品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 材料 | 插入材料 | 形状 | 后壳材料,电镀 | 电阻材料 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 温度系数 | 连接器类型 | 类型 | 定位的数量 | 颜色 | 应用 | 功率(瓦特) | 电容量 | 紧固类型 | 额定电流 | 电压 - 供电 | 方向 | 屏蔽/屏蔽 | 入口保护 | 频率 | 频率稳定性 | 输出量 | 外壳完成 | 外壳尺寸-插入 | 终端样式 | 功能 | 基本谐振器 | 最大电流源 | 执行器类型 | 引线间距 | 电流 - 电源(禁用)(最大值) | 镀层 | 附着方法 | 速度 | 内存大小 | 外壳尺寸,MIL | 引线样式 | 核心处理器 | 周边设备 | 扩频带宽 | 连接方式 | 电缆开口 | 建筑学 | 套管螺纹 | 调整类型 | 转弯数量 | 锥度 | 速度等级 | 内置开关 | 绝对牵引范围 (APR) | 执行器直径 | 主要属性 | 轮调 | 插座数量 | 电阻(欧姆) | 发光二极管 | 闪光大小 | 特征 | 高度 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 电镀厚度 | 触点表面处理厚度 - 配套 | 执行器长度 | 材料可燃性等级 | 评级结果 | ||||||||||
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![]() | XCZU3EG-2SFVC784E | AMD | 数据表 | 908 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 252 | Tray | XCZU3 | 活跃 | AMD | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | 316 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU57DR-L1FSVE1156I | AMD | 数据表 | 778 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | - | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MSINSVF1369 | AMD | 数据表 | 790 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | 316 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MLINBVB1024 | AMD | 数据表 | 862 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | 316 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LLINFVB1369 | AMD | 数据表 | 893 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 0508 (1220 Metric) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 25V | 478 | KYOCERA AVX | -55°C ~ 125°C | IDC, W | 0.050 L x 0.080 W (1.27mm x 2.03mm) | ±20% | X7R | Bypass, Decoupling | 0.047 µF | - | 400MHz, 1GHz | 256KB | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | Low ESL (Multi-Terminal) | - | 0.022 (0.55mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-1FBVB900I | AMD | 数据表 | 646 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 204 | Tray | XCZU7 | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1802-2MLELSVC4072 | AMD | 数据表 | 705 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Versal® Premium | - | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L1FFVB1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Tape & Reel (TR) | 活跃 | 488 | XCZU11 | Knowles Syfer | -40°C ~ 100°C (TJ) | * | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG400C | AMD | 数据表 | 168 In Stock | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 400-LFBGA, CSPBGA | - | Thermoplastic | 400-CSPBGA (17x17) | Thermoplastic | Thermoplastic | 600VAC/DC | Bulk | Plastic | 活跃 | Conxall/Switchcraft | Copper Alloy | Gold | 100 | XC7Z007 | -40°C ~ 85°C | Multi-Con-X®, Insta-Click™ | 焊杯 | Plug, Male Pins | 4 | Black | - | 卡口锁 | 因线规而异 | Keyed | Unshielded | IP67 - Dust Tight, Waterproof | - | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.280 ~ 0.290 (7.11mm ~ 7.37mm) | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | Backshell, UV Resistant | - | UL94 HB | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-2FFVB1156I | AMD | 数据表 | 694 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1156-FCBGA (35x35) | 活跃 | Tape & Reel (TR) | 328 | XCZU15 | SiTime | -40°C ~ 85°C | SiT8208 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 2.5V | 66.666 MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | 0.031 (0.80mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-L2FFVC1760E | AMD | 数据表 | 692 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Bulk | 活跃 | 512 | XCZU19 | PEI-Genesis | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG225I | AMD | 数据表 | 87 In Stock | - | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | 铍铜 | -- | 54 | Tray | XC7Z007 | 活跃 | AMD | 121°C | 插槽安装 | 活跃 | Fingerstock | Zinc + Clear Chromate | Slot | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | 0.130 (3.30mm) | 0.975 (24.77mm) | 0.370 (9.40mm) | 299.21µin (7.60µm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 366 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-L1FSVF1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 活跃 | Tray | 622 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 204 | Tray | XCZU5 | 活跃 | AMD | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-1FF676I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | Tray | XC7Z030 | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-2FFVH1760I | AMD | 数据表 | 559 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 574 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 204 | Tray | XCZU7 | 活跃 | AMD | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MLENSVG1369 | AMD | 数据表 | 785 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Tray | 活跃 | AMD | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-L1SBVA484I | AMD | 数据表 | 659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-SMD, No Lead | 484-FCBGA (19x19) | 82 | Tray | XCZU3 | 活跃 | AMD | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 3.3V | 166.6MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 55mA | 35mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVC1760I | AMD | 数据表 | 949 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | 512 | Tray | XCZU11 | 活跃 | AMD | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | 活跃 | XO (Standard) | 1.8V | 33.33333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-2FFVC1760I | AMD | 数据表 | 719 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | -- | 512 | Tray | XCZU17 | AMD | 活跃 | -40°C ~ 100°C (TJ) | * | 活跃 | -- | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVB1517I | AMD | 数据表 | 676 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Carbon | -- | 644 | Tray | XCZU19 | AMD | 活跃 | -40°C ~ 100°C (TJ) | Bulk | RV4 | ±10% | 活跃 | -- | -- | 2W | 焊片 | Slotted | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3/8-32 | 用户定义 | 1 | Linear | None | 0.249 (6.32mm) | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | 314° | 1 | 100k | - | 0.875 (22.23mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Nylon | -- | 204 | Tray | XCZU4 | AMD | 活跃 | 0°C ~ 100°C (TJ) | RL2 | 活跃 | -- | White | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 所有矩形LED | - | 0.330 (8.38mm) |
XCZU3EG-2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
5,010.656358
XCVM1302-1LSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCZU57DR-L1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
119,021.642852
XCVM1302-2MSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
33,691.646842
XCVM1302-1MLINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
31,101.809390
XCVM1502-1LLINFVB1369
AMD
分类:Embedded - System On Chip (SoC)
73,176.405123
XCZU7EG-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
24,774.533136
XCVP1802-2MLELSVC4072
AMD
分类:Embedded - System On Chip (SoC)
447,853.328944
XCZU11EG-L1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
XC7Z007S-1CLG400C
AMD
分类:Embedded - System On Chip (SoC)
XCZU15EG-2FFVB1156I
AMD
分类:Embedded - System On Chip (SoC)
53,113.977986
XCZU19EG-L2FFVC1760E
AMD
分类:Embedded - System On Chip (SoC)
65,682.212455
XC7Z007S-1CLG225I
AMD
分类:Embedded - System On Chip (SoC)
XCZU47DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU49DR-L1FSVF1760I
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EV-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XC7Z030-1FF676I
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-2FFVH1760I
AMD
分类:Embedded - System On Chip (SoC)
251,287.129946
XCZU7EG-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCVC1502-2MLENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
132,742.097177
XCZU3EG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
4,664.074158
XCZU11EG-1FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
41,117.578876
XCZU17EG-2FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
59,541.371231
XCZU19EG-1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
47,867.769868
XCZU4CG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
