N/A

-

Knowles Syfer

活跃

FMC LPC/JTAG/SPI/UART/USB

Programmable Logic Tools

PCIex4

DDR4

This product may require additional documentation to export from the United States.

1

Microchip

微芯片技术

MPF300

MPF300

MPF300T-1FCG484E

Tape & Reel (TR)

*

评估套件

开发工具

可编程逻辑集成电路开发工具

FPGA

Board(s)

有

1 USB2.0

无

评估套件

PolarFire Splash Kit Brd MPF300TS-1FCG484EES, Adapter, 1Year S/W License, USB Cable, Quickstart Card

可编程逻辑集成电路开发工具

N/A

-

微芯片技术

Bulk

Obsolete

AGL125

IGLOO

FPGA

Board(s), Cable(s)

N/A

-

微芯片技术

Box

Obsolete

SmartFusion®2

SmartFusion®2

FPGA

Board(s), Cable(s), Power Supply, Programmer

N/A

-

微芯片技术

RTPF500T

Box

活跃

RTPF500

RT PolarFire®

FPGA + MCU/MPU SoC

-

Board(s), Cable(s), Power Supply, Accessories

Radiation-Tolerant PolarFire SoC FPGA

开发套件

FMC, Pmod

免费 SoC

N/A

-

微芯片技术

RTPF500T

Box

活跃

RTPF500

RT PolarFire®

FPGA + MCU/MPU SoC

-

Board(s), Cable(s), Power Supply, Accessories

Radiation-Tolerant PolarFire SoC FPGA

开发套件

FMC, Pmod

免费 SoC

N/A

-

微芯片技术

RTPF500T

Box

活跃

RTPF500

RT PolarFire®

FPGA + MCU/MPU SoC

-

Board(s), Cable(s), Power Supply, Accessories

Radiation-Tolerant PolarFire SoC FPGA

开发套件

FMC, Pmod

免费 SoC

N/A

-

微芯片技术

Microchip

微芯片技术

M2S010-1VF256

Details

Bulk

活跃

M2S-HELLO

SmartFusion®2

1 lb

1

HELLO FPGA KIT

Bulk

FPGA

开发工具

可编程逻辑集成电路开发工具

FPGA

Board(s), Cable(s), Accessories

Hello FPGA Eval Kit

开发套件

Arduino R3 Shield, mikroBUS Click

-

FPGA Mainboard w/SmartFusion2 M2S010-1VF256, LI-0V7725-MICRO V1, LCD Brd, USB Cable, QuickStart Card

可编程逻辑集成电路开发工具

N/A

-

微芯片技术

Bulk

Obsolete

-

-

FPGA

Board(s)

N/A

-

微芯片技术

微芯片技术

MPFS250T-FCVG484EES

Icicle Kit

PolarFire SoC FPGA

Bulk

活跃

MPFS250T-FCVG484EES

MPFS-ICICLE

1

CAN, eMMC, I2C, mikroBUS, PCIe, SD Card, SGMII, UART, USB

Microchip

FPGA

开发工具

12 V

可编程逻辑集成电路开发工具

FPGA

Board(s), Cable(s), Power Supply

PolarFire SoC FPGA SiFive RISC-V Icicle Kit

开发套件

mikroBUS Click, Raspberry Pi HAT (40 pin)

免费 SoC

Dev Board MPFS250T-FCVG484EES

可编程逻辑集成电路开发工具

N/A

-

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73R2A

活跃

RTPF500T

-55°C ~ 155°C

RN73R

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.25%

2

±10ppm/°C

FPGA + MCU/MPU SoC

1.54 kOhms

Thin Film

0.125W, 1/8W

-

-

Board(s), Cable(s), Power Supply, Accessories

Radiation-Tolerant PolarFire SoC FPGA

开发套件

Automotive AEC-Q200, Moisture Resistant

FMC, Pmod

免费 SoC

0.024 (0.60mm)

AEC-Q200

N/A

-

NO

176

网格排列

5.5 V

5 V

未说明

4.5 V

Military grade

5962-9215602MXC

无

Obsolete

MICROSEMI CORP

PGA,

5.74

60 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

e0

3A001.A.2.C

锡铅

MAX 140 I/OS

8542.39.00.01

PERPENDICULAR

PIN/PEG

未说明

2.54 mm

compliant

S-CPGA-P176

不合格

MILITARY

8000 GATES

4.7498 mm

现场可编程门阵列

MIL-STD-883

5.2 ns

1232

8000

39.878 mm

39.878 mm

N/A

-

YES

8

3

2097152 words

2000000

85 °C

-40 °C

UNSPECIFIED

SON

SOLCC8,.25

SQUARE

小概要

3.3 V

30

AT17N002-10CI

无

Obsolete

ATMEL CORP

SOIC

SON, SOLCC8,.25

5.91

10 MHz

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.51

DUAL

无铅

240

1

1.27 mm

compliant

8

S-XDSO-N8

不合格

3.6 V

3.3 V

INDUSTRIAL

3 V

SYNCHRONOUS

0.005 mA

2MX1

1.14 mm

1

0.00015 A

2097152 bit

SERIAL

配置存储器

5.99 mm

5.99 mm

N/A

-

YES

8

3

1048576 words

1000000

85 °C

-40 °C

UNSPECIFIED

SON

SOLCC8,.25

SQUARE

小概要

3.3 V

30

AT17N010-10CI

无

Obsolete

ATMEL CORP

SOIC

SON, SOLCC8,.25

5.91

10 MHz

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.51

DUAL

无铅

240

1

1.27 mm

compliant

8

S-XDSO-N8

不合格

3.6 V

3.3 V

INDUSTRIAL

3 V

SYNCHRONOUS

0.005 mA

1MX1

1.14 mm

1

0.0001 A

1048576 bit

SERIAL

配置存储器

10 Write/Erase Cycles

20

5.99 mm

5.99 mm

N/A

-

YES

8

8000000

70 °C

UNSPECIFIED

SON

SOLCC8,.25

SQUARE

小概要

3.3 V

30

AT17F080-30CC

无

Obsolete

ATMEL CORP

SOIC

SON, SOLCC8,.25

5.71

33 MHz

3

8388608 words

e0

EAR99

NOR型号

Tin/Lead (Sn/Pb)

