品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

材料

插入材料

表面贴装的焊盘尺寸

厂商

操作温度

系列

尺寸/尺寸

容差

连接器类型

类型

定位的数量

应用

电容量

紧固类型

触点类型

方向

屏蔽/屏蔽

入口保护

外壳完成

外壳尺寸-插入

房屋颜色

ESR(等效串联电阻)

引线间距

注意

极化

阻抗

速度

内存大小

纹波电流@低频

外壳尺寸,MIL

核心处理器

纹波电流@高频

周边设备

连接方式

建筑学

包括

筛选水平

速度等级

主要属性

闪光大小

特征

座位高度(最大)

材料可燃性等级

评级结果

XCVM1802-2MSIVSVD1760
XCVM1802-2MSIVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

Tray

活跃

AMD

726

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1402-2LSENBVB1024
XCVM1402-2LSENBVB1024
AMD 数据表

948 In Stock

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

Tray

活跃

AMD

424

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU42DR-2FSVE1156I
XCZU42DR-2FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Tray

活跃

AMD

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

-

XCVM1402-2HSIVFVC1596
XCVM1402-2HSIVFVC1596
AMD 数据表

825 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

Tray

活跃

AMD

748

-40°C ~ 100°C (TJ)

Versal™ Prime

800MHz, 1.65GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVC1802-2MSIVIVA1596
XCVC1802-2MSIVIVA1596
AMD 数据表

543 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

Tray

活跃

AMD

500

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU3CG-1UBVA530E
XCZU3CG-1UBVA530E
AMD 数据表

2913 In Stock

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

Tray

活跃

AMD

82

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCVC1702-2LSENSVG1369
XCVC1702-2LSENSVG1369
AMD 数据表

705 In Stock

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

Tray

活跃

AMD

500

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCVM1402-1LSINSVF1369
XCVM1402-1LSINSVF1369
AMD 数据表

739 In Stock

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

Tray

活跃

AMD

424

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU3EG-2UBVA530E
XCZU3EG-2UBVA530E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

Tray

活跃

AMD

82

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCVM1302-1LSEVFVC1596
XCVM1302-1LSEVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

Tray

活跃

AMD

532

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1802-2MSEVSVA2197
XCVM1802-2MSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

Tray

活跃

AMD

770

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCZU2CG-L1UBVA530I
XCZU2CG-L1UBVA530I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

Tray

活跃

AMD

82

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVM1402-1MSINBVB1024
XCVM1402-1MSINBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

Tray

活跃

AMD

424

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU7EV-3FBVB900E
XCZU7EV-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

204

Tray

XCZU7

活跃

AMD

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7CG-1FFVC1156E
XCZU7CG-1FFVC1156E
AMD 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

0.8500 V

0.808 V

0.892 V

360

Tray

AMD

XCZU7

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7EG-3FFVF1517E
XCZU7EG-3FFVF1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

0.873 V

0.927 V

464

Tray

XCZU7

AMD

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7EG-2FBVB900E
XCZU7EG-2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

0.8500 V

0.808 V

0.892 V

204

Tray

AMD

XCZU7

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU4EG-2FBVB900E
XCZU4EG-2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

192,150

0.8500 V

0.808 V

0.892 V

204

AMD

Tray

XCZU4

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU5EV-1FBVB900I
XCZU5EV-1FBVB900I
AMD 数据表

877 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

0.8500 V

0.808 V

0.892 V

204

Tray

AMD

XCZU5

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU9CG-L1FFVC900I
XCZU9CG-L1FFVC900I
AMD 数据表

577 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

204

Bulk

XCZU9

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XC7Z007S-1CLG225C
XC7Z007S-1CLG225C
AMD 数据表

82 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

54

Tray

XC7Z007

活跃

AMD

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

XCZU6EG-3FFVB1156E
XCZU6EG-3FFVB1156E
AMD 数据表

117 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Metal

Tray

XCZU6

活跃

AMD

328

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU3EG-L1SFVA625I
XCZU3EG-L1SFVA625I
AMD 数据表

856 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

180

Tray

XCZU3

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XC7Z012S-1CLG485I
XC7Z012S-1CLG485I
AMD 数据表

2426 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

Radial, Can - SMD

485-CSPBGA (19x19)

0.260 L x 0.260 W (6.60mm x 6.60mm)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

6.3 V

2000 Hrs @ 105°C

150

United Chemi-Con

XC7Z012

-55°C ~ 105°C

Alchip™- MZA

0.248 Dia (6.30mm)

±20%

汽车

100 µF

-

-

Polar

360 mOhms

667MHz

256KB

96 mA @ 120 Hz

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

240 mA @ 100 kHz

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Artix™-7 FPGA, 55K Logic Cells

-

0.240 (6.10mm)

AEC-Q200

XCZU19EG-1FFVD1760I
XCZU19EG-1FFVD1760I
AMD 数据表

569 In Stock

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1760-BBGA, FCBGA

-

Circular

铝合金

1760-FCBGA (42.5x42.5)

Plastic

308

ITT Cannon, LLC

Bulk

KJB6T

22D

活跃

-65°C ~ 175°C

KJB

Plug Housing

用于公引脚

6

Threaded

Crimp

C

Shielded

抗环境干扰

Cadmium over Electroless Nickel

9-35

橄榄色

不包括触点

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

联接螺母

-