品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 触点形状 | 供应商器件包装 | 材料 | 房屋材料 | 质量 | 终端数量 | PCB安装方向 | PCB安装固定 | PCB安装对准 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 终端 | ECCN 代码 | 连接器类型 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 行数 | 附加功能 | HTS代码 | 子类别 | 螺距 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 深度 | Reach合规守则 | 额定电流 | 频率 | JESD-30代码 | 输出的数量 | 资历状况 | 接头数量 | 输出电压 | 房屋颜色 | 输出类型 | 工作电源电压 | 电源 | 触点样式 | 温度等级 | 弱电 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 输入类型 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 配套固定装置 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 预载 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 连接类型 | 输入电压 | 产品类别 | 轴承 | 知识产权评级 | 配套连接器 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
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![]() | AGL125V2-QNG132 | Microchip | 数据表 | 318 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 132 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.61 | HVBCC, LGA132(UNSPEC) | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | UNSPECIFIED | LGA132(UNSPEC) | 1.2 V | 未说明 | 1.14 V | 70 °C | 有 | AGL125V2-QNG132 | 108 MHz | HVBCC | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BUTT | 未说明 | 0.5 mm | compliant | S-XBCC-B132 | 84 | 不合格 | 1.2/1.5 V | COMMERCIAL | 84 | 3072 CLBS, 125000 GATES | 0.8 mm | 现场可编程门阵列 | 3072 | 3072 | 125000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P400-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | Cast Iron | 208 | 微芯片技术 | 无 | 350 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | NH-BM824-50-R-140 | Grove Gear | 151 | Tray | M1A3P400 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | C-Face Coupled | 9216 CLBS, 400000 GATES | 4.1 mm | 现场可编程门阵列 | 55296 | 400000 | 9216 | 400000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-1VQG100T | Microchip | 数据表 | 332 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | 71 | Tray | A3P125 | 活跃 | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 1.425V ~ 1.575V | 36864 | 125000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600-FG256 | Microchip | 数据表 | 2085 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 30 | 1.425 V | 70 °C | 微芯片技术 | 无 | A3PE600-FG256 | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.32 | 1.5000 V | 活跃 | A3PE600 | Tray | 165 | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.5 V | 0 to 70 °C | ProASIC3E | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 165 | 不合格 | 1.5/3.3 V | COMMERCIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL600V5-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 400.011771 mg | 484 | 100 °C | 1.425 V | 30 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | 283-05970 | Siemens Building Technologies | 235 | Non-Compliant | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 5.86 | 1.575 V | MICROSEMI CORP | Obsolete | SQUARE | BGA | 108 MHz | 无 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 13824 | 600000 | 13824 | 600000 | Flanged | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-CQ352M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | YES | 352 | 352-CQFP (75x75) | 10.567001 g | 352 | TPAK352,2.9SQ,20 | -55 °C | 微芯片技术 | 1.5 V | 20 | 1.425 V | 125 °C | 无 | 649 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | Military grade | PDG34G0125E3XK | CE, CSA, UL | Cutler Hammer, Div of Eaton Co | Panel | 198 | Compliant | Tray | AX1000 | 活跃 | GQFF, TPAK352,2.9SQ,20 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55°C ~ 125°C (TA) | Axcelerator | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | 125 A | 649 MHz | S-CQFP-F352 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.89 mm | 现场可编程门阵列 | 12096 | 165888 | 1e+06 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 2.66 mm | 48 mm | 48 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-1QNG132T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132 | Turck | A0851 | 87 | Compliant | 125 °C | -40 °C | 4.5 kB | 250000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025T-FG484 | Microchip | 数据表 | 2042 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 0 C | 1.2 V | SMD/SMT | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 85 °C | 无 | M2GL025T-FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Miscellaneous | 267 | Non-Compliant | Tray | M2GL025 | 活跃 | 27696 LE | + 85 C | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | OTHER | 138 kB | 267 | 2.44 mm | 现场可编程门阵列 | 27696 | 1130496 | 4 Transceiver | 27696 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150-1FC1152 | Microchip | 数据表 | 2535 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | 574 | Tray | M2GL150 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL150-1FC1152 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | QFP208,1.2SQ,20 | SQUARE | 微芯片技术 | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 147 | Tray | M1A3PE3000 | Obsolete | 1.425 V | M1A3PE3000-PQ208I | 无 | Obsolete | MICROSEMI CORP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | 5.6 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | -40°C ~ 100°C (TJ) | ProASIC3E | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7AFS600-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.5 V | 30 | 1.425 V | M7AFS600-2PQ208I | 无 | Transferred | ACTEL CORP | 0.50 MM PITCH, PQFP-208 | 5.85 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | e0 | 锡铅 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600L-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.575 V | 1.2 V | 40 | 1.14 V | M1A3P600L-PQG208 | 有 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.25 | 350 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | e3 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | COMMERCIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000L-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 30 | 1.14 V | 微芯片技术 | 70 °C | 无 | 350 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.61 | ASLD29922N-111-A-12V | IDEC | 147 | Tray | M1A3PE3000L | Obsolete | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | COMMERCIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090-FG676I | Microchip | 数据表 | 2857 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 有 | This product may require additional documentation to export from the United States. | 86316 | + 100 C | 1.26 V | - 40 C | 40 | 1.14 V | SMD/SMT | Microchip | 微芯片技术 | Microchip Technology / Atmel | IGLOO2 | N | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 20 | 无 | M2GL090-FG676I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | 425 | Tray | M2GL090 | 活跃 | -40°C ~ 100°C (TJ) | Tray | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 1.2 V | 667 Mb/s | 425 | 2.44 mm | 现场可编程门阵列 | 86184 | SoC FPGA | 2648064 | 4 Transceiver | 86316 | FPGA - Field Programmable Gate Array | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050-FG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 85 °C | 微芯片技术 | 无 | M2GL050-FG896 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | 377 | Non-Compliant | Tray | M2GL050 | 活跃 | 31 X 31 MM, 1 MM PITCH, FBGA-896 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 20 | 1.14 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | OTHER | 377 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300T-1FCG784IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TS-1FCSG325IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TS-FCSG325IPP | Microchip | 数据表 | 180 In Stock | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-FCG784IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090-1FGG484 | Microchip | 数据表 | 2648 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 10 months ago) | Gold, Lead, Tin | 通孔 | 表面贴装 | 484-BGA | YES | 15 | Round | 484-FPBGA (23x23) | Aluminium | 484 | Vertical | Without | Without | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 85 °C | 有 | M2GL090-1FGG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | Brass | 2.29 mm | Non-Compliant | 267 | Tray | M2GL090 | 活跃 | 86184 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | BGA, BGA484,22X22,40 | 网格排列 | 0°C ~ 85°C (TJ) | Bulk | IGLOO2 | Solder | Male Pin, Pin, Plug | 15 | 200 °C | -200 °C | 1 | 8542.39.00.01 | 现场可编程门阵列 | 635 µm | 1.14V ~ 2.625V | BOTTOM | Vertical | BALL | 260 | 1 mm | 7.11 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 15 | Natural | 1.2 V | 1.2 V | Pin | OTHER | Non-Compliant | 1.26 V | 1.14 V | 323.3 kB | 267 | With | 2.44 mm | 现场可编程门阵列 | 86316 | 2648064 | 有 | 86316 | 7.5184 mm | 14.1859 mm | 23 mm | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1425A-PQG100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 70 °C | 4.75 V | 40 | 5 V | PLASTIC/EPOXY | 3 | FLATPACK | ROHS COMPLIANT, PLASTIC, QFP-100 | Thermoplastic Elastomer (TPE) | A100602-24-COH | CSA, UL | Joy Cooper Interconnect | 5.81 | 5.25 V | MICROSEMI CORP | Obsolete | RECTANGULAR | QFP | 125 MHz | 有 | e3 | 哑光锡 | MAX 80 I/OS | CMOS | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 310 CLBS, 2500 GATES | 3.4 mm | 现场可编程门阵列 | 3 ns | 310 | 2500 | 保护盖 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-2PLG68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | 68 | 有 | 70 °C | 4.75 V | 40 | 5 V | PLASTIC/EPOXY | 3 | CHIP CARRIER | PLASTIC, MS-007-AD, LCC-68 | 5.8 | 5.25 V | MICROSEMI CORP | HS35R40968557 | CE | Hollowshaft | Hollow | Dynapar | 有 | 57 | Obsolete | SQUARE | QCCJ | 60 MHz | -40 to 85 Degrees C | e3 | 10 Pin Connector | Matte Tin (Sn) | 70 °C | 0 °C | MAX 57 I/OS | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | 65 MHz | S-PQCC-J68 | 不合格 | 5 VDC | Differential | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 3.4 ns | 3.4 ns | 547 CLBS, 2000 GATES | 4.445 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 2 | 273 | 3.4 ns | 547 | 2000 | 5~26 VDC | 有 | IP67 | Included | 24.13 mm | 24.13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1425A-1CQ132M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 132 | 132 | TPAK132,2.5SQ,25 | -55 °C | 5 V | 30 | 4.5 V | 125 °C | 无 | 150 MHz | GQFF | SQUARE | Obsolete | MICROSEMI CORP | 5.5 V | 5.85 | BSPA200120N5P | CSA, UL | Bussmann | 有 | Wall | 8542390000/8542390000/8542390000/8542390000/8542390000 | 100 | HERMETIC SEALED, CERAMIC, QFP-132 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 225 | 0.635 mm | not_compliant | 150 MHz | S-CQFP-F132 | 100 | 不合格 | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 2.6 ns | 100 | 310 CLBS, 2500 GATES | 2.9464 mm | 现场可编程门阵列 | 310 | 2500 | 310 | 2.6 ns | 310 | 310 | 2500 | 24.13 mm | 24.13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-1PQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 不锈钢 | 100 | QFP100,.7X.9 | 5 V | 30 | 4.75 V | 70 °C | 无 | 5.84 | 5.25 V | MICROSEMI CORP | Obsolete | RECTANGULAR | QFP | 90 MHz | Straight | ADE4N0502SSNK3 | Armored | Crouse-Hinds Industrial Products | 电缆接线盒 | 无 | 83 | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | Metallic | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.65 mm | unknown | 120 MHz | R-PQFP-G100 | 83 | 不合格 | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 4.3 ns | 83 | 451 CLBS, 2500 GATES | 3.4 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 4.3 ns | 451 | 451 | 2500 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1425A-PLG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | 70 °C | 4.75 V | 40 | 5 V | PLASTIC/EPOXY | 3 | CHIP CARRIER | QCCJ, | PDG23K0100E3RL | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | Panel | 5.82 | 5.25 V | MICROSEMI CORP | Obsolete | SQUARE | QCCJ | 125 MHz | 有 | e3 | 哑光锡 | MAX 70 I/OS | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | 100 A | S-PQCC-J84 | 不合格 | COMMERCIAL | 310 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 3 ns | 310 | 2500 | 29.3116 mm | 29.3116 mm |
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