N/A

-

表面贴装

6-SMD, No Lead

100-VQFP (14x14)

Mercury United Electronics, Inc.

Strip

活跃

77

A3PN030

-40°C ~ 85°C

QuikXO

0.126 L x 0.098 W (3.20mm x 2.50mm)

TCXO

2.5V

16.8 MHz

±1ppm

LVDS

-

Crystal

22mA (Typ)

-

-

30000

-

0.067 (1.70mm)

-

N/A

-

Gold Over Nickel

28

Straight

500VDC/400VAC

36.9(mm)

19-28

-65C to 175C

Crimp

Not Required(mm)

Wall

Copper Alloy

无

(2/26)Signal

Circular

RCP

28(POS)

PIN

1(Port)

TVP

1

Nickel

无

32.74(mm)

36.9(mm)

N/A

-

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

Axial

YES

256

Axial

400.011771 mg

256

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.28

177

Compliant

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

40

1.14 V

70 °C

有

A3P600L-FGG256

350 MHz

-55°C ~ 250°C

Tape & Reel (TR)

Military, MIL-PRF-39007, RWR71S

0.187 Dia x 0.812 L (4.75mm x 20.62mm)

±1%

e1

活跃

2

±50ppm/°C

10 Ohms

锡银铜

70 °C

0 °C

Wirewound

2W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

S (0.001%)

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

13.5 kB

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

600000

781.25 MHz

13824

13824

13824

600000

Military, Moisture Resistant

1.2 mm

--

17 mm

17 mm

无

无铅

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

Axial

208

Axial

微芯片技术

Tray

APA600

Obsolete

158

Compliant

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

活跃

2

±50ppm/°C

4.48 kOhms

125 °C

-55 °C

Metal Film

0.125W, 1/8W

2.3V ~ 2.7V

180 MHz

2.5 V

S (0.001%)

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

21504

Military, Moisture Resistant, Weldable

3.4 mm

--

28 mm

28 mm

无

无铅

N/A

-

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

1152

400.011771 mg

1152

AX2000-1FGG1152

763 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.3

684

Compliant

BGA, BGA1152,34X34,40

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

1.5 V

40

1.425 V

70 °C

有

e1

锡银铜

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

245

1 mm

compliant

763 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

763 MHz

21504

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

Compliant

70 °C

0 °C

5 V

2.3 ns

2

568

无

N/A

-

YES

208

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

QFP-208

FLATPACK

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AFS250-PQ208

QFF

RECTANGULAR

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

FQFP

350 MHz

M1A3P400-PQ208

无

85 °C

1.425 V

151

Tray

M1A3P400

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

5.25

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

144

104

Non-Compliant

70 °C

0 °C

90 MHz

5 V

5.25 V

4.75 V

5 ns

684

4000

684

568

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

1152

400.011771 mg

1152

AX2000-2FG1152

870 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

684

Compliant

1 MM PITCH, FBGA-1152

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

1.5 V

20

1.425 V

70 °C

无

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

870 MHz

21504

2

21504

0.74 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

YES

84

84

A1425A-1PL84C

150 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.88

70

Non-Compliant

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

30

4.75 V

70 °C

无

e0

锡铅

70 °C

0 °C

MAX 70 I/OS

CMOS

QUAD

J BEND

225

1.27 mm

compliant

150 MHz

S-PQCC-J84

不合格

5 V

COMMERCIAL

5.25 V

4.75 V

2.6 ns

310 CLBS, 2500 GATES

4.572 mm

现场可编程门阵列

310

2500

310

2.6 ns

310

2500

29.3116 mm

29.3116 mm

N/A

-

表面贴装

325-TFBGA

325-BGA (11x11)

微芯片技术

- 40 C

970 mV

SMD/SMT

164

Tray

活跃

48000 LE

+ 125 C

1.08 V

-40°C ~ 125°C (TJ)

-

0.97V ~ 1.08V

12.5 Gb/s

48000

3774874

4 Transceiver

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

N/A

-

N/A

-

3

有

M2S050S-1VFG400I

Microsemi Corporation

活跃

MICROSEMI CORP

5.76

,

compliant

现场可编程门阵列

N/A

-

YES

1152

PLASTIC/EPOXY

网格排列

35 X 35 MM, 1 MM PITCH, FBGA-1152

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.86

M2S100-1FC1152I

无

1.14 V

未说明

1.2 V

BGA1152,34X34,40

e0

锡铅

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

表面贴装

YES

1152

1152

574

Non-Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

无

M2GL100-1FC1152

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.88

85 °C

0 °C

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

1.2 V

1.26 V

1.14 V

444 kB

574

现场可编程门阵列

99512

99512

N/A

-

YES

1152

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

未说明

1.14 V

85 °C

有

M2S100-1FCG1152

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

N/A

-