2276 In Stock

• 1: ¥1,232.166491
• 10: ¥1,162.421214
• 100: ¥1,096.623794
• 500: ¥1,034.550743
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

有

微芯片技术

160

IGLOOe

Tray

M1AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AGL1000V5-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

0 C

+ 70 C

SMD/SMT

250 MHz

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

127 uA

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

13 mm

13 mm

2465 In Stock

• 1: ¥3,790.430894
• 10: ¥3,575.878205
• 100: ¥3,373.470002
• 500: ¥3,182.518869
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

Tray

P1AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

2776 In Stock

• 1: ¥1,942.902203
• 10: ¥1,832.926609
• 100: ¥1,729.176046
• 500: ¥1,631.298157
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

有

60

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.73 mm

23 mm

23 mm

701 In Stock

• 1: ¥13,174.823011
• 10: ¥12,741.608328
• 25: ¥12,653.037071
• 50: ¥12,565.081501
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.8

Details

有

60

Fusion

223

Tray

M1AFS1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

有

M1AFS1500-FGG484K

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B484

223

不合格

1.5,3.3 V

223

现场可编程门阵列

276480

1500000

38400

2186 In Stock

• 1: ¥2,145.858029
• 10: ¥2,024.394366
• 100: ¥1,909.806009
• 500: ¥1,801.703783
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

Tray

P1AFS600

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

2152 In Stock

• 1: ¥956.784235
• 10: ¥902.626634
• 100: ¥851.534563
• 500: ¥803.334492
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

70 °C

有

M1A3P1000L-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

0 to 70 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

2145 In Stock

• 1: ¥1,982.483991
• 10: ¥1,870.267919
• 100: ¥1,764.403697
• 500: ¥1,664.531784
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

+ 100 C

SMD/SMT

250 MHz

微芯片技术

有

60

IGLOOe

0.396232 oz

1.5 V

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

M1AGL1000V2-FGG484I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

300 I/O

1.2 V

- 40 C

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.2 V to 1.5 V

INDUSTRIAL

127 µA

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

STD

24576

1000000

23 mm

23 mm

2815 In Stock

• 1: ¥3,803.875357
• 10: ¥3,588.561653
• 100: ¥3,385.435528
• 500: ¥3,193.807101
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

P1AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

U1AFS1500

1.425V ~ 1.575V

276480

1500000

2

49 In Stock

• 1: ¥60.323707
• 10: ¥56.909157
• 100: ¥53.687882
• 500: ¥50.648946
查看所有的价格

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

有

260

微芯片技术

ProASIC3 nano

1.575 V

Tray

A3PN020

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

1.5 V

30

70 °C

有

A3PN020-2QNG68

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.26

Details

49 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

-20°C ~ 85°C (TJ)

Tray

A3PN020

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

1.5 V

OTHER

1 mA

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

20000

2

520

20000

0.88 mm

8 mm

8 mm

765 In Stock

• 1: ¥7,252.391237
• 10: ¥6,841.878527
• 100: ¥6,454.602383
• 500: ¥6,089.247531
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

60

Fusion

223

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

N

有

-55°C ~ 100°C (TJ)

Tray

AFS1500

100 °C

-55 °C

1.425V ~ 1.575V

33.8 kB

276480

1.5e+06

19 In Stock

• 1: ¥95.427170
• 10: ¥90.025632
• 100: ¥84.929840
• 500: ¥80.122492
查看所有的价格

-

表面贴装

UCSP

YES

36-UCSP (3x3)

36

250 MHz

有

微芯片技术

490

IGLOO nano

1.575 V

Tray

AGLN010

活跃

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

85 °C

有

AGLN010V5-UCG36I

VFBGA

SQUARE

活跃

MICROSEMI CORP

2.08

Details

100 LE

23 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

AGLN010V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B36

不合格

1.5 V

INDUSTRIAL

3 uA

260 CLBS, 10000 GATES

0.8 mm

现场可编程门阵列

260

10000

STD

260

10000

3 mm

3 mm

2264 In Stock

• 1: ¥1,579.034111
• 10: ¥1,489.654824
• 100: ¥1,405.334736
• 500: ¥1,325.787483
查看所有的价格

-

表面贴装

CSP

YES

281-CSP (10x10)

281

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

184

IGLOOe

1.5000 V

1.575 V

Tray

AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

未说明

85 °C

无

AGL1000V5-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

11000 LE

215 I/O

1.425 V

0 to 70 °C

Tray

AGL1000V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

281

S-PBGA-B281

不合格

1.5 V

OTHER

44 uA

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

0.71 mm

10 mm

10 mm

19 In Stock

• 1: ¥59.550431
• 10: ¥56.179652
• 100: ¥52.999674
• 500: ¥49.999694
查看所有的价格

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

1.425 V

49 I/O

微芯片技术

Details

1.575 V

Tray

A3P030

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

1.5 V

30

85 °C

有

A3P030-1QNG68

350 MHz

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

ProASIC3

260

有

272 MHz

SMD/SMT

+ 70 C

0 C

0°C ~ 85°C (TJ)

