1760		INDUSTRIAL	PROGRAMMABLE SoC		3.71 mm			CAN, I2C, SPI, UART	42.5 mm	42.5 mm
XCZU3CG-2LSBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	4	110 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-484		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant		S-PBGA-B484		OTHER	PROGRAMMABLE SoC		2.61 mm			CAN, I2C, SPI, UART	19 mm	19 mm
XCZU6CG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-900		e1		锡银铜			BOTTOM	BALL		1 mm	compliant		S-PBGA-B900		OTHER	PROGRAMMABLE SoC		3.42 mm			CAN, I2C, SPI, UART	31 mm	31 mm
XCZU6CG-1SBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	ADVANCED MICRO DEVICES INC	BGA-484	4	100 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有		活跃		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B484		OTHER	PROGRAMMABLE SoC		2.61 mm			I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU2CG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有		活跃	ADVANCED MICRO DEVICES INC	FCBGA-784		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784		OTHER	PROGRAMMABLE SoC		3.32 mm			CAN, I2C, SPI, UART	23 mm	23 mm
P82284	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	18	DIP, DIP18,.3	70 °C	PLASTIC/EPOXY	DIP	DIP18,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无		Obsolete	ADVANCED MICRO DEVICES INC		e0	EAR99	Tin/Lead (Sn/Pb)		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		R-PDIP-T18	不合格	COMMERCIAL	CLOCK GENERATOR, PROCESSOR SPECIFIC	145 mA		8 MHz	8 MHz