品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 材料 | 插入材料 | 表面贴装的焊盘尺寸 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | 连接器类型 | 类型 | 定位的数量 | 应用 | 电容量 | 紧固类型 | 触点类型 | 方向 | 屏蔽/屏蔽 | 入口保护 | 外壳完成 | 外壳尺寸-插入 | 房屋颜色 | ESR(等效串联电阻) | 引线间距 | 注意 | 极化 | 阻抗 | 速度 | 内存大小 | 纹波电流@低频 | 外壳尺寸,MIL | 核心处理器 | 纹波电流@高频 | 周边设备 | 连接方式 | 建筑学 | 包括 | 筛选水平 | 速度等级 | 主要属性 | 闪光大小 | 特征 | 座位高度(最大) | 材料可燃性等级 | 评级结果 | |||||||||||
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![]() | XCVM1802-2MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Tray | 活跃 | AMD | 726 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2LSENBVB1024 | AMD | 数据表 | 948 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | Tray | 活跃 | AMD | 424 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-2FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Tray | 活跃 | AMD | 366 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2HSIVFVC1596 | AMD | 数据表 | 825 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | Tray | 活跃 | AMD | 748 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MSIVIVA1596 | AMD | 数据表 | 543 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | Tray | 活跃 | AMD | 500 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1UBVA530E | AMD | 数据表 | 2913 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | Tray | 活跃 | AMD | 82 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-2LSENSVG1369 | AMD | 数据表 | 705 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | Tray | 活跃 | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LSINSVF1369 | AMD | 数据表 | 739 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | Tray | 活跃 | AMD | 424 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-2UBVA530E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | Tray | 活跃 | AMD | 82 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | Tray | 活跃 | AMD | 532 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Tray | 活跃 | AMD | 770 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-L1UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | Tray | 活跃 | AMD | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MSINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | Tray | 活跃 | AMD | 424 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 204 | Tray | XCZU7 | 活跃 | AMD | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-1FFVC1156E | AMD | 数据表 | 880 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 0.8500 V | 0.808 V | 0.892 V | 360 | Tray | AMD | XCZU7 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-3FFVF1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 0.873 V | 0.927 V | 464 | Tray | XCZU7 | AMD | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | AMD | XCZU7 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 192,150 | 0.8500 V | 0.808 V | 0.892 V | 204 | AMD | Tray | XCZU4 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-1FBVB900I | AMD | 数据表 | 877 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | AMD | XCZU5 | 活跃 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-L1FFVC900I | AMD | 数据表 | 577 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 204 | Bulk | XCZU9 | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG225C | AMD | 数据表 | 82 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | 54 | Tray | XC7Z007 | 活跃 | AMD | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-3FFVB1156E | AMD | 数据表 | 117 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Metal | Tray | XCZU6 | 活跃 | AMD | 328 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-L1SFVA625I | AMD | 数据表 | 856 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 180 | Tray | XCZU3 | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z012S-1CLG485I | AMD | 数据表 | 2426 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Radial, Can - SMD | 485-CSPBGA (19x19) | 0.260 L x 0.260 W (6.60mm x 6.60mm) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 6.3 V | 2000 Hrs @ 105°C | 150 | United Chemi-Con | XC7Z012 | -55°C ~ 105°C | Alchip™- MZA | 0.248 Dia (6.30mm) | ±20% | 汽车 | 100 µF | - | - | Polar | 360 mOhms | 667MHz | 256KB | 96 mA @ 120 Hz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 240 mA @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Artix™-7 FPGA, 55K Logic Cells | - | 0.240 (6.10mm) | AEC-Q200 | |||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVD1760I | AMD | 数据表 | 569 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | Circular | 铝合金 | 1760-FCBGA (42.5x42.5) | Plastic | 308 | ITT Cannon, LLC | Bulk | KJB6T | 22D | 活跃 | -65°C ~ 175°C | KJB | Plug Housing | 用于公引脚 | 6 | Threaded | Crimp | C | Shielded | 抗环境干扰 | Cadmium over Electroless Nickel | 9-35 | 橄榄色 | 不包括触点 | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 联接螺母 | - |
XCVM1802-2MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-2LSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
56,747.621460
XCZU42DR-2FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-2HSIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
75,184.348695
XCVC1802-2MSIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
221,330.008807
XCZU3CG-1UBVA530E
AMD
分类:Embedded - System On Chip (SoC)
3,027.015898
XCVC1702-2LSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
180,429.937389
XCVM1402-1LSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
59,015.383551
XCZU3EG-2UBVA530E
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-1LSEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
XCVM1802-2MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCZU2CG-L1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1MSINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EV-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7CG-1FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
18,374.079438
XCZU7EG-3FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EV-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
19,772.911023
XCZU9CG-L1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
25,976.801049
XC7Z007S-1CLG225C
AMD
分类:Embedded - System On Chip (SoC)
469.522421
XCZU6EG-3FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU3EG-L1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
5,514.349430
XC7Z012S-1CLG485I
AMD
分类:Embedded - System On Chip (SoC)
957.863728
XCZU19EG-1FFVD1760I
AMD
分类:Embedded - System On Chip (SoC)
57,014.490386
