品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Contact plating | 安装类型 | 包装/外壳 | 表面安装 | Number of pins | 供应商器件包装 | 终端数量 | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Kind of connector | 厂商 | Row pitch | Spatial orientation | Type of connector | Operating temperature | 操作温度 | 系列 | JESD-609代码 | 端子表面处理 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | Current rating | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | LABs数量/ CLBs数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | Rated voltage | 个人资料 | 长度 | 宽度 | Plating thickness | Flammability rating | |||||||||||||||||||||
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![]() | 10M16DAU324C6G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 3.15 V | 2.85 V | 3 V | 活跃 | INTEL CORP | 85 °C | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B324 | 246 | 246 | 1000 CLBS | 1.55 mm | 现场可编程门阵列 | 1000 | 16000 | 15 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | EP4CE15F23 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.24 V | 1.16 V | 1.2 V | 活跃 | INTEL CORP | FBGA-484 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 47 CLBS | 2.4 mm | 现场可编程门阵列 | 47 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U23C8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | UBGA-672 | 85 °C | PLASTIC/EPOXY | FBGA | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.13 V | 1.07 V | 1.1 V | 无 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B672 | 145 | 不合格 | OTHER | 145 | 1.85 mm | 现场可编程门阵列 | 25000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | EP4CGX50DF23C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 活跃 | INTEL CORP | LEAD FREE, FBGA-484 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 290 | OTHER | 290 | 3118 CLBS | 2.4 mm | 现场可编程门阵列 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CGXFC7C6F23C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ROHS COMPLIANT, FBGA-484 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B484 | 240 | 不合格 | OTHER | 240 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 149500 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | EP1S20F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | 5AGXBA7D4F31C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | FBGA-896 | 85 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | INTEL CORP | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 384 | 商业扩展 | 384 | 9168 CLBS | 2.7 mm | 现场可编程门阵列 | 9168 | 242000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | EP1S60F1508C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | BGA, | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1022 | 不合格 | OTHER | 1022 | 5712 CLBS | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CGXFC7D6F27C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | ROHS COMPLIANT, FBGA-672 | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B672 | 336 | 不合格 | OTHER | 336 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 149500 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | 1SG280HU3F50E3VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | Obsolete | INTEL CORP | , | 8542.39.00.01 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CGXFC5C7F23A7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | ROHS COMPLIANT, FBGA-484 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 240 | AUTOMOTIVE | 240 | 2908 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1S80F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1203 | 不合格 | 1203 | 7904 CLBS | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C20F324C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C12F256I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 17 X 17 MM, 1.00 MM PITCH, LEAD FREE, FBGA-256 | 275 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F34E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | FBGA-1152 | 100 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 384 | OTHER | 384 | 10162 CLBS | 3.35 mm | 现场可编程门阵列 | 10162 | 270000 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | 5SGXMA4H2F35I3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | 无 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 552 | 不合格 | 552 | 15850 CLBS | 现场可编程门阵列 | 420000 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1SGX10DF672C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | BGA, | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 不合格 | OTHER | 3.5 mm | 现场可编程门阵列 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2SGX30DF780I5N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 | 622.08 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 361 | 不合格 | INDUSTRIAL | 361 | 33880 CLBS | 3.5 mm | 现场可编程门阵列 | 4.006 ns | 33880 | 33380 | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||
![]() | EP1C3T144I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | 275 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | EP4SE820F43C2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 85 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 活跃 | INTEL CORP | FBGA-1760 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | OTHER | 325220 CLBS | 3.7 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2S60F484I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | INTEL CORP | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 326 | 不合格 | 334 | 现场可编程门阵列 | 60440 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SG280LN2F43E2LG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 16 | 1760 | 2x8 | 2.54mm | 2018-08-08 | THT | 0.86 g | female | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | socket | 活跃 | INTEL CORP | 100 °C | 2.54mm | straight | PLASTIC/EPOXY | BGA | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 1.5A | S-PBGA-B1760 | 704 | OTHER | 704 | 344125 CLBS | 3.881 mm | 现场可编程门阵列 | 344125 | 2753000 | 60V | beryllium copper | 42.5 mm | 42.5 mm | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||
![]() | 1SG280LN2F43I2LG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 28 | 1760 | 2x14 | 2.54mm | 2018-08-08 | THT | 1.5 g | female | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | socket | 活跃 | 2.54mm | straight | INTEL CORP | 100 °C | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 1.5A | S-PBGA-B1760 | 704 | INDUSTRIAL | 704 | 344125 CLBS | 3.881 mm | 现场可编程门阵列 | 344125 | 2753000 | 60V | beryllium copper | 42.5 mm | 42.5 mm | 0.254µm | UL94V-0 | ||||||||||||||||||||||||||
![]() | EP2AGX95EF25I5N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 572 | 活跃 | INTEL CORP | 25 X 25 MM, LEAD FREE, MS-034, FBGA-572 | 500 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | HBGA | BGA572,24X24,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 0.93 V | 0.87 V | 0.9 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B572 | 260 | INDUSTRIAL | 260 | 3747 CLBS | 2.2 mm | 现场可编程门阵列 | 3747 | 89178 | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||||||
![]() | 5SGSMD8N2F45I3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) | Intel | 840 | Tray | 5SGSMD8 | 活跃 | -40°C ~ 100°C (TJ) | Stratix® V GS | 0.82V ~ 0.88V | 695000 | 51200000 | 262400 |
10M16DAU324C6G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE15F23
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CSEBA2U23C8
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CGX50DF23C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC7C6F23C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA7D4F31C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60F1508C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC7D6F27C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280HU3F50E3VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC5C7F23A7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S80F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F324C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS027H4F34E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGXMA4H2F35I3
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX10DF672C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2SGX30DF780I5N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SE820F43C2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S60F484I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LN2F43E2LG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LN2F43I2LG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGX95EF25I5N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGSMD8N2F45I3LG
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
