19 In Stock

• 1: ¥362.955650
• 10: ¥342.410994
• 100: ¥323.029236
• 500: ¥304.744570
查看所有的价格

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

178

Tray

M1A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

-40°C ~ 100°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

378 In Stock

• 1: ¥163.944795
• 10: ¥154.664898
• 100: ¥145.910284
• 500: ¥137.651212
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.59

N

1500 LE

71 I/O

1.14 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

有

90

IGLOO nano

1.575 V

Tray

AGLN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.2 V

30

70 °C

无

AGLN125V2-VQ100

TFQFP

-20°C ~ 85°C (TJ)

Tray

AGLN125V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

18 uA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

2387 In Stock

• 1: ¥2,136.718458
• 10: ¥2,015.772128
• 100: ¥1,901.671818
• 500: ¥1,794.030019
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

有

M1A3P1000-PQG208M

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

24

ProASIC3

1.575 V

Tray

M1A3P1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e3

3A001.A.2.C

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

97

Tray

M1A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-1FG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

2271 In Stock

• 1: ¥3,761.215447
• 10: ¥3,548.316460
• 100: ¥3,347.468360
• 500: ¥3,157.989017
查看所有的价格

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

221

Tray

M1A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1A3PE3000-FGG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

2674 In Stock

• 1: ¥2,666.700986
• 10: ¥2,515.755645
• 100: ¥2,373.354385
• 500: ¥2,239.013573
查看所有的价格

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

1.425V ~ 1.575V

1.5 V

8 mA

147456

1000000

750 In Stock

• 1: ¥7,238.424776
• 10: ¥6,828.702621
• 100: ¥6,442.172284
• 500: ¥6,077.521020
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA484,22X22,40

20

无

M1AFS1500-1FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

N

有

60

Fusion

223

Tray

M1AFS1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1500000

38400

19 In Stock

• 1: ¥352.897175
• 10: ¥332.921857
• 100: ¥314.077228
• 500: ¥296.299272
查看所有的价格

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

1.5000 V

1.425 V

1.575 V

97

Tray

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-FGG144

350 MHz

LBGA

SQUARE

0 to 85 °C

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

STD

9216

400000

13 mm

13 mm

939 In Stock

• 1: ¥6,413.634439
• 10: ¥6,050.598529
• 100: ¥5,708.111821
• 500: ¥5,385.011149
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

YES

256

256-FPBGA (17x17)

256

微芯片技术

Tray

AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

30

1.425 V

100 °C

有

AFS1500-FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

-55°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

不合格

OTHER

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1.5e+06

1500000

17 mm

17 mm

125 In Stock

• 1: ¥722.098033
• 10: ¥681.224555
• 100: ¥642.664678
• 500: ¥606.287437
查看所有的价格

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL025-VF256

LFBGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

2732 In Stock

• 1: ¥931.135112
• 10: ¥878.429351
• 100: ¥828.706935
• 500: ¥781.798993
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

60

IGLOO2

1.2000 V

1.14 V

1.26 V

IGLOO®2

微芯片技术

85C

Commercial

FBGA

0C to 85C

267

56340

1.26(V)

1.2(V)

无

1.14(V)

0C

有

56340

表面贴装

1.26 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL050-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

Details

56340 LE

267 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

0 to 85 °C

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

484

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

1.26 V

1.14 V

228.3 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

56340

1869824

STD

4 Transceiver

56340

23 mm

23 mm

793 In Stock

• 1: ¥5,950.486095
• 10: ¥5,613.666125
• 100: ¥5,295.911440
• 500: ¥4,996.142872
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

172

Tray

M1AFS600

-55°C ~ 100°C (TJ)

Tray

M1AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

19 In Stock

• 1: ¥596.386203
• 10: ¥562.628497
• 100: ¥530.781601
• 500: ¥500.737360
查看所有的价格

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

19 In Stock

• 1: ¥175.279002
• 10: ¥165.357543
• 100: ¥155.997685
• 500: ¥147.167626
查看所有的价格

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

119

IGLOO2

1.26 V

活跃

M2GL005

Tray

161

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005S-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

610 In Stock

• 1: ¥21,133.043803
• 10: ¥20,438.146808
• 25: ¥20,296.074287
• 50: ¥20,154.989363
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

PLASTIC/EPOXY

3

网格排列

1 MM PITCH, GREEN, FBGA-484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

250 MHz

A3PE3000L-1FGG484M

有

125 °C

40

1.2 V

-55 °C

BGA484,22X22,40

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

1.575 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

75264

3000000

23 mm

23 mm

无

122 In Stock

• 1: ¥742.465393
• 10: ¥700.439047
• 100: ¥660.791560
• 500: ¥623.388262
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.47

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

19 In Stock

• 1: ¥454.299027
• 10: ¥428.583985
• 100: ¥404.324517
• 500: ¥381.438218
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

24

ProASIC3

151

Tray

M1A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

2210 In Stock

• 1: ¥1,627.923965
• 10: ¥1,535.777324
• 100: ¥1,448.846533
• 500: ¥1,366.836350
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

IGLOOe

1000000

1000000

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

20

1.14 V

100 °C

无

M1AGL1000V2-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

24576

1000000

10 mm

10 mm

19 In Stock

• 1: ¥291.076449
• 10: ¥274.600426
• 100: ¥259.057000
• 500: ¥244.393403
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

6060 LE

171 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

0.287305 oz

Tray

M2GL005

活跃

1.26 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL005-1VFG400I

LFBGA

SQUARE

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

1

6060

17 mm

17 mm

无铅

708 In Stock

• 1: ¥6,997.241223
• 10: ¥6,601.170965
• 100: ¥6,227.519778
• 500: ¥5,875.018656
查看所有的价格

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

119

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

1.425 V

100 °C

有

M1AFS1500-1FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

Details

有

90

Fusion

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B256

不合格

OTHER

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1500000

17 mm

17 mm

83 In Stock

• 1: ¥261.565876
• 10: ¥246.760260
• 100: ¥232.792696
• 500: ¥219.615757
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

BGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL005-FG484

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

6060 LE

209 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

703 kbit

64 kB

400 MHz

有

11 LAB

60

128 kB

IGLOO2

Tray

M2GL005

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

1.2 V

OTHER

1.26 V

1.14 V

128 kB

87.9 kB

-

209

2.44 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

-

6060

23 mm

23 mm

2389 In Stock

• 1: ¥1,360.366530
• 10: ¥1,283.364652
• 100: ¥1,210.721371
• 500: ¥1,142.189973
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090-FCSG325

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

0°C ~ 85°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

2952 In Stock

• 1: ¥2,241.945853
• 10: ¥2,115.043256
• 100: ¥1,995.323830
• 500: ¥1,882.380973
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

活跃

M2GL090

Tray

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL090-1FG484

BGA

SQUARE

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

23 mm

23 mm

2377 In Stock

• 1: ¥2,103.699002
• 10: ¥1,984.621698
• 100: ¥1,872.284621
• 500: ¥1,766.306249
查看所有的价格

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

MICROSEMI CORP

5.27

Details

86184 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

0.630643 oz

1.2 V

Tray

M2GL090

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL090-FGG484I

BGA

SQUARE

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

667 Mb/s

267

2.44 mm

现场可编程门阵列

86184

2648064

STD

4 Transceiver

86316

23 mm

23 mm

49 In Stock

• 1: ¥550.951132
• 10: ¥519.765219
• 100: ¥490.344544
• 500: ¥462.589193
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-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010T-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm