品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS71116AU-15E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-48 | 3.6 V | 270 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | N | GS71116AU | Asynchronous | Memory & Data Storage | 1 Mbit | 15 ns | 64 k x 16 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T38GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 450 MHz | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | 0 to 85 °C | Tray | GS81302T38GE | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 1.19 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81282Z18GB-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-119 | YES | 119 | 未说明 | 4.5 ns | 85 °C | 有 | GS81282Z18GB-333V | 8388608 words | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.68 | Details | 333 MHz | Parallel | 2.3 V | 0 C | + 85 C | SMD/SMT | SDR | 有 | 10 | NBT SRAM | 3.6 V | BGA, | 网格排列 | 8000000 | PLASTIC/EPOXY | 0 to 85 °C | Tray | GS81282Z18GB | NBT Pipeline/Flow Through | IT ALSO OPERATES AT 2.5 V NOMINAL SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | OTHER | 144 Mbit | SYNCHRONOUS | 400 mA, 530 mA | 4.5 ns | 8 M x 18 | 1.99 mm | 18 | 150994944 bit | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS82582QT37GE-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | FPBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 36 Bit | 1.9 V | 1.9 V | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 85 °C | 有 | GS82582QT37GE-333 | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.59 | Details | 333 MHz | Parallel | 1.7 V | 0 C | + 70 C | SMD/SMT | QDR-II | 有 | 10 | SigmaQuad-II+ | 0 to 85 °C | Tray | GS82582QT37GE | 3A991.B.2.B | SigmaQuad-II+ B2 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | OTHER | 288 Mbit | SYNCHRONOUS | 1.11 A | 0.45 | 8 M x 36 | 1.5 mm | 36 | 288 | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||
![]() | GS8662D20BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.9 V | 表面贴装 | 1.9 V | Commercial grade | Details | 450 MHz | Parallel | 1.7 V | 0 C | + 70 C | SMD/SMT | DDR | 有 | 15 | SigmaQuad-II+ | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 0 to 85 °C | Tray | GS8662D20BGD | SigmaQuad-II+ | 72 Mbit | 2 | 820 mA | Pipelined | 4 M x 18 | 20 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81313LQ18GK-714I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | 1.35 V | 表面贴装 | 1.35 V | Industrial grade | Parallel | 1.2 V | Details | 714 MHz | - 40 C | + 100 C | SMD/SMT | DDR | 有 | 10 | SigmaQuad-IIIe | 714 MHz | BGA | DDR | 1.3000 V | 1.2 V | Synchronous | 8 MWords | 18 Bit | -40 to 100 °C | Tray | GS81313LQ18GK | SigmaQuad-IIIe B2 | 144 Mbit | 1 | 1.7 A | 8 M x 18 | 21 Bit | 144 MB | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82583ED18GK-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | YES | 260 | 260 | 有 | 10 | SigmaQuad-IIIe | 500 MHz | FBGA | DDR | 1.3000 V | 1.25 V | Synchronous | 16 MWords | 18 Bit | 1.35 V | 表面贴装 | 1.35 V | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 16000000 | PLASTIC/EPOXY | 未说明 | 有 | GS82583ED18GK-500I | 1.2 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.74 | Industrial grade | Details | 500 MHz | Parallel | 1.25 V | - 40 C | + 100 C | SMD/SMT | QDR-III | -40 to 100 °C | Tray | GS82583ED18GK | e1 | 3A991.B.2.B | SigmaQuad-IIIe B4 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 288 Mbit | 1 | SYNCHRONOUS | 1.2 A | 16 M x 18 | 2.3 mm | 18 | 22 Bit | 288 Mbit | 301989888 bit | Industrial | PARALLEL | QDR SRAM | 1.25 V | 1.15 V | 22 mm | 14 mm | ||||||||||||||||||||||||||
![]() | GS81302TT19GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.9 V | 表面贴装 | 1.9 V | Industrial grade | - 40 C | + 85 C | SMD/SMT | DDR-II | 有 | 10 | SigmaDDR-II+ | Details | 350 MHz | Parallel | 1.7 V | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | -40 to 100 °C | Tray | GS81302TT19GE | SigmaDDR-II+ B2 | 144 Mbit | 1 | 810 mA | Pipelined | 8 M x 18 | 22 Bit | 144 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D08GE-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Commercial grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D08GE | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 995 mA | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D07GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D07GE | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.055 A | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E18CGT-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS881E18CGT-150IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | QFP | Industrial grade | TQFP | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS881E18CGT | e3 | 有 | 3A991.B.2.B | DCD Pipeline/Flow Through | Matte Tin (Sn) | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.6 mm | 18 | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||
