品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8672D19BE-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Compliant | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 15 | Bulk | GS8672D19BE | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.3 A | 4 M x 18 | 20 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AGD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 表面贴装 | 2.7, 3.6 V | 18 Bit | 2 MWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | 133@Flow-Through/150@Pipelined MHz | Compliant | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 18 | 0 to 85 °C | Bulk | GS8321E18AGD | DCD Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 36 Mbit | 2 | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342S09BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 400 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | Bulk | GS8342S09BD | 85 °C | 0 °C | 1.8 V | 36 Mbit | 2 | 705 mA | Pipelined | 4 M x 9 | 21 Bit | 36 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT38BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 165-LBGA | YES | 165 | 165-FPBGA (15x13) | 165 | - 40 C | 1.7 V | SMD/SMT | GSI Technology Inc. | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662DT38BGD-500I | 2097152 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.66 | BGA | Industrial grade | FBGA | 1.8000 V | 1.7 V | 36 Bit | 1.9 V | Tray | GS8662D | 活跃 | Volatile | 500 MHz | + 85 C | 1.9 V | -40 to 100 °C | - | 3A991.B.2.B | 流水线结构 | 8542.32.00.41 | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 72Mbit | SYNCHRONOUS | 500 MHz | 1.17 A | 0.45 | SRAM | Parallel | 2 M x 36 | 1.4 mm | 36 | - | 19 Bit | 72 | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | 2M x 36 | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||
![]() | GS8162Z36DD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 250 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | Bulk | GS8162Z36DD | 85 °C | 0 °C | 18 Mbit | 4 | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T08BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8342T08BD | SigmaDDR-II B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 565 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT10BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | DDR | SigmaDDR-II+ | GSI技术 | GSI技术 | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342TT10BD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 460 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AGB-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, BGA119,7X17,50 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 7.5 ns | 70 °C | 有 | GS8322Z18AGB-150 | 150 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | 0 to 85 °C | Bulk | GS8322Z18AGB | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||||||
![]() | GS816236DD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | Bulk | GS816236DD | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 250 mA, 270 mA | 5.5 ns | 512 k x 36 | 19 b | SRAM | 18 Mb | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E32BGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | FLATPACK, LOW PROFILE | QFP | 5.69 | GSI TECHNOLOGY | Obsolete | GSI技术 | RECTANGULAR | LQFP | 2.5 V | 524288 words | GS8160E32BGT-150 | 有 | 70 °C | 7.5 ns | 未说明 | PLASTIC/EPOXY | 512000 | 3 | LQFP, | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | SYNCHRONOUS | 512KX32 | 1.6 mm | 32 | 16777216 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 无 | GS8321Z18AD-150 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 0 to 85 °C | Tray | GS8321Z18AD | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.4 mm | 18 | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | GS816032BGT-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 6.5 ns | 70 °C | 有 | GS816032BGT-200 | 200 MHz | 524288 words | 2.5 V | LQFP | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.67 | QFP | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | COMMERCIAL | SYNCHRONOUS | 0.255 mA | 512KX32 | 3-STATE | 1.6 mm | 32 | 16777216 bit | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182Q36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Tray | GS8182Q36 | 活跃 | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 512 kWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | -40 to 85 °C | Tray | GS8182Q36BGD | SigmaQuad-II | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | 18 Mbit | 2 | 333 MHz | 1.015 A | SRAM | Parallel | Pipelined | 512 k x 36 | - | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | 512K x 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74108AGP-8 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 44 | 44 | 512000 | PLASTIC/EPOXY | TSOP2 | 1.52 | GSI TECHNOLOGY | 不推荐 | GSI技术 | RECTANGULAR | TSOP2 | 3.3 V | 524288 words | GS74108AGP-8 | 有 | 70 °C | 8 ns | 未说明 | TSOP2, | SMALL OUTLINE, THIN PROFILE | 3 | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | 8542.32.00.41 | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.8 mm | compliant | R-PDSO-G44 | 不合格 | COMMERCIAL | ASYNCHRONOUS | 512KX8 | 1.2 mm | 8 | 4194304 bit | PARALLEL | 标准SRAM | 3.6 V | 3 V | 18.41 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT38BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | GSI Technology Inc. | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Tray | GS8342TT | 活跃 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342TT38BGD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.9 | BGA | Industrial grade | 500 MHz | -40 to 100 °C | Tray | GS8342TT38BGD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 500 MHz | 955 mA | SRAM | Parallel | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | - | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 1M x 36 | 15 mm | 13 mm | |||||||||||
![]() | GS71116AGU-12E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-48 | Parallel | GSI技术 | GSI技术 | Details | 3.6 V | 270 | 3 V | SMD/SMT | GS71116AGU | Asynchronous | Memory & Data Storage | 1 Mbit | 85 mA | 12 ns | 64 k x 16 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T36BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88132CD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 250 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R08BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 200 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | GS881Z18CD | 9 Mbit | 130 mA, 155 mA | 6.5 ns | 512 k x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S09GE-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaSIO DDR-II | Details | DDR-II | Commercial grade | 375 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 9 Bit | 表面贴装 | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302S09GE | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 995 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74117AGX-8E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-48 | 48 | 16 Bit | 3.6 V | 表面贴装 | 3.6 V | 135 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Details | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | -40 to 125 °C | GS74117AGX | Asynchronous | Memory & Data Storage | 4 Mbit | 1 | 130 mA | 8 ns | 256 k x 16 | 18 Bit | SRAM | 4 Mbit | 扩展工业 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T18BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 165-LBGA | YES | 165 | 165-FPBGA (15x13) | 165 | 活跃 | Volatile | GSI Technology Inc. | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | BGA | 1.52 | GSI TECHNOLOGY | 活跃 | GSI技术 | RECTANGULAR | LBGA | 1.8 V | GS8182T18BGD-300I | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | Tray | GS8182T18 | -40 to 85 °C | - | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | SRAM - Synchronous, DDR II | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18Mbit | 1 | SYNCHRONOUS | 300 MHz | SRAM | Parallel | Pipelined | 1MX18 | 1.4 mm | 18 | - | 20 Bit | 18 Mbit | 18874368 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 1M x 18 | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||
![]() | GS8644Z36E-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8644Z36E-250IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | BGA | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS8644Z36E | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | PIPELINED OR FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 295 mA, 435 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 1.5 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | |||||||||||||||||||||
![]() | GS72116AT-10I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | YES | 44 | 44 | Non-Compliant | QFP, QFP44,.47SQ,32 | FLATPACK | 3 | 128000 | PLASTIC/EPOXY | QFP44,.47SQ,32 | -40 °C | 未说明 | 10 ns | 85 °C | 无 | GS72116AT-10I | 131072 words | 3.3 V | QFP | SQUARE | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.77 | QFP | 3A991.B.2.B | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.8 mm | compliant | S-PQFP-G44 | 不合格 | 3.3 V | INDUSTRIAL | ASYNCHRONOUS | 0.105 mA | 128KX16 | 3-STATE | 16 | 0.01 A | 2 | PARALLEL | COMMON | 标准SRAM | 3 V | 3.6 V | 3 V | 10 mm | 10 mm |
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