品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP4SE820H35C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA1152,34X34,40 | SQUARE | 网格排列 | 活跃 | INTEL CORP | FBGA-1152 | 85 °C | PLASTIC/EPOXY | BGA | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | 325220 CLBS | 3.7 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | ||||||||||||||||||||
![]() | EP1S60F1508I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | BGA, | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1022 | 不合格 | 1022 | 5712 CLBS | 现场可编程门阵列 | |||||||||||||||||
![]() | EP1M120B484C8A | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C12F256C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | BGA, | 275 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||
![]() | EP1SGX25CF672C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | Obsolete | INTEL CORP | BGA, | 6 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 455 | 不合格 | OTHER | 455 | 2566 CLBS | 3.5 mm | 现场可编程门阵列 | 7.49 ns | 27 mm | 27 mm | ||||||||||
![]() | 10M25SAE144A7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 活跃 | INTEL CORP | QFP-144 | 125 °C | -40 °C | PLASTIC/EPOXY | HLFQFP | HQFP144,.87SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3 V | 2.85 V | 3.15 V | 有 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | 未说明 | S-PQFP-G144 | 360 | AUTOMOTIVE | 360 | 1563 CLBS | 1.65 mm | 现场可编程门阵列 | 1563 | 25000 | 20 mm | 20 mm | |||||||||
![]() | EP2SGX90FF1508I3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 622.08 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 650 | 不合格 | INDUSTRIAL | 650 | 90960 CLBS | 3.5 mm | 现场可编程门阵列 | 2.99 ns | 90960 | 90960 | 40 mm | 40 mm | |||||||
![]() | EP4CGX110DF23C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 活跃 | INTEL CORP | LEAD FREE, FBGA-484 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 270 | OTHER | 270 | 6839 CLBS | 2.4 mm | 现场可编程门阵列 | 23 mm | 23 mm | ||||||||||||||||
![]() | EP1SGX40GF1020C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | INTEL CORP | BGA, | 5.37 MHz | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 624 | 不合格 | OTHER | 624 | 4125 CLBS | 3.5 mm | 现场可编程门阵列 | 8.245 ns | 33 mm | 33 mm | |||||||||||
![]() | EP4SGX290KF43I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | INTEL CORP | LEAD FREE, FBGA-1760 | 800 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | 880 | 880 | 11648 CLBS | 3.5 mm | 现场可编程门阵列 | 116480 | 42.5 mm | 42.5 mm | ||||||||||||||
![]() | EP3C25U256I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 活跃 | INTEL CORP | LFBGA, BGA256,16X16,32 | 100 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B256 | 156 | 不合格 | 156 | 1539 CLBS | 1.5 mm | 现场可编程门阵列 | 24624 | 14 mm | 14 mm | |||||||||||
![]() | EP1M350B780I6 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | INTEL CORP | 活跃 | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | EP1S25F1508C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 2566 | 25660 | 40 mm | 40 mm | ||||||||||||||
![]() | 5SEE9H40I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 活跃 | INTEL CORP | HBGA-1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 696 | 不合格 | INDUSTRIAL | 696 | 31700 CLBS | 3.9 mm | 现场可编程门阵列 | 31700 | 840000 | 45 mm | 45 mm | |||||||||||
![]() | 10M04DCU324C7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | UBGA-324 | 85 °C | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B324 | 246 | 商业扩展 | 246 | 250 CLBS | 1.55 mm | 现场可编程门阵列 | 250 | 4000 | 15 mm | 15 mm | |||||||||||
![]() | EP1C3T100C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | INTEL CORP | TFQFP, | 405 MHz | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 2910 CLBS | 1.2 mm | 现场可编程门阵列 | 2910 | 14 mm | 14 mm | ||||||||||||||
![]() | EP2SGX60EF1152I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | 622.08 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 534 | 不合格 | INDUSTRIAL | 534 | 60440 CLBS | 3.5 mm | 现场可编程门阵列 | 4.006 ns | 60440 | 60440 | 35 mm | 35 mm | |||||||
![]() | 1SG280HH3F55E2VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||
![]() | 5SGSMD3H3F35I4 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 432 | 不合格 | INDUSTRIAL | 432 | 8900 CLBS | 3.6 mm | 现场可编程门阵列 | 8900 | 236000 | 35 mm | 35 mm | |||||||||||
![]() | EP3SE260F780I4N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 有 | 接触制造商 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 480 | 不合格 | 488 | 现场可编程门阵列 | 255000 | |||||||||||||||||||||
![]() | 1SG280HH3F55E3VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||
![]() | EP1S80F1508I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | BGA, | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1203 | 不合格 | 1203 | 7904 CLBS | 现场可编程门阵列 | |||||||||||||||||
![]() | EP1C20F400C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 21 mm | 21 mm | ||||||||||||||
![]() | EP4CE75F29 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.24 V | 1.16 V | 1.2 V | 活跃 | INTEL CORP | FBGA-780 | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 47 CLBS | 2.4 mm | 现场可编程门阵列 | 47 | 29 mm | 29 mm | |||||||||||||||||||
![]() | EP3SL340F1152I3N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | PLASTIC | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 有 | 接触制造商 | INTEL CORP | BGA, BGA1152,34X34,40 | 100 MHz | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 736 | 不合格 | 744 | 现场可编程门阵列 | 337500 |
EP4SE820H35C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60F1508I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M120B484C8A
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25CF672C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M25SAE144A7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2SGX90FF1508I3
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CGX110DF23C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX40GF1020C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX290KF43I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C25U256I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M350B780I6
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F1508C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SEE9H40I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M04DCU324C7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T100C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2SGX60EF1152I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280HH3F55E2VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGSMD3H3F35I4
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE260F780I4N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280HH3F55E3VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S80F1508I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F400C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE75F29
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL340F1152I3N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
