品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 记忆密度 | 筛选水平 | 并行/串行 | 内存IC类型 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS8662Q08BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | 15 | 0 C | 1.9 V | + 70 C | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | 有 | 333 MHz | DDR | N | SigmaQuad-II | GSI技术 | GSI技术 | Parallel | SMD/SMT | 0 to 85 °C | Tray | GS8662Q08BD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 2 | 920 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640FZ18GT-8.0VI | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS8640FZ18GT | NBT | Memory & Data Storage | 72 Mbit | 1 | 215 mA | 8 ns | Flow-Through | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q37GE-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 200 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS81302Q37GE | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 930 mA | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT19BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS8342TT19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 600 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CB-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 36 Bit | 2, 2.7 V | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 42 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, | 网格排列 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS882Z36CB-150IV | 262144 words | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | 133.3@Flow-Through/150@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 85 °C | Tray | GS882Z36CB | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 9 Mbit | SYNCHRONOUS | 130 mA, 145 mA | 7.5@Flow-Through/3.8 | 256 k x 36 | 1.77 mm | 36 | SRAM | 9 | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||||||
![]() | GS8161E36DGT-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 375 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | -40 to 70 °C | Tray | GS8161E36DGT | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 290 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S36BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | DDR | N | SigmaSIO DDR-II | GSI技术 | GSI技术 | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8662S36BD-350 | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.79 | BGA | Commercial grade | 350 MHz | FBGA | 0 to 85 °C | Tray | GS8662S36BD | 3A991.B.2.B | SigmaSIO DDR-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 885 mA | Pipelined | 2 M x 36 | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||
![]() | GS8342TT06BD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | Commercial grade | 550 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | DDR | 有 | 550 MHz | + 70 C | 1.9 V | 0 to 85 °C | Tray | GS8342TT06BD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 1 | 800 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302S36E | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 1.055 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT10BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS8662QT10BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 860 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S08BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS8662S08BD | SigmaSIO DDR-II | Memory & Data Storage | 72 Mbit | 2 | 735 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640E18GT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 4 MWords | 18 Bit | 3.6 V | 表面贴装 | LQFP, | FLATPACK, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS8640E18GT-300I | 2.5 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.56 | QFP | 300 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 181.8@Flow-Through/300@Pipelined MHz | TQFP | SDR | 3.3000 V | 3 V | Synchronous | -40 to 85 °C | GS8640E18GT | e3 | 有 | 3A991.B.2.B | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 290 mA, 390 mA | 5.5 ns | Flow-Through/Pipelined | 4MX18 | 1.6 mm | 18 | 22 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 20 mm | 14 mm | ||||||||||||||||
![]() | GS8662D37BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS8662D37BD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 735 mA | Pipelined | 2 M x 36 | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CB-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | BGA, | 网格排列 | 512000 | PLASTIC/EPOXY | 未说明 | 4.5 ns | 70 °C | 无 | GS882Z18CB-333 | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 0 to 70 °C | Tray | GS882Z18CB | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 165 mA, 220 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.77 mm | 18 | SRAM | 9 Mbit | 9437184 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||||||
![]() | GS8182T08BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 未说明 | 0.45 ns | 70 °C | 无 | GS8182T08BD-400 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.32 | BGA | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 0 to 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 1 | SYNCHRONOUS | Pipelined | 2MX8 | 1.4 mm | 8 | 20 Bit | 18 Mbit | 16777216 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | GS8342DT07BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8342DT07BD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 715 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT10BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.9 V | + 70 C | 450 MHz | FBGA | 1.8000 V | 1.7 V | 8 MWords | 9 Bit | 1.9 V | 有 | 450 MHz | DDR | Details | SigmaDDR-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | 0 C | 0 to 85 °C | Tray | GS8662TT10BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 695 mA | 0.45 | 8 M x 9 | SRAM | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H18AGB-100 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 119 | 119 | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 12 ns | 70 °C | 有 | GS840H18AGB-100 | 262144 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | BGA, | e1 | 有 | 3A991.B.2.B | 锡银铜 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | SYNCHRONOUS | 256KX18 | 2.19 mm | 18 | 4718592 bit | PARALLEL | 缓存SRAM | 3.6 V | 3 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864418E-133IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 表面贴装 | 2, 2.7 V | 18 Bit | 4 MWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 117.6@Flow-Through/133@Pipelined MHz | 有 | 133 MHz | + 85 C | 2.7 V | - 40 C | 15 | -40 to 85 °C | Tray | GS864418E | 同步突发 | Memory & Data Storage | 72 Mbit | 2 | 235 mA, 285 mA | 8.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T11BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8662T11BD-450 | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.5 | BGA | Commercial grade | 450 MHz | FBGA | 0 to 85 °C | Tray | GS8662T11BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 1 | SYNCHRONOUS | 695 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS882Z18CGD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 200 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | 0 to 70 °C | GS882Z18CGD | 9 Mbit | 2 | 115 mA, 140 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | 9 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T19BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8342T19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 610 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS882Z18CGD-300I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.57 | BGA | Industrial grade | -40 to 85 °C | Tray | GS882Z18CGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 170 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.4 mm | 18 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||
![]() | GS8662TT06BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662TT06BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 600 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864418GE-133 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 117.6@Flow-Through/133@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 133 MHz | + 70 C | 3.6 V | 0 C | 0 to 70 °C | Tray | GS864418GE | 同步突发 | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 2 | 210 mA, 250 mA | 8.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 |
GS8662Q08BD-333
GSI Technology
分类:Memory
GS8640FZ18GT-8.0VI
GSI Technology
分类:Memory
GS81302Q37GE-200
GSI Technology
分类:Memory
GS8342TT19BD-400
GSI Technology
分类:Memory
GS882Z36CB-150IV
GSI Technology
分类:Memory
GS8161E36DGT-375I
GSI Technology
分类:Memory
GS8662S36BD-350
GSI Technology
分类:Memory
GS8342TT06BD-550
GSI Technology
分类:Memory
GS81302S36E-350
GSI Technology
分类:Memory
GS8662QT10BGD-300I
GSI Technology
分类:Memory
GS8662S08BD-400
GSI Technology
分类:Memory
GS8640E18GT-300I
GSI Technology
分类:Memory
GS8662D37BD-300
GSI Technology
分类:Memory
GS882Z18CB-333
GSI Technology
分类:Memory
GS8182T08BD-400
GSI Technology
分类:Memory
GS8342DT07BD-400I
GSI Technology
分类:Memory
GS8662TT10BGD-450
GSI Technology
分类:Memory
GS840H18AGB-100
GSI Technology
分类:Memory
GS864418E-133IV
GSI Technology
分类:Memory
GS8662T11BD-450
GSI Technology
分类:Memory
GS882Z18CGD-200V
GSI Technology
分类:Memory
GS8342T19BD-400I
GSI Technology
分类:Memory
GS882Z18CGD-300I
GSI Technology
分类:Memory
GS8662TT06BD-350I
GSI Technology
分类:Memory
GS864418GE-133
GSI Technology
分类:Memory
