品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 5CEFA9F31C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | INTEL CORP | ROHS COMPLIANT, FBGA-896 | 85 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B896 | 480 | 不合格 | OTHER | 480 | 11356 CLBS | 2 mm | 现场可编程门阵列 | 301000 | 31 mm | 31 mm | ||||||||||
![]() | EP4S100G5F45C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | LEAD FREE, FBGA-1932 | 800 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.95 V | 0.92 V | 0.98 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 781 | OTHER | 781 | 21248 CLBS | 3.6 mm | 现场可编程门阵列 | 212480 | 531200 | 45 mm | 45 mm | ||||||||||||
![]() | EP1C12F324I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | 19 X 19 MM, 1.0 MM PITCH, LEAD FREE, FBGA-324 | 275 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 19 mm | 19 mm | |||||||||||||
![]() | 10AX115S2F45I2VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||
![]() | HC20K1500BC652 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 652 | INTEL CORP | BGA, BGA652,35X35,50 | 85 °C | PLASTIC/EPOXY | BGA | BGA652,35X35,50 | SQUARE | 网格排列 | 1.89 V | 1.71 V | 1.8 V | 无 | 活跃 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-PBGA-B652 | 480 | 不合格 | OTHER | 480 | 现场可编程门阵列 | 5184 | 51840 | |||||||||||||
![]() | EP3SL340F1760I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 无 | 活跃 | INTEL CORP | BGA, BGA1760,42X42,40 | 100 MHz | 1 | 100 °C | -40 °C | PLASTIC | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | 1120 | 不合格 | 1120 | 13500 CLBS | 现场可编程门阵列 | 337500 | |||||||||||
![]() | EP1S30F672I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 活跃 | INTEL CORP | 35 X 35 MM, 1.27 MM PITCH, BGA-672 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 不合格 | 现场可编程门阵列 | 3247 | 32470 | 27 mm | 27 mm | |||||||||||||
![]() | 10AS057N4F40E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | FBGA-1517 | 100 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | OTHER | 588 | 21708 CLBS | 3.5 mm | 现场可编程门阵列 | 21708 | 570000 | 40 mm | 40 mm | ||||||||||||
![]() | EP3SE260F780I4N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 有 | 接触制造商 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 480 | 不合格 | 488 | 现场可编程门阵列 | 255000 | ||||||||||||||||||||
![]() | 5CGXFC7C6F23C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | INTEL CORP | ROHS COMPLIANT, FBGA-484 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B484 | 240 | 不合格 | OTHER | 240 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 149500 | 23 mm | 23 mm | ||||||||||
![]() | EP1S20F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | |||||||||||||
![]() | 5AGXBA7D4F31C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | INTEL CORP | FBGA-896 | 85 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 384 | 商业扩展 | 384 | 9168 CLBS | 2.7 mm | 现场可编程门阵列 | 9168 | 242000 | 31 mm | 31 mm | ||||||||||
![]() | EP1S60F1508C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | BGA, | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1022 | 不合格 | OTHER | 1022 | 5712 CLBS | 现场可编程门阵列 | ||||||||||||||||
![]() | EP3SL340F1152I3N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | PLASTIC | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 有 | 接触制造商 | INTEL CORP | BGA, BGA1152,34X34,40 | 100 MHz | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 736 | 不合格 | 744 | 现场可编程门阵列 | 337500 | ||||||||||||||||||||
![]() | EP3C40F484I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 活跃 | INTEL CORP | BGA, BGA484,22X22,40 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 331 | 不合格 | 331 | 2475 CLBS | 2.4 mm | 现场可编程门阵列 | 39600 | 23 mm | 23 mm | ||||||||||
![]() | EP2C8AF256C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | INTEL CORP | LEAD FREE, FBGA-256 | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.55 mm | 现场可编程门阵列 | 17 mm | 17 mm | ||||||||||||||||
![]() | EP4CGX75DF27 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.24 V | 1.16 V | 1.2 V | 活跃 | INTEL CORP | FBGA-672 | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 47 CLBS | 2.4 mm | 现场可编程门阵列 | 47 | 27 mm | 27 mm | ||||||||||||||||||
![]() | EP1S25F672I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 活跃 | INTEL CORP | 35 X 35 MM, 1.27 MM PITCH, BGA-672 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 473 | 不合格 | 473 | 2566 CLBS | 现场可编程门阵列 | 2566 | 25660 | 27 mm | 27 mm | ||||||||||
![]() | 5AGXMB5G4F35C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 622 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 544 | OTHER | 544 | 15849 CLBS | 2.7 mm | 现场可编程门阵列 | 35 mm | 35 mm | |||||||||||
![]() | EP3SL200H780I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 接触制造商 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | 100 °C | -40 °C | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 488 | 不合格 | 488 | 8000 CLBS | 现场可编程门阵列 | 8000 | 200000 | |||||||||||
![]() | 1SG280HH3F55E3VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant | 现场可编程门阵列 | ||||||||||||||||||||||||||||||||||||
![]() | 5CGXFC7D7F27I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | ROHS COMPLIANT, FBGA-672 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 336 | 336 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 27 mm | 27 mm | |||||||||||||||
![]() | EP1S60F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 1022 | 不合格 | OTHER | 1022 | 5712 CLBS | 现场可编程门阵列 | 5712 | 57120 | 40 mm | 40 mm | ||||||||||
![]() | 5AGZME5K2F40C4N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | FBGA-1517 | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 674 | OTHER | 674 | 15096 CLBS | 3.4 mm | 现场可编程门阵列 | 15096 | 400000 | 40 mm | 40 mm | ||||||||||
![]() | EP4S100G5F45C1N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | 85 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.98 V | 0.92 V | 0.95 V | 活跃 | INTEL CORP | LEAD FREE, FBGA-1932 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 781 | OTHER | 781 | 21248 CLBS | 3.6 mm | 现场可编程门阵列 | 212480 | 531200 | 45 mm | 45 mm |
5CEFA9F31C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5F45C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F324I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX115S2F45I2VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
HC20K1500BC652
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL340F1760I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F672I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS057N4F40E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE260F780I4N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC7C6F23C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA7D4F31C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60F1508C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL340F1152I3N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C40F484I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C8AF256C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CGX75DF27
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F672I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXMB5G4F35C5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL200H780I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280HH3F55E3VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC7D7F27I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGZME5K2F40C4N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5F45C1N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
