N/A

-

表面贴装

TQFP-100

YES

100

100-TQFP (14x14)

100

+ 85 C

SMD/SMT

180 MHz

有

-

90

27648 bit

ProASICPLUS

0.023175 oz

微芯片技术

PROASICPLUS

85C

INDUSTRIALC

TQFP

75000

-40C to 85C

66

75000

0.22UM

2.7(V)

2.5(V)

2.3(V)

-40C

有

3072

表面贴装

2.7 V

Tray

APA075

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

有

APA075-TQG100I

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.56

Details

1000 LE

66 I/O

2.3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

180(MHz)

S-PQFP-G100

66

不合格

2.5,2.5/3.3 V

INDUSTRIAL

5 mA

-

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

-

3072

75000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

-40 to 85 °C

Tray

A3P1000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA600

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

0 C

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

370 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

活跃

APA600

Tray

2.7 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

2.5 V

40

70 °C

有

APA600-FGG484

180 MHz

0°C ~ 70°C (TA)

Tray

APA600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B484

370

不合格

2.5,2.5/3.3 V

COMMERCIAL

15.8 kB

370

600000 GATES

2.44 mm

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

2.7 V

2.3 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

A54SX08A-2TQG100

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

127

不合格

2.5,3.3/5 V

COMMERCIAL

127

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

1.5 V

40

85 °C

有

A3P250-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

Fusion

0.014110 oz

Tray

AFS250

活跃

1.575 V

LBGA,

有

AFS250-2FGG256

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

0°C ~ 85°C (TJ)

Tray

AFS250

70 °C

0 °C

8542.39.00.01

1.5 V

compliant

4.5 kB

36864

250000

1.47059 GHz

2

6144

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS1500-1FG484I

BGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Tray

A3P125

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Industrial grade

Details

-

133 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

24

ProASIC3

PQFP

1.5000 V

125000

133

125000

表面贴装

1.575 V

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

Industrial

1

3072

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

125 °C

无

A54SX32A-1BG329M

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

278 MHz

This product may require additional documentation to export from the United States.

N

249 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-55 °C

2.5 V

30

-55°C ~ 125°C (TC)

Tray

A54SX32A

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5,3.3/5 V

MILITARY

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.5 V

272 MHz

18 kB

147456

1000000

272 MHz

1

24576

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

有

24

Actel

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

有

A54SX32-1PQG208

280 MHz

0°C ~ 70°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3,5 V

COMMERCIAL

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

2.5 V

40

125 °C

有

A54SX32A-1FGG256M

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

203 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-55 °C

-55°C ~ 125°C (TC)

Tray

A54SX32A

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,2.5/5 V

MILITARY

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

微芯片技术

BGA456,26X26,50

2.5 V

40

70 °C

有

APA1000-BGG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

0 to 70 °C

Tray

APA1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

245

1.27 mm

compliant

S-PBGA-B456

356

不合格

2.5,2.5/3.3 V

COMMERCIAL

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

180 MHz

有

40

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

Details

454 I/O

2.3 V

0 C

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

85 °C

有

A54SX72A-1FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

360 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

40

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

2.5 V

40

-40°C ~ 85°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5,3.3/5 V

INDUSTRIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

2.5 V

30

125 °C

有

A54SX72A-1FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

360 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-55 °C

-55°C ~ 125°C (TC)

Tray

A54SX72A

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5,3.3/5 V

MILITARY

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

表面贴装

BGA-329

YES

329

329-PBGA (31x31)

329

微芯片技术

N

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

240 MHz

有

27

Actel

Tray

A54SX32

活跃

3.6 V

BGA, BGA329,23X23,50

网格排列

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

85 °C

无

A54SX32-BG329I

230 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

-40°C ~ 85°C (TA)

Tray

A54SX32

85 °C

-40 °C

CMOS

3.3 V, 5 V

BOTTOM

BALL

1.27 mm

unknown

240 MHz

S-PBGA-B329

249

不合格

3.3,5 V

INDUSTRIAL

900 ps

900 ps

249

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

2880

5.5 V

4.5 V

1.8 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

AFS600

85 °C

-40 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (27X27)

400.011771 mg

微芯片技术

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

Details

360 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

217 MHz

有

-40°C ~ 85°C (TA)

Tray

A54SX72A

85 °C

-40 °C

2.5 V

217 MHz

1.5 ns

1.5 ns

6036

108000

217 MHz

6036

6036

4024

2.75 V

2.25 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

A54SX16A-2TQG144

294 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

有

0.046530 oz

Actel

60

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

FLATPACK, FINE PITCH

FQFP, QFP208,1.2SQ,20

MICROSEMI CORP

5.24

Details

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

有

24

Actel

2.75 V

Tray

A54SX32

活跃

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

A54SX32A-1PQG208

278 MHz

FQFP

SQUARE

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

A54SX32-2BG329I

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

320 MHz

有

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

30

85 °C

无

-40°C ~ 85°C (TA)

Tray

A54SX32

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

A54SX32A-2TQG100

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA750

0 to 70 °C

Tray

APA750

70 °C

0 °C

2.5 V

18 kB

147456

750000

180 MHz

STD

32768

2.7 V

2.3 V

1.73 mm

35 mm

35 mm

无