Tray

A3P030

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

1.5 V

COMMERCIAL

2 mA

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

1

768

30000

0.88 mm

8 mm

8 mm

558 In Stock

• 1: ¥16,682.100448
• 10: ¥16,133.559424
• 25: ¥16,021.409556
• 50: ¥15,910.039281
查看所有的价格

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

- 55 C

+ 125 C

SMD/SMT

504 kbit

350 MHz

3500 LAB

60

ProASIC3

微芯片技术

0.014110 oz

341 I/O

35000 LE

Details

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3PE3000

活跃

1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

M1A3PE3000L-1FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

1.14 V

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

700 Mb/s

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm

592 In Stock

• 1: ¥5,877.196556
• 10: ¥5,544.525054
• 100: ¥5,230.684013
• 500: ¥4,934.607555
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

223

Tray

P1AFS1500

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

2577 In Stock

• 1: ¥1,316.035102
• 10: ¥1,241.542550
• 100: ¥1,171.266552
• 500: ¥1,104.968445
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

1.5000 V

1.425 V

1.575 V

114

Tray

U1AFS250

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

0 to 70 °C

Tray

U1AFS250

1.425V ~ 1.575V

36864

250000

STD

49 In Stock

• 1: ¥355.594536
• 10: ¥335.466546
• 100: ¥316.477872
• 500: ¥298.564036
查看所有的价格

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

ProASIC3

90

有

SMD/SMT

Details

This product may require additional documentation to export from the United States.

178

Tray

M1A3P400

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

2110 In Stock

• 1: ¥2,145.858029
• 10: ¥2,024.394366
• 100: ¥1,909.806009
• 500: ¥1,801.703783
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Fusion

90

有

Details

This product may require additional documentation to export from the United States.

119

Tray

P1AFS600

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

10000 In Stock

• 1: ¥59.640572
• 10: ¥56.264695
• 100: ¥53.079894
• 500: ¥50.075376
查看所有的价格

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

260

Tray

A3PN015

微芯片技术

3

UNSPECIFIED

-20 °C

70 °C

A3PN015-2QNG68

MICROSEMI CORP

Details

1.425 V

ProASIC3 nano

活跃

1.575 V

HVQCCN, LCC68,.32SQ,16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.5 V

30

有

HVQCCN

SQUARE

活跃

5.26

49 I/O

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

-20°C ~ 85°C (TJ)

Tray

A3PN015

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

49

不合格

1.5 V

1.5,1.5/3.3 V

OTHER

1 mA

49

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

15000

2

384

384

15000

0.88 mm

8 mm

8 mm

2442 In Stock

• 1: ¥3,039.019866
• 10: ¥2,866.999873
• 100: ¥2,704.716865
• 500: ¥2,551.619682
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

有

60

Fusion

172

Tray

AFS600

活跃

-55°C ~ 100°C (TJ)

Tray

AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

2162 In Stock

• 1: ¥2,316.249621
• 10: ¥2,185.141155
• 100: ¥2,061.453922
• 500: ¥1,944.767847
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

154 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

24

ProASIC3

1.575 V

Tray

A3P1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

有

A3P1000-1PQG208M

1.36

MICROSEMI CORP

活跃

SQUARE

FQFP

350 MHz

This product may require additional documentation to export from the United States.

Details

11000 LE

-55°C ~ 125°C (TJ)

Tray

A3P1000

e3

3A001.A.2.C

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

2653 In Stock

• 1: ¥1,046.766971
• 10: ¥987.516013
• 100: ¥931.618880
• 500: ¥878.885737
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M1AGL600V2-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

1.2 V

有

184

IGLOOe

215

1.5 V

Tray

M1AGL600

活跃

10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281

GRID ARRAY, THIN PROFILE, FINE PITCH

0°C ~ 70°C (TA)

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

1.2 V to 1.5 V

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

19 In Stock

• 1: ¥123.214007
• 10: ¥116.239633
• 100: ¥109.660028
• 500: ¥103.452854
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

有

90

微芯片技术

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN125-2VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

-20°C ~ 85°C (TJ)

Tray

A3PN125

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

1.14 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.2 V

30

125 °C

无

M1A3PE3000L-1FG896M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e0

3A001.A.2.C

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

31 mm

31 mm

913 In Stock

• 1: ¥7,055.001638
• 10: ¥6,655.661922
• 100: ¥6,278.926341
• 500: ¥5,923.515413
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

N

有

90

Fusion

119

Tray

M1AFS1500

活跃

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

1.425V ~ 1.575V

276480

1500000