品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 5SEE9H40I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 活跃 | INTEL CORP | HBGA-1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 696 | 不合格 | INDUSTRIAL | 696 | 31700 CLBS | 3.9 mm | 现场可编程门阵列 | 31700 | 840000 | 45 mm | 45 mm | |||||||||||
![]() | 10M04DCU324C7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | UBGA-324 | 85 °C | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B324 | 246 | 商业扩展 | 246 | 250 CLBS | 1.55 mm | 现场可编程门阵列 | 250 | 4000 | 15 mm | 15 mm | |||||||||||
![]() | EP1C12F256C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | BGA, | 275 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||
![]() | EP1SGX25CF672C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | Obsolete | INTEL CORP | BGA, | 6 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 455 | 不合格 | OTHER | 455 | 2566 CLBS | 3.5 mm | 现场可编程门阵列 | 7.49 ns | 27 mm | 27 mm | ||||||||||
![]() | 10M25SAE144A7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 活跃 | INTEL CORP | QFP-144 | 125 °C | -40 °C | PLASTIC/EPOXY | HLFQFP | HQFP144,.87SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3 V | 2.85 V | 3.15 V | 有 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | 未说明 | S-PQFP-G144 | 360 | AUTOMOTIVE | 360 | 1563 CLBS | 1.65 mm | 现场可编程门阵列 | 1563 | 25000 | 20 mm | 20 mm | |||||||||
![]() | 5CGXFC7D6F27C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | INTEL CORP | ROHS COMPLIANT, FBGA-672 | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B672 | 336 | 不合格 | OTHER | 336 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 149500 | 27 mm | 27 mm | |||||||||||
![]() | 1SG280HU3F50E3VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | INTEL CORP | , | Obsolete | 8542.39.00.01 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||
![]() | EP1S80F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1203 | 不合格 | 1203 | 7904 CLBS | 现场可编程门阵列 | |||||||||||||||||
![]() | EP1C20F324C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 19 mm | 19 mm | ||||||||||||||
![]() | EP1C12F256I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | 17 X 17 MM, 1.00 MM PITCH, LEAD FREE, FBGA-256 | 275 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||
![]() | EP2SGX30DF780I3N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 | 622.08 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 361 | 不合格 | INDUSTRIAL | 361 | 33880 CLBS | 3.5 mm | 现场可编程门阵列 | 2.99 ns | 33880 | 33380 | 29 mm | 29 mm | |||||||
![]() | EP1M120B484C8A | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C20F400C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 21 mm | 21 mm | ||||||||||||||
![]() | EP4CE75F29 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.24 V | 1.16 V | 1.2 V | 活跃 | INTEL CORP | FBGA-780 | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 47 CLBS | 2.4 mm | 现场可编程门阵列 | 47 | 29 mm | 29 mm | |||||||||||||||||||
![]() | EP1C12F324I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 19 mm | 19 mm | ||||||||||||||
![]() | EP1S30F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 3247 | 32470 | 40 mm | 40 mm | ||||||||||||||
![]() | EP4SE820F43C2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | BGA1760,42X42,40 | SQUARE | 网格排列 | 活跃 | INTEL CORP | FBGA-1760 | 85 °C | PLASTIC/EPOXY | BGA | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | OTHER | 325220 CLBS | 3.7 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | ||||||||||||||||||||
![]() | EP2S60F484I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 活跃 | INTEL CORP | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 326 | 不合格 | 334 | 现场可编程门阵列 | 60440 | |||||||||||||||
![]() | EP1SGX10DF672C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | INTEL CORP | BGA, | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 不合格 | OTHER | 3.5 mm | 现场可编程门阵列 | 27 mm | 27 mm | |||||||||||||||
![]() | EP2SGX30DF780I5N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 | 622.08 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 361 | 不合格 | INDUSTRIAL | 361 | 33880 CLBS | 3.5 mm | 现场可编程门阵列 | 4.006 ns | 33880 | 33380 | 29 mm | 29 mm | |||||||
![]() | EP1C3T144I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | INTEL CORP | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | 275 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | ||||||||||||||
![]() | EP3SL110F780I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | 100 °C | -40 °C | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 488 | 不合格 | 488 | 4300 CLBS | 现场可编程门阵列 | 4300 | 107500 | ||||||||||||
![]() | EP1C12F256I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||
![]() | EP1C12Q240I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | INTEL CORP | 34.60 X 34.60 MM, 0.50 PITCH, PLASTIC, LEAD FREE, QFP-240 | 275 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 12060 CLBS | 4.1 mm | 现场可编程门阵列 | 12060 | 32 mm | 32 mm | ||||||||||||||
![]() | 5CEBA7F23C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 网格排列 | SQUARE | BGA484,22X22,40 | BGA | PLASTIC/EPOXY | 85 °C | ROHS COMPLIANT, FBGA-484 | INTEL CORP | 活跃 | 1.1 V | 1.07 V | 1.13 V | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 240 | OTHER | 240 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm |
5SEE9H40I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M04DCU324C7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25CF672C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M25SAE144A7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC7D6F27C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280HU3F50E3VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S80F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F324C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2SGX30DF780I3N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M120B484C8A
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F400C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE75F29
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F324I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SE820F43C2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S60F484I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX10DF672C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2SGX30DF780I5N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL110F780I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12Q240I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA7F23C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
