N/A

-

表面贴装

256

MICROSEMI CORP

5.75

147456

Compliant

3

30

有

AGL1000V2-FGG256T

Microsemi Corporation

活跃

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

250

compliant

18 kB

现场可编程门阵列

24576

1e+06

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

113

Tray

A54SX32

Obsolete

1.40 MM HEIGHT, MO-136, TQFP-144

微芯片技术

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A54SX32-2TQ144I

320 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

-40°C ~ 85°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G144

不合格

INDUSTRIAL

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

32000

20 mm

20 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

34

Tray

A40MX02

Obsolete

QCCJ,

微芯片技术

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX02-2PL44I

101 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

LCC

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

44

S-PQCC-J44

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

16.5862 mm

16.5862 mm

N/A

-

表面贴装

84

70

Compliant

125 °C

-55 °C

125 MHz

5 V

5.5 V

4.5 V

3 ns

3 ns

200

1500

200

264

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

Tray

A3PE1500

Obsolete

Compliant

微芯片技术

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

A3PE1500-2PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

147

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

144

104

Compliant

85 °C

-40 °C

90 MHz

5 V

5.5 V

4.5 V

5 ns

684

4000

684

568

无

N/A

-

表面贴装

YES

84

6.777889 g

84

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A54SX08-1PL84

280 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

69

Compliant

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

J BEND

225

1.27 mm

compliant

280 MHz

S-PQCC-J84

不合格

5 V

COMMERCIAL

5.25 V

4.75 V

800 ps

800 ps

768 CLBS, 8000 GATES

4.572 mm

现场可编程门阵列

768

12000

280 MHz

768

1

256

0.8 ns

768

8000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

YES

144

84

Tray

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL010S-1TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

12084

933888

20 mm

20 mm

N/A

-

YES

484

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

484

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

70 °C

有

M1A3P1000L-1FGG484

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

COMMERCIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

256

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P600L-1FGG256I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.26

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

13824

600000

17 mm

17 mm

N/A

-

YES

208

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P600L-1PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

YES

484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1FGG484I

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

BGA,

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

484

400.011771 mg

484

网格排列

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

M1AGL600V2-FGG484

108 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

235

Compliant

BGA,

e1

锡银铜

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

600000

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

YES

208

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P600L-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

YES

208

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

RECTANGULAR

QFF

M1AFS250-2PQG208I

有

85 °C

1.425 V

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK

QFF,

5.82

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

YES

208

FLATPACK

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1AFS600-1PQG208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

QFF,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

600000

30.6 mm

28 mm

N/A

-

YES

208

FLATPACK

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1AFS250-1PQG208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

QFF,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

YES

208

FLATPACK

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

85 °C

无

M1AFS250-2PQ208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

QFF,

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

YES

208

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AFS600-1PQG208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

QFF,

FLATPACK

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

600000

30.6 mm

28 mm

N/A

-

YES

208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

5.8

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

FQFP

M7AFS600-PQG208I

有

85 °C

1.425 V

40

1.5 V

-40 °C

FQFP,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

表面贴装

YES

208

208

QFF,

FLATPACK

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AFS600-PQG208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

95

Compliant

e3

哑光锡

70 °C

0 °C

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

1.0989 GHz

R-PQFP-F208

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

600000

1.0989 GHz

13824

13824

600000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

20 X 20 MM, 0.50 MM PITCH, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL005S-TQ144I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

84

Tray

Obsolete

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

YES

208

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.2 V

30

1.14 V

70 °C

无

M1A3P600L-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

COMMERCIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm