品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 材料 | 质量 | 终端数量 | 型芯材料 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 终端 | ECCN 代码 | 温度系数 | 连接器类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 附加功能 | HTS代码 | 子类别 | 额定功率 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 电阻器类型 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 输出电压 | 输出类型 | 电源 | 温度等级 | 弱电 | 终端类型 | 导线/电缆种类 | 内存大小 | 电缆长度 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 导线/电缆直径 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 电阻公差 | 插入损耗(dB) | 寄存器数量 | 模式 | CLB-Max的组合延时 | 导线/电缆颜色 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 等效门数 | 操作方式 | 输入电压 | 产品类别 | 触点 | 产品长度 | 产品宽度 | 轴承 | 知识产权评级 | 配套连接器 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A40MX04-1PL68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68 | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | Compliant | 57 | Tray | A40MX04 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A40MX04-1PL68 | 48 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.21 | LCC | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | Orange | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | COMMERCIAL | Non-Compliant | 双拉链 | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 2.4 mm | 6000 | 0.3 dB | Multimode | 2.3 ns | Orange | 547 | 6000 | 3 m | 24.2316 mm | 不适用 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF050T-1FCVG484E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | DIN Rail,Surface | 484-BFBGA | 484-FBGA (19x19) | 微芯片技术 | 970 mV/1.02 V | SMD/SMT | SHS10S110A | CSA, UL | Syrelec, Brand of Crouzet Control | 无 | 10 | 176 | Tray | 活跃 | 48000 LE | + 100 C | 1.03 V/1.08 V | 0 C | 0°C ~ 100°C (TJ) | - | 0.250 in Flat Blade | 0.97V ~ 1.08V | 3774874 | 48000 | Interval | 固态 | IP66 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 微芯片技术 | 171 | Compliant | Tray | A54SX72A | Obsolete | Miscellaneous | 0°C ~ 70°C (TA) | SX-A | 70 °C | 0 °C | 2.5 V | 217 MHz | 1.5 ns | 1.5 ns | 6036 | 108000 | 217 MHz | 6036 | 6036 | 4024 | 2.75 V | 2.25 V | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | ABB | 83 | Tray | A42MX16 | Obsolete | 1 MM HEIGHT, PLASTIC, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-VQ100 | 94 MHz | TFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 0°C ~ 70°C (TA) | MX | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 1232 | 24000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN125-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | Details | 活跃 | A3PN125 | 微芯片技术 | Tray | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.5 V | 40 | 70 °C | 有 | A3PN125-VQG100 | TFQFP | SQUARE | 活跃 | FPGA - Field Programmable Gate Array ProASIC3 | MICROSEMI CORP | 1.4 | 有 | 1500 LE | 36864 bit | 71 I/O | + 85 C | 1.575 V | 0.321387 oz | - 20 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN125 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425 V to 1.575 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 125000 | STD | - | 3072 | 125000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | AEC-Q200 | 267 | Tray | M2GL090 | 活跃 | 86184 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | -40°C ~ 100°C (TJ) | IGLOO2 | 100 ppm/K | 165 Ohm | 0.125 W | 1.14V ~ 2.625V | 通用型 | 86184 | 2648064 | STD | 4 Transceiver | 1 | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-9215602MYC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 51 | Non-Compliant | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Crimp | D-Sub | 125 °C | -55 °C | 5 V | 12 mm | 5.2 ns | 1 | 998 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050-VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | BGA400,20X20,32 | 1.2 V | 有 | M2GL050-VFG400I | LFBGA | SQUARE | 活跃 | FPGA - Field Programmable Gate Array IGLOO 2 | MICROSEMI CORP | 1.53 | 有 | 56340 LE | 207 I/O | + 100 C | 1.26 V | - 40 C | 90 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL050 | 活跃 | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 667 Mb/s | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | FPGA - Field Programmable Gate Array | 1869824 | STD | 4 Transceiver | 56340 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-FPL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | Ceramic | 微芯片技术 | A42MX24 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-FPL84 | 50.4 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.2 | LCC | 表面贴装 | 72 | Compliant | Tray | -55°C to +125°C | MX | 0.05 