IDT的存储器_正品采购_价格信息

品牌是'IDT' (6623)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	Contact plating	底架	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量					Connector pinout layout	Contacts pitch	Electrical mounting	Gross weight		Kind of connector						厂商																				Row pitch	Spatial orientation		Type of connector			Operating temperature	操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	ECCN 代码	类型	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	最大功率耗散	技术	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	Current rating	频率	时间@峰值回流温度-最大值(s)	频率稳定性	JESD-30代码	最大电流源	输出的数量	资历状况	输出电压	输出类型		极性	电源	温度等级	通道数量	电路数量	内存大小	工作电源电流	端口的数量	操作模式	输出电流	静态电流	电源电流-最大值	准确性	重置	访问时间	稳压器数	最小输入电压	压摆率	内存格式	内存接口	监测的电压数量	重置超时	共模拒绝率	最大输入电压	组织结构	输出特性	每个通道的输出电流	座位高度-最大	内存宽度	写入周期时间 - 字符、页面	压差电压	最小复位阈值电压	最大复位阈值电压	电源抑制比	待机电流-最大值	阈值电压	记忆密度	低电压阈值	过压阈值	噪音	筛选水平	并行/串行	I/O类型	内存IC类型	输入偏置电流	待机电压-最小值	最大结点温度（Tj）	Rated voltage
70V24L20JGI8	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	84-LCC (J-Lead)	84-PLCC (29.21x29.21)																	-40°C ~ 85°C (TA)	Tape & Reel (TR)	--			Preliminary										SRAM - Dual Port, Asynchronous	3 V ~ 3.6 V																	Volatile						64Kb (4K x 16)									20ns				SRAM	Parallel										20ns
IDT71256L35TDB	Integrated Device Technology (IDT)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	28				CERAMIC, GLASS-SEALED		DIP28,.3	-55 °C	20	35 ns	125 °C		无	IDT71256L35TDB	32768 words	5 V	DIP	RECTANGULAR	Integrated Device Technology Inc	活跃	INTEGRATED DEVICE TECHNOLOGY INC	5.08	DIP	Military grade							DIP, DIP28,.3			IN-LINE		1	32000					e0	无		3A001.A.2.C		Tin/Lead (Sn/Pb)				8542.32.00.41	SRAMs		CMOS		DUAL	THROUGH-HOLE	240	1	2.54 mm	not_compliant					R-GDIP-T28			不合格					5 V	MILITARY					1	ASYNCHRONOUS			0.12 mA													32KX8	3-STATE		5.08 mm	8						0.0005 A		262144 bit				MIL-STD-883 Class B	PARALLEL	COMMON	标准SRAM		2 V			5.5 V	4.5 V	YES					37.1475 mm	7.62 mm
70V9289L6PRF	Integrated Device Technology (IDT)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	128					PLASTIC/EPOXY		QFP128,.63X.87,20	PK128	未说明	6.5 ns	70 °C		无	70V9289L6PRF	100 MHz	65536 words	3.3 V	QFP	RECTANGULAR	Integrated Device Technology Inc	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	5.83	TQFP	集成设备技术									QFP, QFP128,.63X.87,20		FLATPACK	3					e0	无				Tin/Lead (Sn85Pb15)			FLOW-THROUGH OR PIPELINED ARCHITECTURE		SRAMs		CMOS		QUAD	鸥翼	225	1	0.5 mm	not_compliant					R-PQFP-G128			不合格			64000		3.3 V	COMMERCIAL					2	SYNCHRONOUS			0.28 mA													64KX16	3-STATE			16						0.002 A		1048576 bit					PARALLEL	COMMON	特殊应用Sram		3 V			3.6 V	3 V
709349L9BF	Integrated Device Technology (IDT)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100				PLASTIC/EPOXY		BGA100,10X10,32	BF100	未说明	20 ns	70 °C		无	709349L9BF	4096 words	5 V	LFBGA	SQUARE	Integrated Device Technology Inc	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	5.91	CABGA	集成设备技术							FPBGA-100			GRID ARRAY, LOW PROFILE, FINE PITCH		3	4000					e0	无		EAR99		Tin/Lead (Sn63Pb37)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs		CMOS		BOTTOM	BALL	225	1	0.8 mm	not_compliant					S-PBGA-B100			不合格					5 V	COMMERCIAL					2	SYNCHRONOUS			0.36 mA													4KX18	3-STATE		1.5 mm	18						0.003 A		73728 bit					PARALLEL	COMMON	DUAL-PORT SRAM		4.5 V			5.5 V	4.5 V						10 mm	10 mm
709359L7BFI	Integrated Device Technology (IDT)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100					PLASTIC/EPOXY		BGA100,10X10,32	BF100	-40 °C	未说明	18 ns		85 °C	无	709359L7BFI	8192 words	5 V	LFBGA	SQUARE	Integrated Device Technology Inc	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	5.91	CABGA	集成设备技术									FPBGA-100		GRID ARRAY, LOW PROFILE, FINE PITCH	3					e0	无		EAR99		Tin/Lead (Sn63Pb37)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs		CMOS		BOTTOM	BALL	225	1	0.8 mm	not_compliant					S-PBGA-B100			不合格			8000		5 V	INDUSTRIAL					2	SYNCHRONOUS			0.44 mA													8KX18	3-STATE		1.5 mm	18						0.003 A		147456 bit					PARALLEL	COMMON	DUAL-PORT SRAM		4.5 V			5.5 V	4.5 V						10 mm	10 mm
70V9169L7PFI	Integrated Device Technology (IDT)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100	16000					PLASTIC/EPOXY		QFP100,.63SQ,20	PN100	-40 °C	20	7.5 ns		85 °C	无	70V9169L7PFI	83 MHz	16384 words	3.3 V	LFQFP	SQUARE	Integrated Device Technology Inc	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	5.26	TQFP	集成设备技术										14 X 14 MM, 1.4 MM HEIGHT, TQFP-100	FLATPACK, LOW PROFILE, FINE PITCH					e0	无		EAR99		Tin/Lead (Sn85Pb15)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs		CMOS		QUAD	鸥翼	240	1	0.5 mm	not_compliant					S-PQFP-G100			不合格			3		3.3 V	INDUSTRIAL					2	SYNCHRONOUS			0.28 mA													16KX9	3-STATE		1.4 mm	9						0.003 A		147456 bit					PARALLEL	COMMON	DUAL-PORT SRAM		3 V			3.6 V	3 V						14 mm	14 mm
7024S35JI	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	表面贴装	84-LCC (J-Lead)	84-PLCC (29.21x29.21)	Volatile																-40°C ~ 85°C (TA)	Tape & Reel (TR)	--			Obsolete				85 °C	-40 °C					SRAM - Dual Port, Asynchronous	4.5 V ~ 5.5 V								150 MHz		50 ppm		105 mA					Compliant						64Kb (4K x 16)									35ns				SRAM	Parallel										35ns																									838.2 µm	7.0104 mm	5.0038 mm
7005L45JI	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	68-LCC (J-Lead)	20	68-PLCC (24.21x24.21)	Volatile																-40°C ~ 85°C (TA)	Tube	--			Obsolete				85 °C	-40 °C					SRAM - Dual Port, Asynchronous	4.5 V ~ 5.5 V																	Non-Compliant						64Kb (8K x 8)									45ns				SRAM	Parallel										45ns																			5.5 V	2.9 V
70V27L15PFI/2703	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 4 months ago)	表面贴装	表面贴装	100-LQFP	6	100-TQFP (14x14)	Compliant	无		Volatile													-40°C ~ 85°C (TA)	Tray	--			Obsolete				85 °C	-40 °C				727 mW	SRAM - Dual Port, Asynchronous	3 V ~ 3.6 V													1		1.6 V	固定式	PRODUCTION (Last Updated: 1 week ago)	Positive					512Kb (32K x 16)				300 mA	140 µA		0.5 %		15ns	1	1.62 V		SRAM	Parallel				3.6 V						15ns	100 mV									86							150 °C		3.6 V	2.12 V					1.1 mm
71342LA45JI8	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	表面贴装	52-LCC (J-Lead)	5	52-PLCC (19.13x19.13)	Compliant	Volatile															-40°C ~ 85°C (TA)	Tape & Reel (TR)	--			Obsolete				125 °C	-40 °C				571 mW	SRAM - Dual Port, Asynchronous	4.5 V ~ 5.5 V																	无						32Kb (4K x 8)									45ns				SRAM	Parallel										45ns																			5.5 V	1 V									无
71V321L55TFI8	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	表面贴装	64-LQFP	5	64-TQFP (10x10)	PRODUCTION (Last Updated: 1 month ago)	Volatile															-40°C ~ 85°C (TA)	Tape & Reel (TR)	--			Obsolete				125 °C	-40 °C				571 mW	SRAM - Dual Port, Asynchronous	3 V ~ 3.6 V																	Compliant				1	1	16Kb (2K x 8)							0.5 %		55ns			10 V/µs	SRAM	Parallel			90 dB				1 mA			55ns				90 dB											120 µA				28 V	3 V
70261S35PFI8	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	表面贴装	100-LQFP	4	100-TQFP (14x14)	Compliant	Volatile															-40°C ~ 85°C (TA)	Tape & Reel (TR)	--			Obsolete		Simple Reset/Power-On Reset		125 °C	-40 °C				320 mW	SRAM - Dual Port, Asynchronous	4.5 V ~ 5.5 V																	无						256Kb (16K x 16)	5 µA							低电平有效	35ns				SRAM	Parallel	1	1 ms								35ns		3.025 V	3.135 V			3.08 V		3.025 V	3.135 V										5.5 V	1 V											无铅
IDT70V3319S133PRFGI	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	128	-40 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87	RECTANGULAR		FLATPACK, LOW PROFILE, FINE PITCH	有	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	QFP	LFQFP, QFP128,.63X.87	3.3 V							4.2 ns	133 MHz	262144 words	256000								85 °C					e3	有		3A991.B.2.A		Matte Tin (Sn) - annealed			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41					QUAD	鸥翼	260	1	0.5 mm	compliant			30		R-PQFP-G128			不合格						INDUSTRIAL					2	SYNCHRONOUS			0.4 mA													256KX18	3-STATE		1.6 mm	18						0.04 A		4718592 bit					PARALLEL	COMMON	MULTI-PORT SRAM		3.15 V			3.45 V	3.15 V			3			20 mm	14 mm
IDT70V7278S15PF	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	100	100	2x15	2.54mm	THT	1.38 g	female	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V	socket						无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	QFP	TQFP-100	15 ns	32768 words	32000	2.54mm	straight	70 °C	pin strips	PLASTIC/EPOXY		-40...163°C				e0			3A991.B.2.B		Tin/Lead (Sn85Pb15)				8542.32.00.41					QUAD	鸥翼	240	1	0.5 mm	not_compliant	1.5A		20		S-PQFP-G100			不合格			LFQFP			COMMERCIAL					2	ASYNCHRONOUS			0.28 mA													32KX16	3-STATE		1.6 mm	16						0.006 A		524288 bit					PARALLEL	COMMON	MULTI-PORT SRAM		3.14 V		60V	3.465 V	3.135 V		beryllium copper	3			14 mm	14 mm	0.254µm		UL94V-0
71256L25Y	IDT	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	28-BSOJ (0.300, 7.62mm Width)	YES	28	28-SOJ	28		0.300 INCH, SOJ-28		小概要	未说明	32000	PLASTIC/EPOXY	30	IDT, Integrated Device Technology Inc	25 ns	70 °C	无	71256L25Y	32768 words	5 V	SOJ	RECTANGULAR	Rochester Electronics LLC	活跃	ROCHESTER ELECTRONICS LLC	5.69	SOJ				Bulk	71256L	活跃			Volatile					0°C ~ 70°C (TA)		-	e0	无				锡铅							SRAM - Asynchronous	4.5V ~ 5.5V	DUAL	J BEND	225	1	1.27 mm	unknown					R-PDSO-J28			COMMERCIAL						COMMERCIAL			256Kbit			ASYNCHRONOUS						25 ns				SRAM	Parallel					32KX8			3.556 mm	8	25ns							262144 bit					PARALLEL		标准SRAM					5.5 V	4.5 V				32K x 8		17.9324 mm	7.5184 mm
IDT7188L45C	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	22	22	16000	70 °C	CERAMIC, METAL-SEALED COFIRED		DIP	DIP22,.3	RECTANGULAR	IN-LINE	5 V							无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	DIP							0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22			45 ns					e0	无		EAR99		锡铅				8542.32.00.41					DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant					R-CDIP-T22			不合格			16384 words			COMMERCIAL					1	ASYNCHRONOUS			0.1 mA													16KX4	3-STATE		5.08 mm	4						0.00015 A		65536 bit					PARALLEL	COMMON	标准SRAM		2 V			5.5 V	4.5 V	NO					27.432 mm	7.62 mm
IDT7130SA70L52	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	52	52	1000	1024 words	70 ns		LCC-52	LCC	INTEGRATED DEVICE TECHNOLOGY INC	Obsolete	无							LCC52,.75SQ	SQUARE	CHIP CARRIER	5 V							QCCN			CERAMIC, METAL-SEALED COFIRED					e0	无		EAR99		锡铅			INTERRUPT FLAG; AUTOMATIC POWER-DOWN	8542.32.00.41					QUAD	无铅		1	1.27 mm	not_compliant					S-CQCC-N52			不合格			70 °C			COMMERCIAL					2	ASYNCHRONOUS			0.18 mA													1KX8	3-STATE		2.2098 mm	8						0.015 A		8192 bit					PARALLEL	COMMON	MULTI-PORT SRAM		4.5 V			5.5 V	4.5 V	YES					19.05 mm	19.05 mm
IDT71982S25C	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	28	16000	70 °C	CERAMIC, METAL-SEALED COFIRED		DIP	DIP28,.4	RECTANGULAR	IN-LINE	5 V							无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	DIP							0.400 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28			25 ns					e0	无		EAR99		锡铅				8542.32.00.41					DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant					R-CDIP-T28			不合格			16384 words			COMMERCIAL					1	ASYNCHRONOUS			0.135 mA													16KX4	3-STATE		5.08 mm	4						0.015 A		65536 bit					PARALLEL	SEPARATE	标准SRAM		4.5 V			5.5 V	4.5 V	YES					35.56 mm	10.16 mm
IDT6168SA20DB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	20	DIP20,.3	RECTANGULAR	IN-LINE	5 V		INTEGRATED DEVICE TECHNOLOGY INC	DIP	0.300 INCH, CERAMIC, DIP-20	20 ns	无	Obsolete							4096 words	4000	125 °C	-55 °C								CERAMIC, GLASS-SEALED						e0			3A001.A.2.C		锡铅				8542.32.00.41					DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant					R-GDIP-T20			不合格			DIP			MILITARY					1	ASYNCHRONOUS			0.12 mA													4KX4	3-STATE		5.08 mm	4								16384 bit				38535Q/M;38534H;883B	PARALLEL	COMMON	标准SRAM		4.5 V			5.5 V	4.5 V	NO					25.3365 mm	7.62 mm
IDT7164S30L28	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	28	28	8000	70 °C	CERAMIC, METAL-SEALED COFIRED		QCCN	LCC28,.45SQ	SQUARE	CHIP CARRIER	5 V							无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	QLCC							LCC-28			29 ns					e0	无		EAR99		锡铅				8542.32.00.41					QUAD	无铅		1	1.27 mm	not_compliant					S-CQCC-N28			不合格			8192 words			COMMERCIAL					1	ASYNCHRONOUS			0.16 mA													8KX8	3-STATE		2.54 mm	8						0.015 A		65536 bit					PARALLEL	COMMON	标准SRAM		4.5 V			5.5 V	4.5 V	YES					11.43 mm	11.43 mm
IDT7030LA25P	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	48	48	1000	70 °C	PLASTIC/EPOXY		DIP	DIP48,.6	RECTANGULAR	IN-LINE	5 V							无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	DIP							DIP, DIP48,.6			25 ns					e0	无		EAR99		锡铅			BATTERY BACK-UP	8542.32.00.41					DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant					R-PDIP-T48			不合格			1024 words			COMMERCIAL					2	ASYNCHRONOUS			0.18 mA													1KX8	3-STATE		5.08 mm	8						0.0015 A		8192 bit					PARALLEL	COMMON	MULTI-PORT SRAM		2 V			5.5 V	4.5 V						61.849 mm	15.24 mm
IDT70V3389S6PRFI	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	128		6 ns	83 MHz	3	65536 words	64000		85 °C	-40 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V							无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	QFP												e0	无		3A991.B.2.A		Tin/Lead (Sn85Pb15)			PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE	8542.32.00.41					QUAD	鸥翼	225	1	0.5 mm	not_compliant			30		R-PQFP-G128			不合格			PLASTIC, TQFP-128			INDUSTRIAL					2	SYNCHRONOUS			0.36 mA													64KX18	3-STATE		1.6 mm	18						0.03 A		1179648 bit					PARALLEL	COMMON	MULTI-PORT SRAM		3.15 V			3.45 V	3.15 V						20 mm	14 mm
IDT7130SA55PG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	48	48	70 °C	PLASTIC/EPOXY		DIP	RECTANGULAR	IN-LINE	5 V							有	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	DIP					GREEN, PLASTIC, DIP-48					55 ns	1024 words					e3			EAR99		哑光锡				8542.32.00.41					DUAL	THROUGH-HOLE		1	2.54 mm	compliant					R-PDIP-T48			不合格			1000			COMMERCIAL						ASYNCHRONOUS																1KX8			5.08 mm	8								8192 bit					PARALLEL		MULTI-PORT SRAM					5.5 V	4.5 V						61.849 mm	15.24 mm
IDT70T3399S133BCG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	256	GRID ARRAY, LOW PROFILE	2.5 V	128000	131072 words	3		133 MHz	4.2 ns	LBGA, BGA256,16X16,40	BGA	INTEGRATED DEVICE TECHNOLOGY INC	Transferred	有							70 °C	CERAMIC, METAL-SEALED COFIRED	LBGA	BGA256,16X16,40								SQUARE					e1	有		3A991.B.2.A		Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41					BOTTOM	BALL	260	1	1 mm	compliant			30		S-CBGA-B256			不合格						COMMERCIAL					2	SYNCHRONOUS			0.37 mA													128KX18	3-STATE		1.7 mm	18						0.015 A		2359296 bit					PARALLEL	COMMON	MULTI-PORT SRAM		2.4 V			2.6 V	2.4 V						17 mm	17 mm
IDT7132LA70L48B	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	48	2048 words	2000	125 °C	-55 °C		CERAMIC, METAL-SEALED COFIRED	QCCN	LCC48,.56SQ,40	SQUARE	CHIP CARRIER	5 V							无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	LCC								LCC-48						e0	无		3A001.A.2.C		锡铅			AUTOMATIC POWER-DOWN	8542.32.00.41					QUAD	无铅		1	1.016 mm	not_compliant					S-CQCC-N48			不合格			70 ns			MILITARY					2	ASYNCHRONOUS			0.18 mA													2KX8	3-STATE		3.048 mm	8						0.004 A		16384 bit				38535Q/M;38534H;883B	PARALLEL	COMMON	MULTI-PORT SRAM		2 V			5.5 V	4.5 V	YES					14.3002 mm	14.3002 mm