8542.32.00.51

DUAL

无铅

240

1

1.27 mm

compliant

8

S-XDSO-N8

不合格

3.63 V

3/3.3 V

COMMERCIAL

2.97 V

SYNCHRONOUS

0.02 mA

8MX1

1.14 mm

1

0.001 A

8388608 bit

SERIAL

配置存储器

0.03 ms

5.99 mm

5.99 mm

N/A

-

YES

8

1000000

70 °C

UNSPECIFIED

SON

SOLCC8,.25

SQUARE

小概要

3.3 V

30

AT17N010-10CC

无

Obsolete

ATMEL CORP

SOIC

SON, SOLCC8,.25

5.91

15 MHz

3

1048576 words

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.51

DUAL

无铅

240

1

1.27 mm

compliant

8

S-XDSO-N8

不合格

3.6 V

3.3 V

COMMERCIAL

3 V

SYNCHRONOUS

0.005 mA

1MX1

1.14 mm

1

0.0001 A

1048576 bit

SERIAL

配置存储器

10 Write/Erase Cycles

20

5.99 mm

5.99 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

60

Tray

AGLN060

Obsolete

1.14 V

-20 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.2 V

未说明

70 °C

5.81

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

MICROSEMI CORP

Obsolete

有

AGLN060V2-ZCSG81

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

18432

60000

1536

60000

5 mm

5 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.575 V

1.2 V

未说明

71

Tray

AGLN060

活跃

1.14 V

AGLN060V2-ZVQG100

有

不推荐

MICROSEMI CORP

TFQFP,

5.6

3

70 °C

-20 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

-20°C ~ 85°C (TJ)

IGLOO nano

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

30

71

Tray

A3PN125

Obsolete

1.425 V

A3PN125-ZVQ100I

无

Obsolete

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

5.32

3

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

-40°C ~ 100°C (TJ)

ProASIC3 nano

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

71

不合格

1.5,1.5/3.3 V

INDUSTRIAL

71

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

3072

3072

125000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.575 V

1.2 V

未说明

71

Tray

AGLN125

活跃

1.14 V

AGLN125V2-ZVQG100

有

不推荐

MICROSEMI CORP

TFQFP,

5.6

3

70 °C

-20 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

-20°C ~ 85°C (TJ)

IGLOO nano

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

14 mm

14 mm

N/A

-

YES

100

A1415A-VQG100M

有

Obsolete

MICROSEMI CORP

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

5.8

125 MHz

125 °C

-55 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

5.5 V

5 V

4.5 V

3A001.A.2.C

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

MILITARY

200 CLBS, 1500 GATES

1.2 mm

现场可编程门阵列

3 ns

200

1500

14 mm

14 mm

N/A

-

YES

144

有

AGL400V2-FGG144I

1.14 V

1.575 V

1.2 V

40

GRID ARRAY, LOW PROFILE

SQUARE

LBGA

PLASTIC/EPOXY

-40 °C

100 °C

3

8.61

LBGA,

MICROSEMI CORP

Obsolete

e1

锡银铜

8542.39.00.01

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

9216

400000

13 mm

13 mm

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

微芯片技术

85 °C

3

108 MHz

5.26

TFBGA,

MICROSEMI CORP

活跃

有

AGL1000V5-CSG281

1.5000 V

1.425 V

1.575 V

215

Tray

AGL1000

活跃

1.425 V

未说明

1.5 V

1.575 V

GRID ARRAY, THIN PROFILE, FINE PITCH

SQUARE

TFBGA

PLASTIC/EPOXY

0 to 70 °C

IGLOO

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

281

S-PBGA-B281

不合格

OTHER

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

10 mm

10 mm

N/A

-

YES

144

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

2.75 V

2.5 V

30

2.25 V

A54SX16A-1FG144M

无

Obsolete

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.31

263 MHz

3

125 °C

-55 °C

e0

3A001.A.2.C

Tin/Lead/Silver (Sn/Pb/Ag)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,2.5/5 V

MILITARY

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.2 ns

1452

1452

24000

13 mm

13 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (27X27)

484

微芯片技术

MICROSEMI CORP

BGA, BGA484,26X26,40

5.24

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,26X26,40

SQUARE

网格排列

2.75 V

2.5 V

30

2.5000 V

2.25 V

2.75 V

360

Tray

A54SX72

活跃

2.25 V

A54SX72A-1FG484I

无

活跃

-40 to 85 °C

SX-A

e0

Tin/Lead (Sn/Pb)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

360

不合格

2.5,3.3/5 V

INDUSTRIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1

1.3 ns

6036

6036

108000

27 mm

27 mm

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

Tray

AGL250

活跃

有

3000 LE

36864 bit

+ 85 C

0 C

160

SMD/SMT

Microchip Technology / Atmel

892.86 MHz

IGLOOe

Details

1.425 V

AGL250V5-FGG144

有

活跃

MICROSEMI CORP

LBGA,

1.37

108 MHz

3

85 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

40

1.5000 V

1.425 V

1.575 V

97

0 to 70 °C

Tray

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

OTHER

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

FPGA - Field Programmable Gate Array

36864

250000

STD

-

6144

250000

FPGA - Field Programmable Gate Array

1.05 mm

13 mm

13 mm