GSI Technology GS881Z36CGD-333I

包装/外壳

BGA-165

安装类型

表面贴装

引脚数

165

供应商器件包装

165-FPBGA (13x15)

Maximum Clock Rate

222.2@Flow-Through/333@Pipelined MHz

Supplier Package

FBGA

Data Rate Architecture

SDR

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

2.3, 3 V

Timing Type

Synchronous

Number of Words

256 kWords

Number of I/O Lines

36 Bit

Maximum Operating Supply Voltage

2.7, 3.6 V

Mounting

表面贴装

Moisture Sensitive

有

Maximum Clock Frequency

333 MHz

Maximum Operating Temperature

+ 85 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

36

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Manufacturer

GSI技术

Brand

GSI技术

Tradename

NBT SRAM

RoHS

Details

Memory Types

SDR

Package

Tray

Base Product Number

GS881Z

厂商

GSI Technology Inc.

Product Status

活跃

Usage Level

Industrial grade

操作温度

-40 to 85 °C

系列

GS881Z36CGD

包装

Tray

类型

NBT Pipeline/Flow Through

子类别

Memory & Data Storage

技术

SRAM - Synchronous, ZBT

电压 - 供电

2.3V ~ 2.7V, 3V ~ 3.6V

内存大小

9 Mbit

端口的数量

1

时钟频率

333 MHz

电源电流-最大值

200 mA, 260 mA

访问时间

4.5 ns

内存格式

SRAM

内存接口

Parallel

建筑学

Flow-Through/Pipelined

组织结构

256 k x 36

写入周期时间 - 字符、页面

-

地址总线宽度

18 Bit

产品类别

SRAM

密度

9 Mbit

筛选水平

Industrial

产品类别

SRAM

组织的记忆

256K x 36