品牌是'Microchip' (5152)
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![]() | A42MX16-PQ100I | Microchip | 数据表 | 141 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | QFP100,.7X.9 | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | 94 MHz | QFP | RECTANGULAR | Transferred | ACTEL CORP | 3.6 V | 5.81 | 有 | Dynapar | 单端 | Shafted | CE | HA62515000241PS | 83 | Tray | A42MX16 | Obsolete | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | 0 to 70 Degrees C | MX | e0 | Side Mount Connector | Tin/Lead (Sn/Pb) | ALSO OPERATE AT 5.0V SUPPLY | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | R-PQFP-G100 | 140 | 不合格 | 5~26 VDC | Differential | 3.3,3.3/5,5 V | INDUSTRIAL | 140 | 608 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 608 | 1232 | 24000 | 5~26 VDC | IP66 | 不包括 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN060-Z1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | Obsolete | 71 | Tray | A3PN060 | -20°C ~ 85°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 18432 | 60000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-PTQ64I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | None | 10 - 30 | None | 46 | Tray | 微芯片技术 | EX128 | Obsolete | TQFP-64 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 30 | 2.3 V | 85 °C | 无 | EX128-PTQ64I | 357 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.61 | Cable with connector | -25 - 55 | 100 | Plastic | DC | IP67 | Other | 无 | -40°C ~ 85°C (TA) | EX | e0 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G64 | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 0.7 ns | 6000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX2000-FGG1152M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 1152-BGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | Plunger | None | 684 | Compliant | 微芯片技术 | Tray | AX2000 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1152,34X34,40 | -55 °C | 1.5 V | 40 | 1.425 V | 125 °C | 有 | AX2000-FGG1152M | 649 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.29 | Military grade | Cable entry metrical | 0 | 1 | Plastic | IP67 | Other | 2 | 有 | None | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1 mm | compliant | 649 MHz | S-PBGA-B1152 | 684 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | 现场可编程门阵列 | 21504 | 294912 | 2e+06 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||
![]() | A54SX16P-1VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | Metal | IP67 | Other | 0 | 无 | None | Roller cam | None | 81 | Tray | A54SX16 | Obsolete | Other | 1 | 0 | 0°C ~ 70°C (TA) | SX | 3V ~ 3.6V, 4.75V ~ 5.25V | 24000 | 1452 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 无 | None | Plunger | None | 125 | Tray | 微芯片技术 | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX16-PQ160M | 94 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Other | 1 | 0 | Plastic | IP00 | Other | 0 | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-2TQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 无 | A54SX08A-2TQ100I | 313 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | 20 | Transverse connector | 81 | Tray | A54SX08A | Obsolete | LFQFP, TQFP100,.63SQ | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 81 | 768 CLBS, 12000 GATES | 1.6 mm | 现场可编程门阵列 | 12000 | 768 | 0.9 ns | 768 | 768 | 12000 | 有 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 无 | None | Other | None | 34 | Tray | 微芯片技术 | A40MX02 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX02-3PL44I | 109 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | LCC | Other | 1 | 0 | Plastic | IP00 | Other | 0 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | INDUSTRIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQ144M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-BQFP | 144-PQFP (28x28) | 微芯片技术 | 17.5 | Transverse connector | 95 | Tray | Obsolete | -55°C ~ 125°C (TC) | 42MX | 3V ~ 3.6V, 4.75V ~ 5.25V | 348 | 14000 | 有 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 无 | None | Roller lever | None | 69 | Tray | 微芯片技术 | A40MX04 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A40MX04-PQ100M | 80 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | With cable preassembled | 1 | 0 | Metal | IP67 | Other | 0 | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | MILITARY | 547 CLBS, 6000 GATES | 3.4 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-VQ80A | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 80-TQFP | YES | 80-VQFP (14x14) | 80 | 微芯片技术 | 125 °C | 无 | A40MX02-VQ80A | 116 MHz | TQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.54 | QFP | 1 | 0 | 0 | 57 | Tray | A40MX02 | Obsolete | TQFP, | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 30 | 4.75 V | -40°C ~ 125°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 3V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 80 | S-PQFP-G80 | 不合格 | AUTOMOTIVE | 295 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | 2.2 ns | 295 | 3000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX250-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Compliant | 115 | Tray | AX250 | Obsolete | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PL68M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | Non-Compliant | 57 | Tray | A40MX04 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A40MX04-PL68M | 80 MHz | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | 不合格 | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-3PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Cable | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | LCC | Compliant | 34 | Tray | A40MX04 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX04-3PL44I | 109 MHz | QCCJ | -40°C ~ 85°C (TA) | MX | e0 | Solder | 6 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 2.54 mm | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 1.7 ns | 547 | 6000 | 152.4 mm | 16.5862 mm | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 176 | Tray | A42MX24 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-1PQ208 | 96.6 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | COMMERCIAL | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 36000 | 2.1 ns | 1890 | 36000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 140 | Tray | A42MX16 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-2PQ208I | 117 MHz | FQFP | SQUARE | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | MICROSEMI CORP | 1.575 V | 5.61 | 147 | Compliant | Tray | A3PE3000L | Obsolete | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3PE3000L-PQ208I | FQFP | SQUARE | Microsemi Corporation | Obsolete | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3e+06 | 781.25 MHz | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 12084 | 933888 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1TQG144T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | 活跃 | -40°C ~ 125°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 6060 | 719872 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1VFG400 | Microchip | 数据表 | 27 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | GRID ARRAY, LOW PROFILE, FINE PITCH | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | 169 | Tray | M2GL005 | 活跃 | 1.26 V | 1.14 V | 5.28 | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | LFBGA | M2GL005S-1VFG400 | 有 | 85 °C | 30 | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 3 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | OTHER | 171 | 1.51 mm | 现场可编程门阵列 | 6060 | 719872 | 6060 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 1.575 V | 5.25 | 154 | Tray | M1A3P600 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1A3P600-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 110592 | 600000 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7A3P1000-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | Zinc | 微芯片技术 | Compliant | 154 | Tray | M7A3P1000 | Obsolete | 0°C ~ 85°C (TJ) | ProASIC3 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1e+06 | 310 MHz | 2 | 24576 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000L-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.61 | Non-Compliant | 147 | Tray | M1A3PE3000L | Obsolete | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M1A3PE3000L-1PQ208I | -40°C ~ 100°C (TJ) | Bulk | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 28 V | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 3 GHz | 75264 | 75264 | 3000000 | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-FCG484T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 244 | Tray | 活跃 | -40°C ~ 125°C (TJ) | PolarFire™ | 0.97V ~ 1.08V | 192000 | 13946061 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 有 | 93 | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AFS250-2PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 3.4 mm | 28 mm | 28 mm | 无 |
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