品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662DT38BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | Synchronous | 1.8000 V | QDR | FBGA | 350 MHz | 表面贴装 | 36 Bit | 2 MWords | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | -40 to 100 °C | Tray | GS8662DT38BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 895 mA | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 表面贴装 | 2.7, 3.6 V | 18 Bit | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 85 °C | Tray | GS8162Z18DGD | NBT Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 2 | 250 mA, 320 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D06BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342D06BGD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 500 MHz | -40 to 100 °C | Tray | GS8342D06BGD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 865 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | SRAM | 36 Mbit | 0.26 A | 33554432 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||
![]() | GS8342D07BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | 450 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 Bit | 1.9 V | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | -40 to 100 °C | Tray | GS8342D07BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 795 mA | 0.45 | 4 M x 8 | SRAM | 36 | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z36AGD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 2, 2.7 V | 表面贴装 | 200 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 6.5 ns | 70 °C | 有 | GS8321Z36AGD-200V | 200 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 0 to 85 °C | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||
![]() | GS832032AGT-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS832032AGT | 同步突发 | Memory & Data Storage | 36 Mbit | 4 | 260 mA, 315 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT19BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662TT19BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 705 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832018AGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 5 ns | 有 | GS832018AGT-333IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | QFP | Industrial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | -40 to 100 °C | Tray | GS832018AGT | 3A991.B.2.B | 同步突发 | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 36 Mbit | 2 | SYNCHRONOUS | 265 mA, 350 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.6 mm | 18 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||||
![]() | GS81302D08GE-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Industrial grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302D08GE | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 1.005 A | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q19GE-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS81302Q19GE-250 | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Commercial grade | 250 MHz | FBGA | QDR | 0 to 85 °C | Tray | GS81302Q19GE | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | 2 | SYNCHRONOUS | 1.06 A | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||
![]() | GS816118DGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Industrial grade | FBGA | SDR | 2.5, 3.3 V | -40 to 85 °C | 2 | Flow-Through/Pipelined | 20 Bit | 18 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74117AX-8I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | BGA-119 | YES | 48 | 48 | 3.6 V | 表面贴装 | + 85 C | 3.6 V | - 40 C | 135 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | N | SDR | BGA | 5.23 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | TFBGA | 3.3 V | GS74117AX-8I | 无 | 85 °C | 8 ns | 未说明 | -40 °C | BGA48,6X8,30 | PLASTIC/EPOXY | 256000 | 3 | GRID ARRAY, THIN PROFILE, FINE PITCH | TFBGA, BGA48,6X8,30 | Industrial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | 16 Bit | -40 to 85 °C | GS74117AX | 无 | 3A991.B.2.B | Asynchronous | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | 3.3 V | INDUSTRIAL | 4 Mbit | 1 | ASYNCHRONOUS | 140 mA | 8 ns | 256 k x 16 | 3-STATE | 1.2 mm | 16 | 18 Bit | SRAM | 4 Mbit | 0.02 A | 4194304 bit | Industrial | PARALLEL | COMMON | 标准SRAM | 3 V | 3.6 V | 3 V | SRAM | 10 mm | 6 mm | |||||||||||||
![]() | GS8662TT10BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | DDR | N | SigmaDDR-II+ | GSI技术 | GSI技术 | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 70 °C | Tray | GS8662TT10BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 625 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT06GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302DT06GE | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 2 | 950 mA | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72GC-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 133 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS8322Z72GC | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 8 | 220 mA, 255 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S08BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.71 | BGA | 400 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS8662S08BGD-400 | 8388608 words | 1.8 V | LBGA | RECTANGULAR | 3A991.B.2.B | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | SYNCHRONOUS | 735 mA | 8 M x 8 | 1.4 mm | 8 | 72 | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302R18GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR-II | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302R18GE | SigmaDDR-II B4 | Memory & Data Storage | 144 Mbit | 2 | 765 mA | Pipelined | 8 M x 18 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT10BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662DT10BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 590 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT10BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662QT10BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 995 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E18DGT-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 2.5 V | QFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.42 | QFP | GS8161E18DGT-400 | 有 | 70 °C | 4 ns | 未说明 | UNSPECIFIED | 1000000 | FLATPACK | QFP, | Commercial grade | 250@Flow-Through/400@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 0 to 70 °C | Tray | GS8161E18DGT | 3A991.B.2.B | DCD Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | compliant | R-XQFP-G100 | 不合格 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 255 mA, 335 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | ||||||||||||||||||
![]() | GS8662Q09BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662Q09BD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 2 | 850 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D37BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 350 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 350 MHz | FBGA | QDR | -40 to 100 °C | GS8662D37BGD | 72 Mbit | 2 | 895 mA | Pipelined | 2 M x 36 | 19 Bit | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z18GE-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8644Z18GE-250IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | -40 to 85 °C | Tray | GS8644Z18GE | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 275 mA, 395 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 1.5 mm | 18 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||
![]() | GS8662T20BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | SMD/SMT | 1.7 V | 15 | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662T20BD-500I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.43 | BGA | Industrial grade | 500 MHz | FBGA | DDR | 1.8000 V | -40 to 100 °C | Tray | GS8662T20BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 770 mA | Pipelined | 4 M x 18 | 1.4 mm | 18 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||
![]() | GS81302T07GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302T07GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1 A | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM |
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