品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | Current - Supply (Nom) | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 频率 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8182Q36BGD-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 512 kWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 167 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | BGA | 4.64 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | GS8182Q36BGD-167I | 有 | 85 °C | 0.5 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 512000 | 3 | GRID ARRAY, LOW PROFILE | LBGA, | Industrial grade | 167 MHz | FBGA | DDR | -40 to 85 °C | Tray | GS8182Q36BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 495 mA | 500 ps | Pipelined | 512 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | GS81302D19GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | YES | 165 | 165 | Synchronous | 8 MWords | 18 Bit | 1.9 V | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | BGA, | 网格排列 | 3 | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS81302D19GE-400 | 1.8 V | BGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.2 | BGA | Commercial grade | 400 MHz | FBGA | 1.8000 V | 1.7 V | 0 to 70 °C | Tray | GS81302D19GE | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | SYNCHRONOUS | 1.055 A | 0.45 | 8 M x 18 | 18 | SRAM | 144 | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 18 | - 40 C | 3.6 V | + 85 C | 150 MHz | 有 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS8321E36AD-150I | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | -40 to 100 °C | Tray | GS8321E36AD | e0 | 无 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡铅 | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||
![]() | GS8321Z18AD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 无 | GS8321Z18AD-200I | -40 to 100 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2 | SYNCHRONOUS | Flow-Through/Pipelined | 2MX18 | 1.4 mm | 18 | 21 Bit | 36 Mbit | 37748736 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DGD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS8161Z18DGD-150I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.79 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | -40 to 85 °C | Tray | GS8161Z18DGD | 3A991.B.2.B | NBT | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||
![]() | GS8342DT20BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 85 °C | 有 | GS8342DT20BGD-500 | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.78 | BGA | Commercial grade | 500 MHz | FBGA | 0 to 85 °C | Tray | GS8342DT20BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 855 mA | 450 ps | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||
![]() | GS816032DGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 1.7, 2.3 V | Synchronous | 512 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS816032DGT-200IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.85 | QFP | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | -40 to 100 °C | Tray | GS816032DGT | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 230 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 32 | 1.6 mm | 32 | 20 Bit | SRAM | 18 Mbit | 16777216 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | GS816018DGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS816018DGT-250 | 1048576 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.84 | QFP | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 36 | 0 C | 3.6 V | + 85 C | 250 MHz | 有 | Tray | GS816018DGT | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 210 mA, 230 mA | 5.5 ns | 1 M x 18 | 1.6 mm | 8 | 21 b | SRAM | 18 Mb | 8388608 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T18BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR | 有 | 250 MHz | + 70 C | 1.9 V | Tray | GS8182T18BGD | SigmaDDR-II B2 | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 1 | 350 mA | 450 ps | 1 M x 18 | 20 b | SRAM | 18 Mb | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160Z18DGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | + 100 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 有 | GS8160Z18DGT-200I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.68 | Industrial grade | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 有 | 200 MHz | -40 to 100 °C | Tray | GS8160Z18DGT | 3A991.B.2.B | NBT Pipeline/Flow Through | 100 °C | -40 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 18 Mbit | 2 | SYNCHRONOUS | 215 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 18 | 20 b | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 295 mA | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | 1.051276 oz | - 40 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Compliant | BGA, BGA165,11X15,40 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS8644Z36E-250I | 250 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.64 | BGA | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | -40 to 85 °C | Tray | GS8644Z36E | 无 | 3A991.B.2.B | NBT | 85 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 153.8 MHz | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 295 mA, 435 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 3-STATE | 1.5 mm | 36 | 21 Bit | SRAM | 72 Mbit | 0.16 A | 75497472 bit | Industrial | PARALLEL | COMMON | Synchronous | 36 b | ZBT SRAM | 2.3 V | 3.6 V | 2.3 V | SRAM | 17 mm | 15 mm | 无 | ||||||||||||||||
