品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 材料 | 插入材料 | 表面贴装的焊盘尺寸 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | 终端 | 连接器类型 | 类型 | 定位的数量 | 颜色 | 应用 | 电容量 | 紧固类型 | 触点类型 | 额定电流 | 方向 | 屏蔽/屏蔽 | 入口保护 | 额定电流 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 房屋颜色 | ESR(等效串联电阻) | 引线间距 | 注意 | 极化 | 阻抗 | 速度 | 内存大小 | 纹波电流@低频 | 外壳尺寸,MIL | 核心处理器 | 纹波电流@高频 | 周边设备 | 连接方式 | 保护措施 | 建筑学 | 端子类型 | 包括 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 闪光大小 | 连接类型 | 特征 | 座位高度(最大) | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 评级结果 | |||||||||||||||||||||
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![]() | XCZU7EG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU7 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 活跃 | AMD | 192,150 | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-1FBVB900I | AMD | 数据表 | 578 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU5 | 活跃 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-L1FFVC900I | AMD | 数据表 | 848 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Bulk | XCZU9 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG225C | AMD | 数据表 | 220 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | AMD | 54 | Tray | XC7Z007 | 活跃 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-3FFVB1156E | AMD | 数据表 | 335 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Metal | AMD | Tray | XCZU6 | 活跃 | 328 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-L1SFVA625I | AMD | 数据表 | 975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | XCZU3 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z012S-1CLG485I | AMD | 数据表 | 2880 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Radial, Can - SMD | 485-CSPBGA (19x19) | 0.260 L x 0.260 W (6.60mm x 6.60mm) | United Chemi-Con | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 6.3 V | 2000 Hrs @ 105°C | 150 | XC7Z012 | -55°C ~ 105°C | Alchip™- MZA | 0.248 Dia (6.30mm) | ±20% | 汽车 | 100 µF | - | - | Polar | 360 mOhms | 667MHz | 256KB | 96 mA @ 120 Hz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 240 mA @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Artix™-7 FPGA, 55K Logic Cells | - | 0.240 (6.10mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVD1760I | AMD | 数据表 | 681 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | Circular | 铝合金 | 1760-FCBGA (42.5x42.5) | Plastic | ITT Cannon, LLC | Bulk | KJB6T | 22D | 活跃 | 308 | -65°C ~ 175°C | KJB | Plug Housing | 用于公引脚 | 6 | Threaded | Crimp | C | Shielded | 抗环境干扰 | Cadmium over Electroless Nickel | 9-35 | 橄榄色 | 不包括触点 | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 联接螺母 | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-2FBVB900I | AMD | 数据表 | 637 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | PEI-Genesis | Bulk | 活跃 | 204 | XCZU5 | -40°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-L1FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Amphenol Positronic | Bulk | 活跃 | 464 | XCZU7 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-L2FSVG1517I | AMD | 数据表 | 799 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1517-BBGA, FCBGA | - | 铝合金 | 1517-FCBGA (40x40) | ITT Cannon, LLC | 50V | Bulk | Metal | CA310 | 活跃 | Silver | 561 | -55°C ~ 125°C | MIL-DTL-5015, CA-B | 焊杯 | Plug, Female Sockets | 5 | 橄榄色 | 反向卡口锁 | N (Normal) | - | IP67 - Dust Tight, Waterproof | 41A, 245A | 橄榄色镉 | 32-1 | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-3FFV676E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | Bulk | Obsolete | 130 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-1MSIVSVA2197 | AMD | 数据表 | 835 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Tray | 活跃 | 586 | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-3SFVC784E | AMD | 数据表 | 605 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 252 | Tray | XCZU4 | 活跃 | AMD | 139743 | Schneider | 0.9000 V | 0.873 V | 0.927 V | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | Threaded | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-2FBVB900I | AMD | 数据表 | 520 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | 活跃 | AMD | Turck | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L2FFVF1517E | AMD | 数据表 | 527 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 4000-70403-0100220 | UR | Murrelektronik | 无 | 653,100 | FCBGA | 0.8500 V | 0.808 V | 464 | 0.892 V | AMD | 表面贴装 | 464 | Tray | XCZU11 | 活跃 | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EG | Black | 1517 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2L | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | 597,120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-L1SFVC784I | AMD | 数据表 | 931 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 252 | Tray | XCZU3 | 活跃 | AMD | DH365NDKV | Cutler Hammer, Div of Eaton Corp | 0.8500 V | 0.808 V | 0.892 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVD1760E | AMD | 数据表 | 807 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | 活跃 | AMD | 3EU30 | CE, CSA, UL | Altech | DIN Rail | 308 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 30 A | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Motor | MCU, FPGA | Screw | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-L2FBVB900E | AMD | 数据表 | 610 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | VH7441CS+3801D | Johnson Controls | 204 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-2FFVB1517E | AMD | 数据表 | 635 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 644 | Tray | XCZU17 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L2FFVF1517E | AMD | 数据表 | 560 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 0.8500 V | 0.808 V | 0.892 V | 464 | Tray | XCZU7 | 活跃 | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-L1FBVB900I | AMD | 数据表 | 629 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU5 | 活跃 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z100-2FF900I | AMD | 数据表 | 855 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 1.0000 V | 212 | Tray | XC7Z100 | 活跃 | -40 to 100 °C | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Kintex™-7 FPGA, 444K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 402 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - |
XCZU7EG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EV-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
21,882.423357
XCZU9CG-L1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
25,646.815976
XC7Z007S-1CLG225C
AMD
分类:Embedded - System On Chip (SoC)
413.092732
XCZU6EG-3FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU3EG-L1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
4,854.208423
XC7Z012S-1CLG485I
AMD
分类:Embedded - System On Chip (SoC)
1,065.509568
XCZU19EG-1FFVD1760I
AMD
分类:Embedded - System On Chip (SoC)
63,063.990448
XCZU5EV-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
27,034.810988
XCZU7CG-L1FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU47DR-L2FSVG1517I
AMD
分类:Embedded - System On Chip (SoC)
245,664.874062
XC7Z045-3FFV676E
AMD
分类:Embedded - System On Chip (SoC)
XCVC1502-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
134,141.357498
XCZU4EG-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
13,485.774484
XCZU7CG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
26,058.246303
XCZU11EG-L2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
50,962.010487
XCZU3CG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
4,242.387082
XCZU19EG-1FFVD1760E
AMD
分类:Embedded - System On Chip (SoC)
50,617.316587
XCZU5CG-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
23,668.979024
XCZU17EG-2FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
48,442.264543
XCZU7EV-L2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
38,428.424522
XCZU5EG-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
22,628.928913
XC7Z100-2FF900I
AMD
分类:Embedded - System On Chip (SoC)
27,442.299482
XCVM1302-2MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
