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首页 所有品牌 AMD category.片上系统（SoC）

品牌是'AMD' (1092)

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定位的数量

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建筑学

电流-输出1

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电压 - 输出 3

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闪光大小

电流-输出3

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特征

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座位高度(最大)

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宽度

评级结果
XCVM1302-2LSEVSVD1760
XCVM1302-2LSEVSVD1760
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

402

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

 XCVC1902-1MSIVIVA1596
XCVC1902-1MSIVIVA1596
 AMD 数据表

551 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

 XCZU1EG-2SBVA484I
XCZU1EG-2SBVA484I
 AMD 数据表

2126 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

-

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

 XCVM1802-2LSEVFVC1760
XCVM1802-2LSEVFVC1760
 AMD 数据表

877 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

 XCVM1302-1MSINSVF1369
XCVM1302-1MSINSVF1369
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

316

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

 XCVM1402-1LLINBVB1024
XCVM1402-1LLINBVB1024
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

424

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

 XCVC1902-2MSEVSVD1760
XCVC1902-2MSEVSVD1760
 AMD 数据表

518 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

 XCVC1902-1MSEVSVD1760
XCVC1902-1MSEVSVD1760
 AMD 数据表

718 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

 XC7Z015-1CLG485C
XC7Z015-1CLG485C
 AMD 数据表

2706 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Can

485-CSPBGA (19x19)

-

EPCOS - TDK Electronics

130

XC7Z015

Bulk

Obsolete

25 V

5000 Hrs @ 105°C

-55°C ~ 105°C

B41858

0.492 Dia (12.50mm)

±20%

汽车

2200 µF

30mOhm @ 10kHz

0.197 (5.00mm)

Polar

25 mOhms

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

2.858 A @ 100 kHz

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 74K Logic Cells

-

1.654 (42.00mm)

-

 XC7Z020-2CLG484I
XC7Z020-2CLG484I
 AMD 数据表

51 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Molex

Bulk

093338

活跃

130

-40°C ~ 100°C (TJ)

*

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

 XC7Z045-1FFG900C
XC7Z045-1FFG900C
 AMD 数据表

723 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

TE Connectivity Deutsch 连接器

Bag

DIV40E15

活跃

130

0°C ~ 85°C (TJ)

*

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

 XCZU7EV-1FBVB900I
XCZU7EV-1FBVB900I
 AMD 数据表

703 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

KEMET

Obsolete

Bulk

204

XCZU7

-40°C ~ 100°C (TJ)

-

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

 XCVC1702-2LLEVSVA2197
XCVC1702-2LLEVSVA2197
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

有

608

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

 XCVM1802-2LLIVSVA2197
XCVM1802-2LLIVSVA2197
 AMD 数据表

704 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

有

648

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

 XC7Z007S-2CLG225E
XC7Z007S-2CLG225E
 AMD 数据表

20 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

磁性安装

460 MHz

TE Connectivity

TE Connectivity / Laird External Antennas

UHF

-

54

Tray

AMD

XC7Z007

活跃

-

-

Whip

1

0°C ~ 100°C (TJ)

QW

无源天线

Mobile Antennas

Antennas

带底座的直线型

-

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

GPS Antennas - GNSS, GLONASS, Galileo, Beidou

Unity

Artix™-7 FPGA, 23K Logic Cells

1 Band

-

室外天线

Antennas

6 in

 XAZU2EG-1SFVA625Q
XAZU2EG-1SFVA625Q
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

- 55 C

10000

PCB 安装

Vishay

Vishay / Dale

Details

128

Tray

AMD

XAZU2

活跃

0402

1005

+ 155 C

0.000023 oz

-40°C ~ 125°C (TJ)

Reel

RCWE

1 %

2 Terminal

200 PPM / C

厚膜表面贴装片式电阻器

80.6 mOhms

电流感应

Resistors

125 mW (1/8 W)

厚膜

SMD/SMT

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

电流检测电阻器

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

厚膜电阻器

Current Sense Resistors - SMD

0.35 mm

1.05 mm

0.55 mm

 XCZU15EG-L1FFVB1156I
XCZU15EG-L1FFVB1156I
 AMD 数据表

964 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

25

132041-0864

ITT Cannon

ITT Cannon

Details

328

Tray

XCZU15

活跃

-40°C ~ 100°C (TJ)

PL

Circular Connectors

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

圆形推拽连接器

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

圆形推拽连接器

 XCZU3CG-1SFVC784E
XCZU3CG-1SFVC784E
 AMD 数据表

2277 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

XCZU3

活跃

Non-Compliant

252

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

 XCVC1802-1LSEVSVA2197
XCVC1802-1LSEVSVA2197
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

 XCZU3EG-1SFVC784E
XCZU3EG-1SFVC784E
 AMD 数据表

597 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU3

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

 XCZU2CG-2SFVA625I
XCZU2CG-2SFVA625I
 AMD 数据表

878 In Stock

-

最小起订量: 1

最小包装量: 1

Gold

Flanges, Panel, Through Hole

625-BFBGA, FCBGA

23

625-FCBGA (21x21)

AMD

Compliant

180

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Bulk

Zynq® UltraScale+™ MPSoC CG

Solder

Receptacle

19

175 °C

-65 °C

Threaded

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

Shielded

抗环境干扰

 XCZU3EG-1SFVA625I
XCZU3EG-1SFVA625I
 AMD 数据表

933 In Stock

-

最小起订量: 1

最小包装量: 1

Panel

625-BFBGA, FCBGA

625-FCBGA (21x21)

230 g

AMD

XCZU3

活跃

5 V

Compliant

180

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

50 °C

0 °C

55 W

76.2 mm

3

70 %

12 V

500MHz, 600MHz, 1.2GHz

256KB

6 A

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

55 W

12 V

MCU, FPGA

6 A

-12 V

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

500 mA

-

500 mA

28.956 mm

127 mm

76.2 mm

 XC7Z035-2FBG676E
XC7Z035-2FBG676E
 AMD 数据表

951 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

Tray

XC7Z035

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

 XCZU2EG-2SFVA625I
XCZU2EG-2SFVA625I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

恩智浦半导体

Bulk

74AHC30

活跃

180

-40°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

 XCZU3CG-1SFVA625E
XCZU3CG-1SFVA625E
 AMD 数据表

2449 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

霍尼韦尔传感与生产力解决方案

Bulk

Obsolete

180

XCZU3

0°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-