N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-FCSG325

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010TS-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

90

IGLOO2

1.2 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL050-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.59

This product may require additional documentation to export from the United States.

Details

56340 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

256 kB

228.3 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

56340

1869824

400 MHz

72

STD

4 Transceiver

56340

17 mm

17 mm

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL025T-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

1.2 V

Tray

活跃

M2GL025

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL025-1FGG484I

1.56

MICROSEMI CORP

活跃

SQUARE

BGA

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL025

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

1.2 V

114 kB

12084

933888

STD

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

+ 85 C

SMD/SMT

有

微芯片技术

90

IGLOO2

0.236938 oz

Tray

M2GL010

活跃

1.2 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL010-VFG400

LFBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array M2GL010-VFG400

MICROSEMI CORP

1.6

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

STD

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

M2GL-EVAL-KIT

200 MHz

60

1826 kbit

IGLOO2

1.2 V

Tray

M2GL060

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL060TS

1.2 V

5 Gb/s

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

1.2 V

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

-55°C ~ 125°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

-55°C ~ 125°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

TQFP-144

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010S

1.2 V

12084

933888

N/A

-

表面贴装

PGA-132

132-CPGA

微芯片技术

This product may require additional documentation to export from the United States.

95 I/O

4.5 V

SMD/SMT

250 MHz

21

5.5 V

Tray

A42MX09

活跃

-55°C ~ 125°C (TJ)

Tray

A42MX09

3.3 V, 5 V

14000

N/A

-

PGA-132

微芯片技术

4.5 V

- 55 C

+ 125 C

SMD/SMT

5.5 V

Tray

A42MX09

活跃

250 MHz

21

This product may require additional documentation to export from the United States.

95 I/O

-55°C ~ 125°C (TC)

Tray

A42MX09

3.3 V, 5 V

14000

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

244 I/O

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

284

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

0°C ~ 100°C (TJ)

Tray

MPF200TL

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

244

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF200TS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

244

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF200TL

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

有

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

170 I/O

970 mV/1.02 V

SMD/SMT

0°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

Tray

MPF300

活跃

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

1

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

970 mV/1.02 V

SMD/SMT

有

0°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

192000 LE

364 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

PolarFire

1.08 V

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TS

1.05 V

12.5 Gb/s

192000

13619200

16 Transceiver

N/A

-

表面贴装

BGA-484

YES

484-FCBGA (23x23)

484

SMD/SMT

有

微芯片技术

1

20.6 Mbit

PolarFire

1.08 V

Tray

MPF300

活跃

BGA,

网格排列

4

PLASTIC/EPOXY

-40 °C

1.05 V

未说明

100 °C

有

MPF300TS-FCG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

0.97 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

MPF300TS

CMOS

1 V, 1.05 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

INDUSTRIAL

12.5 Gb/s

2.87 mm

现场可编程门阵列

300000

21094400

8 Transceiver

23 mm

23 mm

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

0.97 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

Tray

MPF300

活跃

1.08 V

0°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.5 Gb/s

300000

21094400

8 Transceiver