品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

外壳材料

供应商器件包装

材料

插入材料

形状

后壳材料,电镀

电阻材料

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

湿度敏感性等级(MSL)

终端

温度系数

连接器类型

类型

定位的数量

颜色

应用

功率(瓦特)

电容量

紧固类型

额定电流

电压 - 供电

方向

屏蔽/屏蔽

入口保护

频率

频率稳定性

输出量

外壳完成

外壳尺寸-插入

终端样式

功能

基本谐振器

最大电流源

执行器类型

引线间距

电流 - 电源(禁用)(最大值)

镀层

附着方法

速度

内存大小

外壳尺寸,MIL

引线样式

核心处理器

周边设备

扩频带宽

连接方式

电缆开口

建筑学

套管螺纹

调整类型

转弯数量

锥度

速度等级

内置开关

绝对牵引范围 (APR)

执行器直径

主要属性

轮调

插座数量

电阻(欧姆)

发光二极管

闪光大小

特征

高度

座位高度(最大)

长度

宽度

厚度(最大)

电镀厚度

触点表面处理厚度 - 配套

执行器长度

材料可燃性等级

评级结果

XCZU3EG-2SFVC784E
XCZU3EG-2SFVC784E
AMD 数据表

908 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

252

Tray

XCZU3

活跃

AMD

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCVM1302-1LSENBVB1024
XCVM1302-1LSENBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

316

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU57DR-L1FSVE1156I
XCZU57DR-L1FSVE1156I
AMD 数据表

778 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

-

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC DR

500MHz, 1.2GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-

XCVM1302-2MSINSVF1369
XCVM1302-2MSINSVF1369
AMD 数据表

790 In Stock

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

316

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1302-1MLINBVB1024
XCVM1302-1MLINBVB1024
AMD 数据表

862 In Stock

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

316

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1502-1LLINFVB1369
XCVM1502-1LLINFVB1369
AMD 数据表

893 In Stock

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0508 (1220 Metric)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

25V

478

KYOCERA AVX

-55°C ~ 125°C

IDC, W

0.050 L x 0.080 W (1.27mm x 2.03mm)

±20%

X7R

Bypass, Decoupling

0.047 µF

-

400MHz, 1GHz

256KB

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

Low ESL (Multi-Terminal)

-

0.022 (0.55mm)

-

XCZU7EG-1FBVB900I
XCZU7EG-1FBVB900I
AMD 数据表

646 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

204

Tray

XCZU7

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCVP1802-2MLELSVC4072
XCVP1802-2MLELSVC4072
AMD 数据表

705 In Stock

-

最小起订量: 1

最小包装量: 1

780

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Versal® Premium

-

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

XCZU11EG-L1FFVB1517I
XCZU11EG-L1FFVB1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Tape & Reel (TR)

活跃

488

XCZU11

Knowles Syfer

-40°C ~ 100°C (TJ)

*

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XC7Z007S-1CLG400C
XC7Z007S-1CLG400C
AMD 数据表

168 In Stock

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

400-LFBGA, CSPBGA

-

Thermoplastic

400-CSPBGA (17x17)

Thermoplastic

Thermoplastic

600VAC/DC

Bulk

Plastic

活跃

Conxall/Switchcraft

Copper Alloy

Gold

100

XC7Z007

-40°C ~ 85°C

Multi-Con-X®, Insta-Click™

焊杯

Plug, Male Pins

4

Black

-

卡口锁

因线规而异

Keyed

Unshielded

IP67 - Dust Tight, Waterproof

-

-

667MHz

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

0.280 ~ 0.290 (7.11mm ~ 7.37mm)

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

Backshell, UV Resistant

-

UL94 HB

XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I
AMD 数据表

694 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

活跃

Tape & Reel (TR)

328

XCZU15

SiTime

-40°C ~ 85°C

SiT8208

0.197 L x 0.126 W (5.00mm x 3.20mm)

XO (Standard)

2.5V

66.666 MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

0.031 (0.80mm)

-

XCZU19EG-L2FFVC1760E
XCZU19EG-L2FFVC1760E
AMD 数据表

692 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Bulk

活跃

512

XCZU19

PEI-Genesis

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XC7Z007S-1CLG225I
XC7Z007S-1CLG225I
AMD 数据表

87 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

铍铜

--

54

Tray

XC7Z007

活跃

AMD

121°C

插槽安装

活跃

Fingerstock

Zinc + Clear Chromate

Slot

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

0.130 (3.30mm)

0.975 (24.77mm)

0.370 (9.40mm)

299.21µin (7.60µm)

XCZU47DR-1FSVE1156I
XCZU47DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

366

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-L1FSVF1760I
XCZU49DR-L1FSVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

活跃

Tray

622

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EV-3FBVB900E
XCZU5EV-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

204

Tray

XCZU5

活跃

AMD

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XC7Z030-1FF676I
XC7Z030-1FF676I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

Tray

XC7Z030

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU46DR-2FFVH1760I
XCZU46DR-2FFVH1760I
AMD 数据表

559 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

574

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU7EG-3FBVB900E
XCZU7EG-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

204

Tray

XCZU7

活跃

AMD

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCVC1502-2MLENSVG1369
XCVC1502-2MLENSVG1369
AMD 数据表

785 In Stock

-

最小起订量: 1

最小包装量: 1

Tray

活跃

AMD

*

XCZU3EG-L1SBVA484I
XCZU3EG-L1SBVA484I
AMD 数据表

659 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-SMD, No Lead

484-FCBGA (19x19)

82

Tray

XCZU3

活跃

AMD

-20°C ~ 70°C

Tape & Reel (TR)

SiT9120

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

3.3V

166.6MHz

±10ppm

LVDS

Enable/Disable

MEMS

55mA

35mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU11EG-1FFVC1760I
XCZU11EG-1FFVC1760I
AMD 数据表

949 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1760-FCBGA (42.5x42.5)

512

Tray

XCZU11

活跃

AMD

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.106 L x 0.094 W (2.70mm x 2.40mm)

活跃

XO (Standard)

1.8V

33.33333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

31mA

30mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU17EG-2FFVC1760I
XCZU17EG-2FFVC1760I
AMD 数据表

719 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

--

512

Tray

XCZU17

AMD

活跃

-40°C ~ 100°C (TJ)

*

活跃

--

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU19EG-1FFVB1517I
XCZU19EG-1FFVB1517I
AMD 数据表

676 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Carbon

--

644

Tray

XCZU19

AMD

活跃

-40°C ~ 100°C (TJ)

Bulk

RV4

±10%

活跃

--

--

2W

焊片

Slotted

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3/8-32

用户定义

1

Linear

None

0.249 (6.32mm)

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

314°

1

100k

-

0.875 (22.23mm)

XCZU4CG-2FBVB900E
XCZU4CG-2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Nylon

--

204

Tray

XCZU4

AMD

活跃

0°C ~ 100°C (TJ)

RL2

活跃

--

White

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

所有矩形LED

-

0.330 (8.38mm)