品牌是'Microchip' (371)
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![]() | MPF300-SPLASH-KIT | Microchip | 数据表 | 2945 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Knowles Syfer | Tape & Reel (TR) | 活跃 | FMC LPC/JTAG/SPI/UART/USB | Programmable Logic Tools | PCIex4 | DDR4 | This product may require additional documentation to export from the United States. | 1 | Microchip | 微芯片技术 | MPF300 | MPF300 | MPF300T-1FCG484E | * | 评估套件 | 开发工具 | 可编程逻辑集成电路开发工具 | FPGA | Board(s) | 有 | 1 USB2.0 | 无 | 评估套件 | PolarFire Splash Kit Brd MPF300TS-1FCG484EES, Adapter, 1Year S/W License, USB Cable, Quickstart Card | 可编程逻辑集成电路开发工具 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL-ICICLE-KIT | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | Obsolete | AGL125 | Bulk | IGLOO | FPGA | Board(s), Cable(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SF2-DEV-KIT-PP-1 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | Obsolete | SmartFusion®2 | Box | SmartFusion®2 | FPGA | Board(s), Cable(s), Power Supply, Programmer | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RTPF-DEV-KIT-CB-1 | Microchip | 数据表 | 860 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | RTPF500 | RTPF500T | Box | 活跃 | RT PolarFire® | FPGA + MCU/MPU SoC | - | Board(s), Cable(s), Power Supply, Accessories | Radiation-Tolerant PolarFire SoC FPGA | 开发套件 | FMC, Pmod | 免费 SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RTPF-DEV-KIT-CG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | RTPF500 | RTPF500T | Box | 活跃 | RT PolarFire® | FPGA + MCU/MPU SoC | - | Board(s), Cable(s), Power Supply, Accessories | Radiation-Tolerant PolarFire SoC FPGA | 开发套件 | FMC, Pmod | 免费 SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RTPF-DEV-KIT-CG-1 | Microchip | 数据表 | 958 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | RTPF500 | RTPF500T | Box | 活跃 | RT PolarFire® | FPGA + MCU/MPU SoC | - | Board(s), Cable(s), Power Supply, Accessories | Radiation-Tolerant PolarFire SoC FPGA | 开发套件 | FMC, Pmod | 免费 SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT17LV128-10CC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | ATMEL CORP | SOIC | SON, SOLCC8,.25 | 5.88 | 75 ns | 10 MHz | 3 | 131072 words | 128000 | 70 °C | UNSPECIFIED | SON | SOLCC8,.25 | SQUARE | 小概要 | 3.3 V | 30 | AT17LV128-10CC | 无 | Obsolete | e0 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | DUAL | 无铅 | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | 不合格 | 3.6 V | 3.3 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.005 mA | 128KX1 | 1.14 mm | 1 | 0.00005 A | 131072 bit | SERIAL | 配置存储器 | 5.99 mm | 5.99 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT17LV010-10SC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOP, SOP20,.4 | 5.82 | 15 MHz | 1 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 3.3 V | 30 | AT17LV010-10SC | 无 | Obsolete | ATMEL CORP | SOIC | e0 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | compliant | 20 | R-PDSO-G20 | 不合格 | 3.6 V | 3.3/5 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.01 mA | 1MX1 | 2.65 mm | 1 | 1048576 bit | SERIAL | 配置存储器 | HARDWARE | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005-VF256I | Microchip | 数据表 | 197 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFBGA-256 | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | N | Tray | M2GL005 | 活跃 | 1.14 V | M2GL005-VF256I | 无 | 活跃 | MICROSEMI CORP | LFBGA, | 5.27 | IC FPGA 161 I/O 256VFBGA | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 20 | 有 | 6060 LE | 161 I/O | + 100 C | 0.321234 oz | - 40 C | 119 | SMD/SMT | Microchip Technology / Atmel | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL005 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | - | 1.56 mm | 现场可编程门阵列 | 6060 | FPGA - Field Programmable Gate Array | 719872 | STD | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-FG256I | Microchip | 数据表 | 3000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 30 | 1.2 V | 1.14 V | 1.575 V | 网格排列 | SQUARE | BGA256,16X16,40 | BGA | PLASTIC/EPOXY | -40 °C | 85 °C | 3 | 350 MHz | 5.24 | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | MICROSEMI CORP | 活跃 | 无 | M1A3P1000L-FG256I | 1.2000 V | 1.14 V | 1.26 V | 177 | Tray | M1A3P1000 | 活跃 | -40 to 85 °C | ProASIC3L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FG676I | Microchip | 数据表 | 2947 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 40 | SMD/SMT | 7193 LAB | Microchip Technology / Atmel | N | - | 64 kB | 425 | Tray | M2S090 | 活跃 | 1.14 V | M2S090TS-1FG676I | 无 | 活跃 | MICROSEMI CORP | FBGA-676 | 5.29 | 3 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 有 | - | 166 MHz | 86316 LE | 1.071118 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090TS-FCS325 | Microchip | 数据表 | 2676 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | 180 | Tray | M2GL090 | 活跃 | 1.14 V | M2GL090TS-FCS325 | 无 | 活跃 | MICROSEMI CORP | BGA, BGA325,21X21,20 | 5.27 | 85 °C | PLASTIC/EPOXY | BGA | BGA325,21X21,20 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-FG256K | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | 微芯片技术 | GRID ARRAY, LOW PROFILE | 1.575 V | 1.5 V | 20 | 119 | Non-Compliant | Tray | M1AFS600 | 活跃 | 1.425 V | M1AFS600-FG256K | 