![]() | GS832018AGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | 未说明 | 6.5 ns | 85 °C | 有 | GS832018AGT-200V | 1.8 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.06 | QFP | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | LQFP, | FLATPACK, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 0 to 85 °C | Bulk | 3A991.B.2.B | 85 °C | 0 °C | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | OTHER | 2 | SYNCHRONOUS | Flow-Through/Pipelined | 2MX18 | 1.6 mm | 18 | 21 Bit | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT37BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342QT37BGD-333 | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.66 | BGA | Commercial grade | 333 MHz | FBGA | 0 to 85 °C | Tray | GS8342QT37BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 1.01 A | 450 ps | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||
![]() | GS881E18CGD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GS881E18CGD-150 | 524288 words | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 4.62 | BGA | Compliant | 150 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS881E18CGD | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 120 mA, 130 mA | 7.5 ns | 512 k x 18 | 1.4 mm | 18 | 18 b | 9 Mb | 9437184 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816018DGT-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 100 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS816018DGT-150I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.32 | QFP | Industrial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | -40 to 100 °C | Tray | GS816018DGT | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 8 | 21 b | SRAM | 18 Mbit | 8388608 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||
![]() | GS880F36CGT-6.5I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS880F36CGT-6.5I | 153 MHz | 262144 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.9 | QFP | 有 | - | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | Tray | GS880F36CGT | e3 | 有 | 3A991.B.2.B | 流过 | 纯哑光锡 | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | SYNCHRONOUS | 160 mA | 6.5 ns | 256 k x 36 | 3-STATE | 1.6 mm | 36 | SRAM | 0.045 A | 9437184 bit | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q09BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | Commercial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Tray | GS8342Q09BD | SigmaQuad-II | Memory & Data Storage | 36 Mbit | 2 | 665 mA | 450 ps | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816032DGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS816032DGT-150 | 524288 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.85 | QFP | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS816032DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | SYNCHRONOUS | 180 mA, 190 mA | 7.5 ns | 512 k x 32 | 1.6 mm | 32 | SRAM | 16777216 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AGB-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | Bulk | 100 °C | -40 °C | 4 | 20 b | 36 Mb | 36 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z36CGT-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 150 MHz | + 85 C | 3.6 V | Tray | GS881Z36CGT | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 150 mA, 160 mA | 7.5 ns | 256 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z32CGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 200 MHz | + 85 C | 3.6 V | GS880Z32CGT | NBT | Memory & Data Storage | 9 Mbit | 160 mA, 190 mA | 6.5 ns | 256 k x 32 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816036DGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100 | 100-TQFP (20x14) | GSI Technology Inc. | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 活跃 | GS816036 | Tray | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 100 C | 3.6 V | - 40 C | 36 | -40 to 100 °C | Tray | GS816036DGT | Pipeline/Flow Through | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 18 Mbit | 4 | 333 MHz | 280 mA, 335 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 512 k x 36 | - | 20 Bit | SRAM | 18 Mbit | Industrial | SRAM | 512K x 36 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T18BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | 0.162437 oz | GSI Technology Inc. | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | Tray | GS8342T | 活跃 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342T18BGD-300I | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.86 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8342T18BGD | 3A991.B.2.B | SigmaDDR-II B2 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous, DDR II | 1.7V ~ 1.9V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 300 MHz | 460 mA | 450 ps | SRAM | Parallel | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | - | 21 Bit | SRAM | 36 Mbit | 0.195 A | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 2M x 18 | 15 mm | 13 mm | ||||||||||||||
![]() | GS8644Z18GE-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0.324873 oz | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 2.7 V | 0 to 70 °C | Tray | GS8644Z18GE | NBT | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 2 | 250 mA, 315 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z36CGT-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | GSI Technology Inc. | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS880Z | 活跃 | LQFP, | FLATPACK, LOW PROFILE | 256000 | UNSPECIFIED | -40 °C | 未说明 | 85 °C | 有 | GS880Z36CGT-250IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.65 | QFP | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS880Z36CGT | 3A991.B.2.B | NBT | PIPELINED ARCHITECTURE, FLOW-THROUGH, IT ALSO OPERATES WITH 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, ZBT | 1.7V ~ 2V, 2.3V ~ 2.7V | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-XQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 250 MHz | 160 mA, 200 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | - | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 256K x 36 | 20 mm | 14 mm |
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