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | COMMERCIAL | Pb | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 3.4 ns | 1890 | 5.25 V | 3 V | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL1000V5-CS281I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | Industrial grade | 表面贴装 | 1000000 | 215 | 1000000 | 1.5000 V | CSP | 215 | Tray | AGL1000 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.5 V | 未说明 | 1.425 V | 100 °C | 无 | AGL1000V5-CS281I | 108 MHz | TFBGA | -40 to 85 °C | IGLOO | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | unknown | S-PBGA-B281 | 不合格 | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.05 mm | 现场可编程门阵列 | 24576 | 147456 | 1000000 | Industrial | STD | 24576 | 24576 | 1000000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-1FG484T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | 微芯片技术 | 无 | A3P1000-1FG484T | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.47 | Automotive grade | 表面贴装 | 1000000 | 300 | 1000000 | 1.5000 V | FBGA | 300 | Tray | A3P1000 | 活跃 | 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 20 | 1.425 V | 125 °C | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | 1 | 24576 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX16P-1VQG100 | 280 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | Commercial grade | 1452 | VQFP | 3.3, 5 V | 2.97, 4.75 V | 24000 | 81 | 16000 | 3.63, 5.25 V | 表面贴装 | 81 | Tray | A54SX16 | 活跃 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 0 to 70 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 3.3,3.3/5 V | COMMERCIAL | 81 | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 1452 | Commercial | 1 | 528 | 0.8 ns | 1452 | 1452 | 16000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-FG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | 70 °C | 无 | APA750-FG896 | 180 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | Commercial grade | FBGA | 2.5000 V | 2.3 V | 750000 | 562 | 750000 | 2.7 V | 表面贴装 | 562 | Compliant | Tray | APA750 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 2.5 V | 30 | 2.3 V | 0 to 70 °C | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B896 | 562 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 18 kB | 562 | 750000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 750000 | 180 MHz | Commercial | STD | 32768 | 32768 | 2.7 V | 2.3 V | 750000 | 1.73 mm | 31 mm | 31 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-2PLG68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | 68 | HS35R40968557 | CE | Hollowshaft | Hollow | Dynapar | 有 | 57 | PLASTIC, MS-007-AD, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 5 V | 40 | 4.75 V | 70 °C | 有 | 60 MHz | QCCJ | SQUARE | Obsolete | MICROSEMI CORP | 5.25 V | 5.8 | -40 to 85 Degrees C | e3 | 10 Pin Connector | Matte Tin (Sn) | 70 °C | 0 °C | MAX 57 I/OS | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | 65 MHz | S-PQCC-J68 | 不合格 | 5 VDC | Differential | COMMERCIAL | 3.4 ns | 3.4 ns | 547 CLBS, 2000 GATES | 4.445 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 2 | 273 | 3.4 ns | 547 | 5.25 V | 4.75 V | 2000 | 5~26 VDC | 有 | IP67 | Included | 24.13 mm | 24.13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1425A-1CQ132M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 132 | 132 | BSPA200120N5P | CSA, UL | Bussmann | Wall | 有 | 8542390000/8542390000/8542390000/8542390000/8542390000 | 100 | HERMETIC SEALED, CERAMIC, QFP-132 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | TPAK132,2.5SQ,25 | -55 °C | 5 V | 30 | 4.5 V | 125 °C | 无 | 150 MHz | GQFF | SQUARE | Obsolete | MICROSEMI CORP | 5.5 V | 5.85 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | FLAT | 225 | 0.635 mm | not_compliant | 150 MHz | S-CQFP-F132 | 100 | 不合格 | 5 V | MILITARY | 2.6 ns | 100 | 310 CLBS, 2500 GATES | 2.9464 mm | 现场可编程门阵列 | 310 | 2500 | 310 | 2.6 ns | 310 | 310 | 5.5 V | 4.5 V | 2500 | 24.13 mm | 24.13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-1PQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 不锈钢 | 100 | Straight | ADE4N0502SSNK3 | Armored | Crouse-Hinds Industrial Products | 电缆接线盒 | 无 | 83 | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | QFP100,.7X.9 | 5 V | 30 | 4.75 V | 70 °C | 无 | 90 MHz | QFP | RECTANGULAR | Obsolete | MICROSEMI CORP | 5.25 V | 5.84 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | Metallic | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | unknown | 120 MHz | R-PQFP-G100 | 83 | 不合格 | 5 V | COMMERCIAL | 4.3 ns | 83 | 451 CLBS, 2500 GATES | 3.4 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 4.3 ns | 451 | 451 | 5.25 V | 4.75 V | 2500 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Tray | APA1000 | Obsolete | 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 30 | 2.3 V | 70 °C | 无 | APA1000-PQ208 | 180 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.3 | 158 | Compliant | 0°C ~ 70°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 180 MHz | S-PQFP-G208 | 158 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 24.8 kB | 158 | 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 202752 | 1e+06 | 180 MHz | 56320 | 56320 | 2.7 V | 2.3 V | 1000000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FGG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | 微芯片技术 | 1.14 V | 1.26 V | 221 | Tray | A3PE3000 | 活跃 | Compliant | 5.29 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | BGA | 250 MHz | A3PE3000L-FGG324I | 有 | 85 °C | 1.14 V | 40 | 1.2 V | -40 °C | BGA324,18X18,40 | PLASTIC/EPOXY | 3 | 网格排列 | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324 | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | 现场可编程门阵列 | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060TS-VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 207 | Tray | M2GL060 | 活跃 | 56520 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 有 | M2GL060TS-VFG400I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.26 | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | S-PBGA-B400 | 1.51 mm | 现场可编程门阵列 | 56520 | 1869824 | STD | 4 Transceiver | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-FGG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | BGA, BGA324,18X18,40 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 70 °C | 有 | AX125-FGG324 | 649 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.8 | 168 | Compliant | 网格排列 | e1 | 锡银铜 | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | BOTTOM | BALL | 260 | 1 mm | compliant | 649 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 2.3 kB | 990 ps | 990 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 125000 | 649 MHz | 1344 | 1344 | 0.99 ns | 1344 | 2016 | 1.575 V | 1.425 V | 125000 | 1.25 mm | 19 mm | 19 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN125-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 活跃 | 微芯片技术 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 85 °C | 1.44 | MICROSEMI CORP | 活跃 | SQUARE | TFQFP | A3PN125-VQG100I | 有 | 有 | 1500 LE | 36864 bit | 71 I/O | + 100 C | 1.575 V | - 40 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 nano | Details | Tray | A3PN125 | -40°C ~ 100°C (TJ) | Tray | A3PN125 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425 V to 1.575 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 125000 | STD | - | 3072 | 125000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-FCSG325 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | MICROSEMI CORP | 5.2 | 180 | Tray | M2GL025 | 活跃 | 27696 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | 网格排列 | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 85 °C | 有 | M2GL025TS-FCSG325 | BGA | SQUARE | Microsemi Corporation | 活跃 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 180 | 现场可编程门阵列 | 27696 | 1130496 | 2 Transceiver | 27696 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-1FG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 256 | 400.011771 mg | 138 | Compliant | 70 °C | 0 °C | 1.5 V | 763 MHz | 2.3 kB | 850 ps | 850 ps | 1344 | 125000 | 763 MHz | 1344 | 1 | 1344 | 1.575 V | 1.425 V | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1FCS325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | M2GL025 | 活跃 | 27696 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | 180 | Tray | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 27696 | 1130496 | 2 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-FG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | 30 | 1.425 V | 70 °C | 无 | AX125-FG324 | 649 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | 1 MM PITCH, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 168 | Compliant | 1.5 V | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 2.3 kB | 990 ps | 990 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 125000 | 649 MHz | 1344 | 1344 | 0.99 ns | 1344 | 2016 | 1.575 V | 1.425 V | 125000 | 1.25 mm | 19 mm | 19 mm | 无 |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
