N/A

-

Production (Last Updated: 2 months ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

Tray

M2GL150

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-1FCSG536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

IGLOO2

90

有

Details

293

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

N

12084 LE

138 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

活跃

M2GL010

Tray

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL010TS-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

323.3 kB

86316

2648064

STD

4 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

N

56520 LE

200 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

活跃

M2GL060

Tray

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060T-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

Tray

M2GL150

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150TS-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

293

0°C ~ 85°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

1

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

60

IGLOO2

微芯片技术

267

Tray

M2GL050

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

VFBGA-400

YES

400-VFBGA (17x17)

400

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.705961 oz

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL010T-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

Tray

M2GL010T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

有

90

微芯片技术

IGLOO2

169

Tray

M2GL005

活跃

1.26 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL005S-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

425 I/O

1.2 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

有

M2GL090TS-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

Details

86184 LE

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

100 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

N

27696 LE

138 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL025-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

209

Tray

M2GL005

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL005S-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005S

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

209

不合格

1.2 V

87.9 kB

209

2.44 mm

现场可编程门阵列

6060

719872

6060

23 mm

23 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

84

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005S-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

Details

1.14 V

有

60

IGLOO2

1.26 V

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL090TS

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

微芯片技术

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

有

M2GL010T-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

-55°C ~ 125°C (TJ)

Tray

M2GL010T

3A001.A.2.C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

MILITARY

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

IGLOO2

200

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

176

-40°C ~ 100°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

300

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

11000 LE

有

60

ProASIC3

-55°C ~ 125°C (TJ)

Tray

A3P1000

125 °C

-55 °C

1.425V ~ 1.575V

18 kB

147456

1e+06

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL025T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060TS-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

STD

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

60

微芯片技术

IGLOO2

1.26 V

84

Tray

M2GL005

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL005-1TQG144

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

1.14 V

有

0°C ~ 85°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

0.331393 oz

Tray

M2GL025

活跃

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL025-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL025

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL090TS-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

STD

4 Transceiver

86316

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

IGLOO2

微芯片技术

267

Tray

M2GL050

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050T-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

60

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

有

M2GL050TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

1

56340

17 mm

17 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

1.26 V

84

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL005S-TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005S

e3

Matte Tin (Sn)

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

30

S-PQFP-G144

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm