品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

Contact plating

表面安装

引脚数

终端数量

Connector pinout layout

Contacts pitch

Electrical mounting

Gross weight

Kind of connector

Row pitch

Spatial orientation

Type of connector

Operating temperature

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

Current rating

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

温度等级

端口的数量

操作模式

电源电流-最大值

组织结构

输出特性

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

筛选水平

并行/串行

I/O类型

内存IC类型

待机电压-最小值

Rated voltage

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

个人资料

饱和电流

长度

宽度

Plating thickness

Flammability rating

IDT71321SA45L52
IDT71321SA45L52
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

52

52

LCC

QCCN, LCC52,.75SQ

45 ns

2048 words

2000

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC52,.75SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

INTERRUPT FLAG; AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

S-CQCC-N52

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.19 mA

2KX8

3-STATE

2.2098 mm

8

0.015 A

16384 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

YES

19.05 mm

19.05 mm

IDT7165S45TCB
IDT7165S45TCB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

28

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, THIN, SIDE BRAZED, DIP-28

45 ns

8192 words

8000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T28

不合格

MILITARY

1

ASYNCHRONOUS

0.16 mA

8KX8

3-STATE

5.08 mm

8

0.02 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

35.56 mm

7.62 mm

IDT7143SA45GB
IDT7143SA45GB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

68

68

INTEGRATED DEVICE TECHNOLOGY INC

PGA

CERAMIC, PGA-68

45 ns

2048 words

2000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

PGA68,11X11

SQUARE

网格排列

5 V

Obsolete

e0

3A001.A.2.C

锡铅

AUTOMATIC POWER-DOWN

8542.32.00.41

PERPENDICULAR

PIN/PEG

1

2.54 mm

not_compliant

S-CPGA-P68

不合格

MILITARY

2

ASYNCHRONOUS

0.33 mA

2KX16

3-STATE

3.683 mm

16

0.004 A

32768 bit

MIL-PRF-38535

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

YES

29.464 mm

29.464 mm

IDT70V3389S6PRFI
IDT70V3389S6PRFI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

128

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, TQFP-128

6 ns

83 MHz

3

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

e0

3A991.B.2.A

Tin/Lead (Sn85Pb15)

PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE

8542.32.00.41

QUAD

鸥翼

225

1

0.5 mm

not_compliant

30

R-PQFP-G128

不合格

INDUSTRIAL

2

SYNCHRONOUS

0.36 mA

64KX18

3-STATE

1.6 mm

18

0.03 A

1179648 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3.15 V

3.45 V

3.15 V

20 mm

14 mm

IDT7188L45C
IDT7188L45C
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

22

22

DIP

0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22

45 ns

16384 words

16000

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP22,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T22

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.1 mA

16KX4

3-STATE

5.08 mm

4

0.00015 A

65536 bit

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

NO

27.432 mm

7.62 mm

IDT70V9289L6PRFG
IDT70V9289L6PRFG
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

128

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, GREEN, TQFP-128

15 ns

100 MHz

3

65536 words

64000

70 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

e3

3A991.B.2.B

Matte Tin (Sn) - annealed

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

260

1

0.5 mm

unknown

30

R-PQFP-G128

不合格

COMMERCIAL

2

SYNCHRONOUS

0.28 mA

64KX16

3-STATE

1.6 mm

16

0.002 A

1048576 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

20 mm

14 mm

IDT7198L85CB
IDT7198L85CB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

24

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, SIDE BRAZED, DIP-24

85 ns

16384 words

16000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T24

不合格

MILITARY

1

ASYNCHRONOUS

0.105 mA

16KX4

3-STATE

5.08 mm

4

0.0006 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

30.607 mm

7.62 mm

IDT71322S70C
IDT71322S70C
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

48

48

DIP

0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-48

70 ns

2048 words

2000

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP48,.6

RECTANGULAR

IN-LINE

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

备用电池操作

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T48

不合格

COMMERCIAL

2

ASYNCHRONOUS

2KX8

3-STATE

4.826 mm

8

0.015 A

16384 bit

PARALLEL

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

60.96 mm

15.24 mm

IDT7130SA20PFG
IDT7130SA20PFG
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

64

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP64,.66SQ,32

20 ns

3

1024 words

1000

70 °C

PLASTIC/EPOXY

LQFP

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

5 V

Transferred

e3

EAR99

Matte Tin (Sn) - annealed

8542.32.00.41

QUAD

鸥翼

260

1

0.8 mm

compliant

30

S-PQFP-G64

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.25 mA

1KX8

3-STATE

1.6 mm

8

0.015 A

8192 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

14 mm

14 mm

IDT7025L55PFB
IDT7025L55PFB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

100

SQUARE

LFQFP

PLASTIC/EPOXY

-55 °C

125 °C

8000

8192 words

3

55 ns

LFQFP,

QFP

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

5 V

FLATPACK, LOW PROFILE, FINE PITCH

e0

3A001.A.2.C

Tin/Lead (Sn85Pb15)

CONFIGURABLE AS 8K X 16

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

20

S-PQFP-G100

不合格

MILITARY

ASYNCHRONOUS

8KX16

1.6 mm

16

131072 bit

MIL-PRF-38535

PARALLEL

DUAL-PORT SRAM

5.5 V

4.5 V

14 mm

14 mm

IDT71321SA55L52
IDT71321SA55L52
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

52

52

LCC

QCCN, LCC52,.75SQ

55 ns

2048 words

2000

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC52,.75SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

INTERRUPT FLAG; AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

S-CQCC-N52

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.18 mA

2KX8

3-STATE

2.2098 mm

8

0.015 A

16384 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

YES

19.05 mm

19.05 mm

IDT6168SA20DB
IDT6168SA20DB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

20

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, CERAMIC, DIP-20

20 ns

Obsolete

4096 words

4000

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-GDIP-T20

不合格

MILITARY

1

ASYNCHRONOUS

0.12 mA

4KX4

3-STATE

5.08 mm

4

16384 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

NO

25.3365 mm

7.62 mm

IDT7132LA70L48B
IDT7132LA70L48B
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

48

48

INTEGRATED DEVICE TECHNOLOGY INC

LCC

LCC-48

70 ns

2048 words

2000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC48,.56SQ,40

SQUARE

CHIP CARRIER

5 V

Obsolete

e0

3A001.A.2.C

锡铅

AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

无铅

1

1.016 mm

not_compliant

S-CQCC-N48

不合格

MILITARY

2

ASYNCHRONOUS

0.18 mA

2KX8

3-STATE

3.048 mm

8

0.004 A

16384 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

YES

14.3002 mm

14.3002 mm

IDT71V256SB12Y
IDT71V256SB12Y
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

28

INTEGRATED DEVICE TECHNOLOGY INC

SOJ

SOJ, SOJ28,.34

12 ns

3

32768 words

32000

70 °C

PLASTIC/EPOXY

SOJ

SOJ28,.34

RECTANGULAR

小概要

3.3 V

Obsolete

e0

EAR99

Tin/Lead (Sn85Pb15)

8542.32.00.41

DUAL

J BEND

225

1

1.27 mm

not_compliant

30

R-PDSO-J28

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.09 mA

32KX8

3-STATE

3.556 mm

8

0.002 A

262144 bit

PARALLEL

COMMON

CACHE TAG SRAM

3 V

3.6 V

3 V

YES

17.9324 mm

7.5184 mm

IDT7142LA70P
IDT7142LA70P
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

48

48

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.600 INCH, PLASTIC, DIP-48

70 ns

2048 words

2000

70 °C

PLASTIC/EPOXY

DIP

DIP48,.6

RECTANGULAR

IN-LINE

5 V

Obsolete

e0

EAR99

Tin/Lead (Sn85Pb15)

AUTOMATIC POWER-DOWN

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-PDIP-T48

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.135 mA

2KX8

3-STATE

5.08 mm

8

0.0015 A

16384 bit

MIL-STD-883 Class B (Modified)

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

YES

61.849 mm

15.24 mm

IDT70V9279S15PRF
IDT70V9279S15PRF
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

128

32768 words

32000

70 °C

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, TQFP-128

30 ns

40 MHz

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

3

e0

EAR99

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

225

1

0.5 mm

not_compliant

30

R-PQFP-G128

不合格

COMMERCIAL

2

SYNCHRONOUS

0.22 mA

32KX16

3-STATE

1.6 mm

16

0.005 A

524288 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

20 mm

14 mm

IDT7130SA70L52
IDT7130SA70L52
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

52

52

5 V

QCCN

CERAMIC, METAL-SEALED COFIRED

70 °C

1000

1024 words

70 ns

LCC-52

LCC

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

LCC52,.75SQ

SQUARE

CHIP CARRIER

e0

EAR99

锡铅

INTERRUPT FLAG; AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

S-CQCC-N52

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.18 mA

1KX8

3-STATE

2.2098 mm

8

0.015 A

8192 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

YES

19.05 mm

19.05 mm

IDT7164S30L28
IDT7164S30L28
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

28

QLCC

LCC-28

29 ns

8192 words

8000

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC28,.45SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

S-CQCC-N28

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.16 mA

8KX8

3-STATE

2.54 mm

8

0.015 A

65536 bit

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

11.43 mm

11.43 mm

IDT7030LA25P
IDT7030LA25P
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

48

48

DIP

DIP, DIP48,.6

25 ns

1024 words

1000

70 °C

PLASTIC/EPOXY

DIP

DIP48,.6

RECTANGULAR

IN-LINE

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

BATTERY BACK-UP

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-PDIP-T48

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.18 mA

1KX8

3-STATE

5.08 mm

8

0.0015 A

8192 bit

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

61.849 mm

15.24 mm

IDT70V7278S15PF
IDT70V7278S15PF
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

gold-plated

YES

100

100

2x15

2.54mm

THT

1.38 g

QFP

female

TQFP-100

15 ns

32768 words

32000

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

socket

Obsolete

2.54mm

straight

INTEGRATED DEVICE TECHNOLOGY INC

pin strips

-40...163°C

e0

3A991.B.2.B

Tin/Lead (Sn85Pb15)

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

1.5A

20

S-PQFP-G100

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.28 mA

32KX16

3-STATE

1.6 mm

16

0.006 A

524288 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3.14 V

60V

3.465 V

3.135 V

beryllium copper

3

14 mm

14 mm

0.254µm

UL94V-0

IDT70V3319S133PRFGI
IDT70V3319S133PRFGI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

128

133 MHz

262144 words

256000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP, QFP128,.63X.87

3.3 V

4.2 ns

e3

3A991.B.2.A

Matte Tin (Sn) - annealed

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

260

1

0.5 mm

compliant

30

R-PQFP-G128

不合格

INDUSTRIAL

2

SYNCHRONOUS

0.4 mA

256KX18

3-STATE

1.6 mm

18

0.04 A

4718592 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3.15 V

3.45 V

3.15 V

3

20 mm

14 mm

IDT7164L45L32
IDT7164L45L32
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

32

QFJ

LCC-32

45 ns

8192 words

8000

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

R-CQCC-N32

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.12 mA

8KX8

3-STATE

3.048 mm

8

0.00006 A

65536 bit

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

13.97 mm

11.43 mm

6116L150DB
6116L150DB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

16

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, CERAMIC, DIP-16

150 ns

2048 words

2000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

5 V

Obsolete

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T16

不合格

MILITARY

ASYNCHRONOUS

0.08 mA

2KX8

3-STATE

5.08 mm

8

0.0003 A

16384 bit

MIL-STD-883 Class B

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

20.066 mm

7.62 mm

IDT7198L55CB
IDT7198L55CB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

24

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, SIDE BRAZED, DIP-24

55 ns

16384 words

16000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T24

不合格

MILITARY

1

ASYNCHRONOUS

0.11 mA

16KX4

3-STATE

5.08 mm

4

0.0006 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

30.607 mm

7.62 mm

IDT70V9169L7PF
IDT70V9169L7PF
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

100

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-64

18 ns

83 MHz

3

16384 words

16000

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

e0

EAR99

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

20

S-PQFP-G100

不合格

COMMERCIAL

2

SYNCHRONOUS

0.28 mA

16KX9

3-STATE

1.6 mm

9

0.003 A

147456 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

14 mm

14 mm