品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS832036AGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks, 5 Days | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | 0.460219 oz | GSI Technology Inc. | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS832036 | 活跃 | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 有 | GS832036AGT-250I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.88 | QFP | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | -40 to 100 °C | Tray | GS832036AGT | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 3.3; SYNCHRONOUS BURST | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 36 Mbit | 4 | SYNCHRONOUS | 250 MHz | 250 mA, 305 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | 1.6 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 1M x 36 | 20 mm | 14 mm | ||||||||||||||||||||
![]() | GS832036AGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | GSI Technology Inc. | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 活跃 | GS832036 | Tray | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 5 ns | 有 | GS832036AGT-333IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.66 | QFP | Industrial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 100 °C | Tray | GS832036AGT | 3A991.B.2.B | 同步突发 | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | Memory & Data Storage | SRAM - Synchronous, Standard | 1.7V ~ 2V, 2.3V ~ 2.7V | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 36 Mbit | 4 | SYNCHRONOUS | 333 MHz | 290 mA, 375 mA | 5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | 1.6 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 1M x 36 | 20 mm | 14 mm | |||||||||||||||||||||
![]() | GS881Z36CGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS881Z | 活跃 | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS881Z36CGD | NBT Pipeline/Flow Through | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | 9 Mbit | 1 | 333 MHz | 200 mA, 260 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | - | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 256K x 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q36BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Tray | GS8342Q | 活跃 | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342Q36BGD | SigmaQuad-II | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | 36 Mbit | 2 | 357 MHz | 1.155 A | SRAM | Parallel | Pipelined | 1 M x 36 | - | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 1M x 36 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88036CGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100 | 100-TQFP (20x14) | GSI Technology Inc. | GSI技术 | SyncBurst | Details | SDR | Tray | GS88036 | 活跃 | Industrial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | -40 to 85 °C | Tray | GS88036CGT | Pipeline/Flow Through | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 9 Mbit | 4 | 333 MHz | 200 mA, 260 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | - | SRAM | 9 Mbit | Industrial | SRAM | 256K x 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816118DGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 165-LBGA | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | Tray | GS816118 | 活跃 | Volatile | 333 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | -40 to 85 °C | Bulk | - | 85 °C | -40 °C | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 18Mbit | 2 | 333 MHz | 260 mA, 305 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 18 | - | 20 Bit | 18 Mbit | Industrial | 1M x 18 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D18BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Tray | GS8342D | 活跃 | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342D18BGD | SigmaQuad-II | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | 36 Mbit | 2 | 400 MHz | 715 mA | SRAM | Parallel | Pipelined | 2 M x 18 | - | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 2M x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS816136 | 活跃 | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS816136DGD | Pipeline/Flow Through | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 18 Mbit | 4 | 333 MHz | 280 mA, 335 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 512 k x 36 | - | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 512K x 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T18BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | Tray | GS8342T | 活跃 | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342T18BGD | SigmaDDR-II B2 | Memory & Data Storage | SRAM - Quad Port, Synchronous, DDR II | 1.7V ~ 1.9V | 36 Mbit | 1 | 400 MHz | 610 mA | SRAM | Parallel | Pipelined | 2 M x 18 | - | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 2M x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z36GB-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-119 | YES | 119 | 119-FPBGA (22x14) | 119 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | GSI Technology Inc. | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS8642Z | 活跃 | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8642Z36GB-250IV | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 166.6@Flow-Through/250@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS8642Z36GB | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, ZBT | 1.7V ~ 2V, 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 250 MHz | 275 mA, 380 mA | 6.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 36 | 1.99 mm | 36 | - | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 2M x 36 | 22 mm | 14 mm | |||||||||||||
![]() | GS8320Z36AGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100 | 100-TQFP (20x14) | GSI Technology Inc. | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Tray | GS8320Z | 活跃 | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 100 °C | Bulk | GS8320Z36AGT | NBT Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | 36 Mbit | 4 | 333 MHz | 280 mA, 365 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | - | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 1M x 36 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS84036CGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | TQFP-100 | YES | 100 | 100 | 2.3, 3 V | Synchronous | 128 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Non-Compliant | 有 | 200 MHz | + 85 C | 3.6 V | 0.304823 oz | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS84036CGT-200I | 3.3 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.37 | Industrial grade | 200 MHz | TQFP | SDR | 2.5, 3.3 V | -40 to 100 °C | Tray | GS84036CGT | 3A991.B.2.B | Pipeline/Flow Through | Pure Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 4 Mbit | 4 | SYNCHRONOUS | 160 mA, 190 mA | 6.5 ns | Flow-Through/Pipelined | 128 k x 36 | 1.6 mm | 36 | 17 Bit | SRAM | 4 Mbit | 4718592 bit | Industrial | PARALLEL | 缓存SRAM | 3.6 V | 3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||
