品牌是'AMD' (1092)

对比

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品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

供应商器件包装

电阻材料

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

湿度敏感性等级(MSL)

温度系数

类型

电阻

功率(瓦特)

螺距

电压 - 供电

频率

频率稳定性

基本部件号

输出量

终端样式

功能

基本谐振器

最大电流源

电流 - 电源(禁用)(最大值)

速度

内存大小

核心处理器

周边设备

连接方式

建筑学

调整类型

逻辑元件/单元数

产品类别

转弯数量

总 RAM 位数

LABs数量/ CLBs数量

速度等级

绝对牵引范围 (APR)

主要属性

闪光大小

座位高度(最大)

评级结果

XCZU5CG-L2SFVC784E
XCZU5CG-L2SFVC784E
AMD 数据表

587 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

784-FCBGA (23x23)

AMD

XCZU5

活跃

252

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

1.8V

33.3MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

31mA

30mA

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

0.039 (1.00mm)

--

XCZU7CG-L2FBVB900E
XCZU7CG-L2FBVB900E
AMD 数据表

633 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU7

活跃

204

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

3.3V

133.333333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

36mA

31mA

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU7EV-2FFVF1517I
XCZU7EV-2FFVF1517I
AMD 数据表

772 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-SMD, No Lead

1517-FCBGA (40x40)

AMD

XCZU7

活跃

464

Tray

-20°C ~ 70°C

Tape & Reel (TR)

SiT9120

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

2.25 V ~ 3.63 V

156.25MHz

±10ppm

LVDS

Standby (Power Down)

MEMS

55mA

35mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU4EG-1FBVB900E
XCZU4EG-1FBVB900E
AMD 数据表

899 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU4

活跃

204

Tray

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

2.8V

26MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU2CG-L2SFVA625E
XCZU2CG-L2SFVA625E
AMD 数据表

27 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

625-BFBGA, FCBGA

625-FCBGA (21x21)

Cermet

AMD

Tray

XCZU2

活跃

--

180

0°C ~ 100°C (TJ)

Bulk

RJ-5

Square - 0.266 L x 0.252 W x 0.177 H (6.75mm x 6.40mm x 4.50mm)

±10%

活跃

--

±100ppm/°C

1 kOhms

0.25W, 1/4W

PC引脚

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

侧面调节

14

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVC1802-2MLIVSVD1760
XCVC1802-2MLIVSVD1760
AMD 数据表

951 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

692

Tray

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVM1302-2LSEVSVD1760
XCVM1302-2LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

402

Tray

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1902-1MSIVIVA1596
XCVC1902-1MSIVIVA1596
AMD 数据表

551 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

活跃

500

Tray

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU1EG-2SBVA484I
XCZU1EG-2SBVA484I
AMD 数据表

2126 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

活跃

-

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

XCVM1802-2LSEVFVC1760
XCVM1802-2LSEVFVC1760
AMD 数据表

877 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

500

Tray

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1302-1MSINSVF1369
XCVM1302-1MSINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

活跃

316

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1402-1LLINBVB1024
XCVM1402-1LLINBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

活跃

424

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVC1902-2MSEVSVD1760
XCVC1902-2MSEVSVD1760
AMD 数据表

518 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

692

Tray

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCVC1902-1MSEVSVD1760
XCVC1902-1MSEVSVD1760
AMD 数据表

718 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

692

Tray

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XC7Z035-2FFG900E
XC7Z035-2FFG900E
AMD 数据表

947 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Tray

AMD

XC7Z035

活跃

130

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

XCZU1CG-1SFVC784E
XCZU1CG-1SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

-

AMD

Tray

活跃

BGA Socketing Systems

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

Socket Adapter Systems

1.27mm Pitch

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

Socket Adapter Systems

-

-

XCZU6EG-L2FFVB1156E
XCZU6EG-L2FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

BGA Socketing Systems

328

AMD

Tray

XCZU6

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Socket Adapter Systems

1.00mm Pitch

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Socket Adapter Systems

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU48DR-2FSVE1156I
XCZU48DR-2FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

活跃

366

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XC7Z007S-1CLG400C5283
XC7Z007S-1CLG400C5283
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1152-BBGA, FCBGA

1152-HBGA, FC (42.5x42.5)

744

-40°C ~ 100°C (TJ)

STRATIX® IV E

活跃

0.87 V ~ 0.93 V

EP4SE820

813050

34093056

32522

XCVM1502-1LSIVFVC1760
XCVM1502-1LSIVFVC1760
AMD 数据表

855 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

500

AMD

Tray

活跃

Non-Compliant

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCZU6EG-3FFVC900E
XCZU6EG-3FFVC900E
AMD 数据表

492 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Tray

AMD

XCZU6

活跃

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU2EG-L1SFVA625I
XCZU2EG-L1SFVA625I
AMD 数据表

2910 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

Tray

AMD

XCZU2

活跃

180

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCZU17EG-1FFVC1760I
XCZU17EG-1FFVC1760I
AMD 数据表

895 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

活跃

512

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCVC1902-2MLIVIVA1596
XCVC1902-2MLIVIVA1596
AMD 数据表

931 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

活跃

500

Tray

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCVC1802-1MLIVSVD1760
XCVC1802-1MLIVSVD1760
AMD 数据表

814 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

活跃

692

Tray

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-