品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342TT37BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Compliant | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342TT37BD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 670 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T11BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Compliant | BGA | 5.21 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | 400 MHz | GS8342T11BD-400I | 无 | 85 °C | 0.45 ns | 未说明 | -40 °C | BGA165,11X15,40 | PLASTIC/EPOXY | 4000000 | GRID ARRAY, LOW PROFILE | LBGA, BGA165,11X15,40 | Industrial grade | 400 MHz | FBGA | -40 to 100 °C | Tray | GS8342T11BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 610 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 0.225 A | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||
![]() | GS8182Q09BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | DDR | SigmaQuad-II | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8182Q09BD-250I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | -40 to 85 °C | Tray | GS8182Q09BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 605 mA | Pipelined | 2 M x 9 | 1.4 mm | 9 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||
![]() | GS8342QT10BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342QT10BGD | SigmaQuad-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 555 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182Q08BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | Tray | GS8182Q08BGD | SigmaQuad-II | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 510 mA | 2 M x 8 | 20 b | SRAM | 18 Mb | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342S18BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | Details | DDR | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342S18BGD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 470 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880F32CGT-6.5I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS880F32CGT-6.5I | 153 MHz | 262144 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.37 | QFP | 有 | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | Tray | GS880F32CGT | e3 | 有 | 3A991.B.2.B | 流过 | 纯哑光锡 | 85 °C | -40 °C | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 160 mA | 6.5 ns | 256 k x 32 | 3-STATE | 1.6 mm | 32 | 18 b | SRAM | 8 Mb | 0.045 A | 8388608 bit | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||
![]() | GS8182Q08BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8182Q08BD-333 | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | BGA | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | 0 to 70 °C | Tray | GS8182Q08BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 860 mA | Pipelined | 2 M x 8 | 1.4 mm | 8 | 20 Bit | SRAM | 18 Mbit | 16777216 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||
![]() | GS8342S09BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | Details | DDR | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342S09BGD | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 605 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S09BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR | FBGA | 1.8000 V | 9 Bit | -40 to 85 °C | Tray | GS8182S09BGD | SigmaSIO DDR-II | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 525 mA | 0.45 | 2 M x 9 | 20 b | SRAM | 18 Mb | 18 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 150 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | FBGA | -40 to 85 °C | Bulk | 85 °C | -40 °C | 18 Mbit | 4 | 195 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 b | 18 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CB-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Compliant | 200 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | BGA, | 网格排列 | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS88218CB-200 | 524288 words | 2.5 V | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 130 mA, 155 mA | 6.5 ns | 512 k x 18 | 1.77 mm | 18 | 19 b | 9 Mb | 9437184 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 22 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342S36BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 表面贴装 | 1.9 V | 36 Bit | 1 MWords | Synchronous | 1.7 V | 1.8000 V | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342S36BD-300I | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Industrial grade | 300 MHz | FBGA | -40 to 100 °C | Bulk | GS8342S36BD | 3A991.B.2.B | SigmaSIO DDR-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 685 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 0.21 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||
![]() | GS881Z18CGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | LQFP, | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS881Z18CGT-150 | 524288 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.51 | QFP | Compliant | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Tray | GS881Z18CGT | e3 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Matte Tin (Sn) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 120 mA, 130 mA | 7.5 ns | 512 k x 18 | 1.6 mm | 18 | 18 b | SRAM | 9 Mb | 9437184 bit | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8161E32DD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 18 | -40 to 85 °C | Bulk | GS8161E32DD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 195 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 32 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342R09BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342R09BGD | SigmaDDR-II B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 405 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT07BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | SMD/SMT | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342TT07BGD-300 | 300 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | DDR | SigmaDDR-II+ | GSI技术 | GSI技术 | Parallel | Bulk | GS8342TT07BGD | 3A991.B.2.B | SigmaDDR-II+ B2 | 85 °C | 0 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 1 | SYNCHRONOUS | 450 mA | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 b | SRAM | 36 Mb | 36 | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||
![]() | GS8161E32DD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS8161E32DD-200 | 524288 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Compliant | SDR | SyncBurst | GSI技术 | GSI技术 | SMD/SMT | 2.3 V | 36 | 0 C | 3.6 V | + 70 C | 200 MHz | 有 | LBGA, | GRID ARRAY, LOW PROFILE | Bulk | GS8161E32DD | 3A991.B.2.B | DCD Pipeline/Flow Through | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | 4 | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 32 | 1.4 mm | 32 | 19 b | SRAM | 18 Mb | 16777216 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S18BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 18 | Tray | GS8182S18BD | SigmaSIO DDR-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 485 mA | 1 M x 18 | 19 b | SRAM | 18 Mb | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342R09BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342R09BD | SigmaDDR-II B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 525 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT38BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342DT38BD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 860 mA | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT06BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342TT06BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 575 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z36DGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 165-LBGA | YES | 165 | 165-FPBGA (15x13) | 165 | GSI Technology Inc. | 85 °C | 有 | GS8162Z36DGD-250I | 524288 words | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Tray | GS8162Z36 | 活跃 | Volatile | 250 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | -40°C ~ 100°C (TJ) | - | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18Mbit | SYNCHRONOUS | 250 MHz | 250 mA, 270 mA | 5.5 ns | SRAM | Parallel | 512 k x 36 | 1.4 mm | 36 | - | 18874368 bit | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 512K x 36 | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D36BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | Details | DDR | Tray | GSI Technology Inc. | GS8182D36 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8182D36BGD-300I | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.65 | BGA | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | -40°C ~ 85°C (TA) | Tray | GS8182D36BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | SYNCHRONOUS | 300 MHz | 605 mA | SRAM | Parallel | 512 k x 36 | 1.4 mm | 36 | - | SRAM | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 512K x 36 | 15 mm | 13 mm | ||||||||||||||||||||||||||||
![]() | GS71116AU-10I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | BGA-48 | YES | 48 | 48 | - | + 85 C | 3.6 V | - 40 C | 240 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | N | SDR | TFBGA, BGA48,6X8,30 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 64000 | PLASTIC/EPOXY | BGA48,6X8,30 | -40 °C | 未说明 | 10 ns | 85 °C | 无 | GS71116AU-10I | 3.3 V | TFBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.58 | BGA | Industrial grade | FBGA | 3.3000 V | Asynchronous | 64 kWords | 16 Bit | 表面贴装 | 有 | -40 to 85 °C | GS71116AU | 无 | 3A991.B.2.B | Asynchronous | 85 °C | -40 °C | 8542.32.00.41 | Memory & Data Storage | CMOS | 3.3 V | BOTTOM | BALL | 未说明 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | 3.3 V | INDUSTRIAL | 1 Mbit | 1 | ASYNCHRONOUS | 105 mA | 10 ns | 64 k x 16 | 3-STATE | 1.2 mm | 16 | 16 Bit | SRAM | 1 Mbit | 0.005 A | 1048576 bit | Industrial | PARALLEL | COMMON | 标准SRAM | 2 V | 3.6 V | 3 V | SRAM | 8 mm | 6 mm | 无 |
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