无 | 活跃 | MICROSEMI CORP | LBGA, | 5.3 | 3 | 100 °C | -55 °C | PLASTIC/EPOXY | LBGA | SQUARE | -55°C ~ 100°C (TJ) | Fusion® | e0 | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | OTHER | 13.5 kB | 600000 GATES | 1.7 mm | 现场可编程门阵列 | 110592 | 600000 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FCS325I | Microchip | 数据表 | 2879 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | 微芯片技术 | M2S090-1FCS325I | 无 | 活跃 | MICROSEMI CORP | FBGA-325 | 5.77 | PLASTIC/EPOXY | TFBGA | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.26 V | 1.2 V | 30 | 180 | Tray | M2S090 | 活跃 | - | 166 MHz | 86316 LE | SMD/SMT | - | 64 kB | 1.14 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-1FCS536I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | 微芯片技术 | M2S150-1FCS536I | 无 | 活跃 | MICROSEMI CORP | BGA, BGA536,30X30,20 | 5.81 | PLASTIC/EPOXY | BGA | BGA536,30X30,20 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.2000 V | 293 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | - | 64 kB | 1.14 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | 293 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FG484 | Microchip | 数据表 | 2510 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 1.14 V | M2S060TS-1FG484 | 无 | 活跃 | MICROSEMI CORP | FBGA-484 | 5.84 | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | Non-Compliant | 267 | Tray | M2S060 | 活跃 | - | 166 MHz | 56520 LE | - | 64 kB | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-FG676I | Microchip | 数据表 | 2849 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | BGA, | 5.26 | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | 387 | Tray | 活跃 | M2GL060 | 56520 LE | + 100 C | - 40 C | SMD/SMT | 1.14 V | M2GL060T-FG676I | 无 | 活跃 | MICROSEMI CORP | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060TS-VF400 | Microchip | 数据表 | 2976 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | 5.26 | 85 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 20 | 207 | Tray | M2GL060 | 活跃 | 56520 LE | + 85 C | 0 C | SMD/SMT | 1.14 V | M2GL060TS-VF400 | 无 | 活跃 | MICROSEMI CORP | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 1.2 V | OTHER | 1.51 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150-FC1152I | Microchip | 数据表 | 2359 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | BGA, BGA1152,34X34,40 | 5.27 | FPGA - Field Programmable Gate Array IGLOO 2 | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | 1.2000 V | 1.14 V | 1.26 V | 574 | Tray | M2GL150 | 活跃 | 1.14 V | M2GL150-FC1152I | 无 | 活跃 | MICROSEMI CORP | -40 to 100 °C | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025T-VF400 | Microchip | 数据表 | 2739 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | SQUARE | BGA400,20X20,32 | LFBGA | PLASTIC/EPOXY | 85 °C | 5.3 | LFBGA, BGA400,20X20,32 | MICROSEMI CORP | 活跃 | 无 | M2GL025T-VF400 | 207 | Non-Compliant | Tray | M2GL025 | 活跃 | 27696 LE | + 85 C | 0 C | SMD/SMT | 1.14 V | 20 | 1.2 V | 1.26 V | GRID ARRAY, LOW PROFILE, FINE PITCH | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 1.2 V | OTHER | 138 kB | 207 | 1.51 mm | 现场可编程门阵列 | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-1FG484I | Microchip | 数据表 | 24 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 166 MHz | 6060 LE | SMD/SMT | - | 64 kB | 1.14 V | M2S005-1FG484I | 无 | 活跃 | MICROSEMI CORP | FBGA-484 | 5.86 | 3 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.2000 V | 1.14 V | 1.26 V | 209 | Tray | M2S005 | 活跃 | - | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 217 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 217 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-1VF400 | Microchip | 数据表 | 24 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | LFBGA, BGA400,20X20,32 | 5.3 | 85 °C | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 20 | 195 | Non-Compliant | Tray | M2GL010 | 活跃 | 12084 LE | + 85 C | 0 C | SMD/SMT | 1.14 V | M2GL010-1VF400 | 无 | 活跃 | MICROSEMI CORP | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 1 | 12084 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060-FG676I | Microchip | 数据表 | 2426 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 活跃 | MICROSEMI CORP | BGA, | 5.26 | FPGA - Field Programmable Gate Array IGLOO 2 | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | 387 | Tray | M2GL060 | 活跃 | 56520 LE | + 100 C | - 40 C | SMD/SMT | 1.14 V | M2GL060-FG676I | 无 | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | 现场可编程门阵列 | 56520 | 1869824 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-FG484I | Microchip | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | - | 64 kB | 1.14 V | M2S010T-FG484I | 无 | 活跃 | MICROSEMI CORP | FBGA-484 | 5.81 | 3 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.2000 V | Non-Compliant | 233 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-FCSG325I | Microchip | 数据表 | 2939 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | 64 kB | M2S050TS-FCSG325I | 有 | 活跃 | MICROSEMI CORP | FBGA-325 | 5.82 | 3 | PLASTIC/EPOXY | TFBGA | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.26 V | 1.14 V | 1.2 V | 40 | Non-Compliant | 200 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm |
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