品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342T36BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Bulk | GS8342T36BGD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 735 mA | Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T19BGE-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | Compliant | 375 MHz | + 85 C | 1.9 V | - 40 C | Bulk | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 1.04 A | 4 M x 18 | 22 b | 72 Mb | 72 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S09BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | 有 | 167 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | Tray | GS8182S09BD | SigmaSIO DDR-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 315 mA | 2 M x 9 | 20 b | SRAM | 18 Mb | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342S36BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Bulk | GS8342S36BD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 685 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816132DD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | BGA | 5.31 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 2.5 V | 524288 words | GS816132DD-250I | 无 | 85 °C | Compliant | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, | Bulk | GS816132DD | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | -40 °C | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 250 mA, 270 mA | 5.5 ns | 512 k x 32 | 1.4 mm | 32 | 19 b | SRAM | 18 Mb | 16777216 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D18BD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8182D18BD-200I | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | Compliant | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, | Tray | GS8182D18BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 365 mA | 1 M x 18 | 1.4 mm | 18 | 18 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||
![]() | GS8342Q37BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Commercial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Bulk | GS8342Q37BGD | SigmaQuad-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 640 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T36BE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | Tray | GS8672T36BE | SigmaDDR-II | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 1.45 A | 2 M x 36 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | QFP, | FLATPACK | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 有 | GS816136DGT-200V | 1.8 V | QFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | QFP | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 0 to 85 °C | Bulk | GS816136DGT | 3A991.B.2.B | 同步突发 | 85 °C | 0 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 4 | SYNCHRONOUS | 205 mA, 210 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 36 | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 无 | ||||||||||||||||||||||||||||||||
![]() | GS8161Z18DGD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | -40 to 100 °C | Bulk | GS8161Z18DGD | 100 °C | -40 °C | 18 Mbit | 2 | 240 mA, 300 mA | 5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | 18 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT07BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 1.9 V | DDR | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | 0 C | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342QT07BGD-200 | 200 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | 200 MHz | FBGA | QDR | 0 to 85 °C | Bulk | GS8342QT07BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 555 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 36 Mbit | 33554432 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||
![]() | GS8672T37BGE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | Tray | GS8672T37BGE | SigmaDDR-II+ B2 | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.59 A | 2 M x 36 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E18DD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | -40 to 85 °C | Bulk | GS8161E18DD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 2 | 230 mA, 250 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320E32AGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks, 6 Days | TQFP-100 | YES | 100 | 100 | Synchronous | 32 Bit | 2, 2.7 V | Compliant | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS8320E32AGT-250I | 250 MHz | 1048576 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | SRAM 2.5 or 3.3V 1M x 32 32M | GSI TECHNOLOGY | 1.79 | QFP | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | TQFP | 1.8, 2.5 V | 1.7, 2.3 V | -40 to 100 °C | Bulk | GS8320E32AGT | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 250 mA, 305 mA | 5.5@Flow-Through/3@P | 1 M x 32 | 3-STATE | 1.6 mm | 32 | 20 b | SRAM | 36 Mb | 0.04 A | 36 | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | |||||||||||||||||||||
![]() | GS8182S18BGD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | 有 | 167 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | Tray | GS8182S18BGD | SigmaSIO DDR-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 315 mA | 1 M x 18 | 19 b | SRAM | 18 Mb | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | 1.7 V | 18 | - 40 C | 2.7 V | + 85 C | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | -40 to 85 °C | Bulk | GS8161E36DD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 245 mA, 265 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88036CGT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | GSI Technology Inc. | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS88036 | 活跃 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS88036CGT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.66 | QFP | Industrial grade | 200@Flow-Through/300@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS88036CGT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 300 MHz | 185 mA, 245 mA | 5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | 3-STATE | 1.6 mm | 36 | - | 18 Bit | SRAM | 9 Mbit | 0.045 A | 9437184 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 256K x 36 | 20 mm | 14 mm | |||||||
![]() | GS8161E18DD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 85 °C | Bulk | GS8161E18DD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 2 | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mb | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88032CGT-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 200@Flow-Through/300@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS88032CGT | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 165 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182Q18BGD-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.5 ns | 85 °C | 有 | GS8182Q18BGD-167I | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Compliant | 有 | 167 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Tray | GS8182Q18BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 445 mA | 1 M x 18 | 1.4 mm | 18 | 19 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8182Q36BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8182Q36BGD-250I | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Tray | GS8182Q36BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 670 mA | 512 k x 36 | 1.4 mm | 36 | 18 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8342D08BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342D08BD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Bulk | GS8342D08BD | 3A991.B.2.B | SigmaQuad-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 470 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | SRAM | 36 Mbit | 0.195 A | 33554432 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||
![]() | GS8342TT20BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Bulk | GS8342TT20BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 575 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E32AD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 100 °C | Bulk | GS8321E32AD | DCD Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 4 | 250 mA, 305 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816018DGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 100 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS816018DGT-200IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.32 | QFP | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | -40 to 100 °C | Bulk | GS816018DGT | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 215 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 18 | 21 b | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 |
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