![]() | GS8321Z32AD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GS8321Z32AD-375 | 1048576 words | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | 375 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | 238@Flow-Through/375@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 32 Bit | 2.7, 3.6 V | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 无 | 0 to 85 °C | GS8321Z32AD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | SYNCHRONOUS | 270 mA, 380 mA | 4.2@Flow-Through/2.5 | 1MX32 | 1.4 mm | 32 | 36 | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | GS832118AD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 250@Flow-Through/400@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | 2.7, 3.6 V | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | 0 to 85 °C | Tray | GS832118AD | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 265 mA, 355 mA | 4@Flow-Through/2.5@P | 2 M x 18 | SRAM | 36 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72C-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 表面贴装 | 2.7, 3.6 V | 72 Bit | 512 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | 117.6@Flow-Through/150@Pipelined MHz | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS8322Z72C | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 8 | 220 mA, 280 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z18B-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | SDR | FBGA | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, | 网格排列 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 无 | GS8642Z18B-167IV | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.17 | BGA | Industrial grade | 125@Flow-Through/167@Pipelined MHz | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 85 °C | Tray | GS8642Z18B | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 215 mA, 260 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 1.99 mm | 18 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||
![]() | GS832272GC-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | 表面贴装 | 2, 2.7 V | 72 Bit | 512 kWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | -40 to 85 °C | Tray | GS832272GC | 同步突发 | Memory & Data Storage | 36 Mbit | 8 | 285 mA, 400 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T09BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 70 °C | 无 | GS8182T09BD-400 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.33 | BGA | Commercial grade | 表面贴装 | 1.9 V | 9 Bit | 2 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 400 MHz | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 0 to 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 1 | SYNCHRONOUS | Pipelined | 2MX9 | 1.4 mm | 9 | 20 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||
![]() | GS88136CD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, | 网格排列 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS88136CD-150IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 85 °C | Tray | GS88136CD | 3A991.B.2.B | 同步突发 | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 130 mA, 145 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||
![]() | GS88136CD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 66 | - 40 C | 2.7 V | + 85 C | 200 MHz | 有 | LQFP, | 网格排列 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS88136CD-200IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS88136CD | 3A991.B.2.B | 同步突发 | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 145 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||
![]() | GS864032GT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 200 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 133.3@Flow-Through/200@Pipelined MHz | TQFP | SDR | -40 to 85 °C | GS864032GT | 72 Mbit | 4 | 250 mA, 330 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 32 | 21 Bit | 64 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AGB-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | 0 to 85 °C | Tray | GS832236AGB | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 270 mA, 355 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT20BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT20BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 590 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D10E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 70 °C | Tray | GS81302D10E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 815 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832118AGD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | 表面贴装 | 2, 2.7 V | 18 Bit | 2 MWords | Synchronous | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 85 °C | 有 | GS832118AGD-200V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 0 to 85 °C | Tray | GS832118AGD | 3A991.B.2.B | 同步突发 | PIPELINE OR FLOW THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5 SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 195 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||
![]() | GS832218AGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4 ns | 70 °C | 有 | GS832218AGD-400 | 400 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Commercial grade | 250@Flow-Through/400@Pipelined MHz | 0 to 85 °C | Tray | GS832218AGD | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 265 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm |
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