N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

+ 85 C

SMD/SMT

237 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.5 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-3PLG84I

129 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

1.9 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

153 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A42MX16

活跃

VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-VQG100A

139 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

83 I/O

4.75 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

5 V

AUTOMOTIVE

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

STD

2.2 ns

1232

24000

1 mm

14 mm

14 mm

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

SMD/SMT

350 MHz

有

微芯片技术

260

ProASIC3 nano

1.575 V

Tray

A3PN015

活跃

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LCC68,.32SQ,16

-40 °C

1.5 V

30

85 °C

有

A3PN015-1QNG68I

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.26

Details

49 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN015

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

49

不合格

1.5 V

1.5,1.5/3.3 V

INDUSTRIAL

1 mA

49

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

15000

1

384

384

15000

0.88 mm

8 mm

8 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

272 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

微芯片技术

77 I/O

N

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P030-1VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

ProASIC3

90

有

0 to 70 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

1

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

微芯片技术

有

90

Actel

0.014110 oz

Tray

AX250

活跃

1.575 V

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

40

70 °C

有

AX250-FGG256

649 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

138 I/O

0°C ~ 70°C (TA)

Tray

AX250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

1.7 mm

现场可编程门阵列

55296

250000

4224

0.99 ns

2816

4224

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

90

IGLOOe

1.5000 V

1.575 V

Tray

AGL030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL030V5-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.56

N

330 LE

77 I/O

-40 to 85 °C

Tray

AGL030V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

24

ProASIC3

1.575 V

Tray

A3P600

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P600-2PQ208I

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

5.25

N

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

-40°C ~ 100°C (TJ)

Tray

A3P600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

310 MHz

2

13824

13824

600000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

11000 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

272 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P1000-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

BGA-784

YES

784-FCBGA (29x29)

784

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

1

PolarFire

2.674354 oz

Tray

MPF200

活跃

1.03 V/1.08 V

BGA,

网格排列

4

PLASTIC/EPOXY

-40 °C

1 V

未说明

100 °C

有

MPF200T-FCG784I

BGA

SQUARE

活跃

MICROSEMI CORP

5.8

This product may require additional documentation to export from the United States.

Details

192000 LE

364 I/O

-40°C ~ 100°C (TJ)

Tray

MPF200T

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

0.97V ~ 1.08V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B784

1 V, 1.05 V

INDUSTRIAL

12.7 Gb/s

3.47 mm

现场可编程门阵列

192000

13619200

16 Transceiver

29 mm

29 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

0 C

+ 85 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

85 °C

有

M2GL090TS-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

86184 LE

425 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P250-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

A3PE3000-1FGG896

有

70 °C

40

1.5 V

PLASTIC/EPOXY

3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

0°C ~ 85°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

-

178 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

微芯片技术

350 MHz

有

90

ProASIC3

0.014110 oz

1.425 V

1.575 V

Tray

A3P400

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P400-FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.22

-40°C ~ 100°C (TJ)

Tray

A3P400

e0

3A001.A.7.B

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

STD

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

Tray

AFS250

活跃

This product may require additional documentation to export from the United States.

N

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

AFS250

70 °C

0 °C

1.425V ~ 1.575V

1.0989 GHz

1.5 V

1.575 V

1.425 V

4.5 kB

36864

250000

1.0989 GHz

STD

6144

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

CSP

YES

201-CSP (8x8)

201

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

348

IGLOO PLUS

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGLP030

活跃

VFBGA, BGA201,15X15,20

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA201,15X15,20

1.5 V

未说明

70 °C

有

AGLP030V2-CSG201

160 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

120 I/O

0 to 70 °C

Tray

AGLP030V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

201

S-PBGA-B201

120

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

120

792 CLBS, 30000 GATES

0.99 mm

现场可编程门阵列

792

30000

STD

792

792

30000

0.66 mm

8 mm

8 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

6500 LE

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

350 MHz

有

-

24

110592 bit

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

5 mA

700 Mb/s

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

STD

13824

600000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-536

YES

536-CSPBGA (16x16)

536

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

1

20.6 Mbit

PolarFire

1.08 V

Tray

MPF300

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1 V

100 °C

有

MPF300TL-FCSG536I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.79

This product may require additional documentation to export from the United States.

Details

300000 LE

300 I/O

0.97 V

-40°C ~ 100°C (TJ)

Tray

MPF300TL

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

0.97V ~ 1.08V

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B536

1 V, 1.05 V

INDUSTRIAL

12.5 Gb/s

1.45 mm

现场可编程门阵列

300000

21094400

4 Transceiver

16 mm

16 mm

5000 In Stock

-

24 Weeks

Tin

表面贴装

表面贴装

100-TQFP

100

80

Industrial grade

-40°C~85°C TC

Tray

1999

AT6000(LV)

e3

yes

活跃

3 (168 Hours)

100

4.5V~5.5V

QUAD

鸥翼

260

5V

0.5mm

40

AT6005

80

5V

500MHz

现场可编程门阵列

15000

2

3136

50 ns

14mm

14mm

ROHS3 Compliant

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1AGL250V5-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

68 I/O

-40 to 85 °C

Tray

M1AGL250V5

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

SMD/SMT

151 MHz

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX36

活跃

PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

125 °C

无

A42MX36-1BG272M

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.19

BGA

This product may require additional documentation to export from the United States.

N

202 I/O

3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

A42MX36

e0

3A001.A.2.C

锡铅银

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

225

1.27 mm

compliant

272

S-PBGA-B272

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

1.14 V

有

M2GL050T-FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B896

377

不合格

1.2 V

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P600

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-1FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

+ 85 C

SMD/SMT

172 MHz

有

微芯片技术

40

Actel

3.3, 5 V

Tray

A42MX16

活跃

5.5 V

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-TQG176I

94 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.28

Details

140 I/O

3 V

- 40 C

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

N

151 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

24

ProASIC3

Tray

A3P400

Obsolete

1.575 V

0°C ~ 85°C (TJ)

Tray

A3P400

1.425V ~ 1.575V

1.5 V

55296

400000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

60

Actel

0.046530 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

A54SX32A-1TQG144

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

113 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

20 mm

20 mm