![]() | GS880Z36CGT-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 有 | GS880Z36CGT-200 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.2 | QFP | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | GS880Z36CGT | e3 | 有 | 3A991.B.2.B | NBT | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 140 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||
![]() | GS8182R36BGD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 0.5 ns | 70 °C | 有 | GS8182R36BGD-167 | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.67 | BGA | 有 | 167 MHz | + 70 C | 1.9 V | 0.224777 oz | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | Tray | GS8182R36BGD | e1 | 有 | 3A991.B.2.B | SigmaDDR-II B4 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | SYNCHRONOUS | 330 mA | 500 ps | 512 k x 36 | 1.4 mm | 36 | SRAM | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 无 | GS8321Z18AD-250I | -40 to 100 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2 | SYNCHRONOUS | Flow-Through/Pipelined | 2MX18 | 1.4 mm | 18 | 21 Bit | 36 Mbit | 37748736 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816018DGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks, 3 Days | TQFP-100 | YES | 100 | 100 | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS816018DGT-150 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.71 | QFP | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 0 to 85 °C | Tray | GS816018DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 170 mA, 180 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 8 | 21 Bit | SRAM | 18 Mbit | 8388608 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | GS8321Z36AD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 无 | GS8321Z36AD-150I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.78 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | -40 to 100 °C | Tray | GS8321Z36AD | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 36 Mbit | 4 | SYNCHRONOUS | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||
![]() | GS816036DGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | 0 to 85 °C | Tray | GS816036DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 180 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 36 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D36BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Parallel | SMD/SMT | 1.7 V | 15 | - 40 C | 1.9 V | + 85 C | 250 MHz | 有 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342D36BGD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.88 | BGA | Industrial grade | 250 MHz | FBGA | -40 to 100 °C | Tray | GS8342D36BGD | e1 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 685 mA | 450 ps | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 18 Bit | SRAM | 36 Mbit | 0.195 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||
![]() | GS8342Q36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342Q36BGD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.91 | BGA | Industrial grade | 333 MHz | FBGA | QDR | -40 to 100 °C | Tray | GS8342Q36BGD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 1.065 A | 450 ps | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 0.245 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||
![]() | GS88118CGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | 2.7, 3.6 V | 18 Bit | 512 kWords | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 72 | - 40 C | 3.6 V | + 85 C | 200 MHz | 有 | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | GS88118CGD-200I | 3.3 V | LBGA | RECTANGULAR | 活跃 | BGA | 4.81 | GSI TECHNOLOGY | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | -40 to 85 °C | Tray | GS88118CGD | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 150 mA, 175 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.4 mm | 18 | 19 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | SERIAL | 缓存SRAM | 3.6 V | 3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | GS8322Z18AD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | 0.594778 oz | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS8322Z18AD-200I | 200 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.77 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | -40 to 100 °C | Tray | GS8322Z18AD | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 205 mA, 240 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||
![]() | GS832132AGD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks, 2 Days | BGA-165 | YES | 165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS832132AGD-150I | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.48 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | -40 to 100 °C | Tray | GS832132AGD | 3A991.B.2.B | Pipeline/Flow Through | PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 32 | 3-STATE | 1.4 mm | 32 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 33554432 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||
![]() | GS864218GB-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 14 | 0 C | 3.6 V | + 70 C | 167 MHz | 有 | Commercial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | SyncBurst | Details | SDR | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 0 to 70 °C | Tray | GS864218GB | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 2 | 195 mA, 240 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q09BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 9 Bit | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | 0.541455 oz | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342Q09BD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | -40 to 100 °C | Tray | GS8342Q09BD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 675 mA | 450 ps | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 0.215 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm |
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