19 In Stock

• 1: ¥158.902709
• 10: ¥149.908215
• 100: ¥141.422842
• 500: ¥133.417779
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

有

310 MHz

SMD/SMT

+ 85 C

- 40 C

微芯片技术

1.425 V

96 I/O

N

1.5000 V

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-2FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.014110 oz

ProASIC3

160

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

2

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 125 C

SMD/SMT

247 MHz

微芯片技术

有

66

Actel

0.062040 oz

5.5 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1PQG100M

135 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

83 I/O

3 V

- 55 C

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

MILITARY

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

2.7 mm

20 mm

14 mm

2247 In Stock

• 1: ¥1,635.457372
• 10: ¥1,542.884318
• 100: ¥1,455.551240
• 500: ¥1,373.161551
查看所有的价格

-

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.05 mm

13 mm

13 mm

无

560 In Stock

• 1: ¥4,408.210395
• 10: ¥4,158.689053
• 100: ¥3,923.291556
• 500: ¥3,701.218454
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0 to 70 °C

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

258 In Stock

• 1: ¥460.251585
• 10: ¥434.199608
• 100: ¥409.622275
• 500: ¥386.436107
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

6500 LE

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

272 MHz

有

-

24

110592 bit

ProASIC3

1.5000 V

1.575 V

Tray

A3P600

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

45 mA

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

1

13824

600000

3.4 mm

28 mm

28 mm

2957 In Stock

• 1: ¥1,286.892067
• 10: ¥1,214.049120
• 100: ¥1,145.329356
• 500: ¥1,080.499392
查看所有的价格

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-FG484

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.73 mm

23 mm

23 mm

无

2404 In Stock

• 1: ¥886.251500
• 10: ¥836.086321
• 100: ¥788.760682
• 500: ¥744.113848
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

0 to 70 °C

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

2950 In Stock

• 1: ¥1,161.731249
• 10: ¥1,095.972879
• 100: ¥1,033.936673
• 500: ¥975.411958
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

微芯片技术

272 MHz

SMD/SMT

+ 85 C

- 40 C

1.5000 V

1.425 V

1.575 V

Tray

A3PE600

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

0.014110 oz

ProASIC3

60

-40 to 85 °C

Tray

A3PE600

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

649 MHz

微芯片技术

有

27

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

40

125 °C

有

AX1000-FGG896M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Military grade

This product may require additional documentation to export from the United States.

Details

516 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TA)

Tray

AX1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

MIL-STD-883 Class B

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

有

84

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

85 °C

无

A3PE3000-2FG324I

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

-40 to 85 °C

Tray

A3PE3000

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B324

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

含铅

2143 In Stock

• 1: ¥2,465.864767
• 10: ¥2,326.287515
• 100: ¥2,194.610861
• 500: ¥2,070.387604
查看所有的价格

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA

YES

324

400.011771 mg

324

ProASIC3

0.014110 oz

1.575 V

BGA, BGA324,18X18,40

网格排列

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

未说明

70 °C

无

A3PE3000-FG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

84

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

231 MHz

S-PBGA-B324

221

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

25 mA

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

3000000

231 MHz

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

无铅

36 In Stock

• 1: ¥446.609608
• 10: ¥421.329820
• 100: ¥397.480966
• 500: ¥374.982037
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P400-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

178 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

-40°C ~ 100°C (TJ)

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.2 mm

17 mm

17 mm

无

677 In Stock

• 1: ¥9,843.910068
• 10: ¥9,520.222502
• 25: ¥9,454.044195
• 50: ¥9,388.325916
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

有

40

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

AX1000-2FGG676I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

418 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

870 MHz

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

无

2046 In Stock

• 1: ¥1,117.220761
• 10: ¥1,053.981850
• 100: ¥994.322500
• 500: ¥938.040092
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

0 C

+ 70 C

SMD/SMT

微芯片技术

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

1.5 V

30

85 °C

无

A3P1000-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

PLASTIC/EPOXY

3

网格排列

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

This product may require additional documentation to export from the United States.

N

11000 LE

300 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

2663 In Stock

• 1: ¥2,731.806228
• 10: ¥2,577.175685
• 100: ¥2,431.297816
• 500: ¥2,293.677185
查看所有的价格

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

Details

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

Tray

M7AFS600

活跃

1.575 V

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

964 In Stock

• 1: ¥5,900.900672
• 10: ¥5,566.887430
• 100: ¥5,251.780593
• 500: ¥4,954.509995
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

8542310000, 8542390000

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

A3PE3000-FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.77

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

-40 to 85 °C

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

19 In Stock

• 1: ¥183.711771
• 10: ¥173.312989
• 100: ¥163.502820
• 500: ¥154.247948
查看所有的价格

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P250-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

157 I/O

0 to 70 °C

Tray

A3P250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

36 In Stock

• 1: ¥702.651231
• 10: ¥662.878522
• 100: ¥625.357095
• 500: ¥589.959523
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

272 MHz

微芯片技术

有

24

ProASIC3

Tray

M1A3P1000

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

28 mm

28 mm

19 In Stock

• 1: ¥81.611112
• 10: ¥76.991611
• 100: ¥72.633597
• 500: ¥68.522258
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P030-1VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

77 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

1

768

30000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

A42MX24

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-3PLG84I

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

16

Actel

0.239083 oz

5.5 V

Tray

-40°C ~ 85°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

49 In Stock

• 1: ¥115.579791
• 10: ¥109.037543
• 100: ¥102.865605
• 500: ¥97.043028
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P060-2VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

71 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

2640 In Stock

• 1: ¥2,574.280863
• 10: ¥2,428.566857
• 100: ¥2,291.100805
• 500: ¥2,161.415851
查看所有的价格

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

Details

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

Fusion

60

有

1282.05 MHz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

1

1.73 mm

23 mm

23 mm

28 In Stock

• 1: ¥576.963292
• 10: ¥544.304992
• 100: ¥513.495278
• 500: ¥484.429509
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

-40 to 85 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

2969 In Stock

• 1: ¥1,880.389832
• 10: ¥1,773.952671
• 100: ¥1,673.540258
• 500: ¥1,578.811563
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS600-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0°C ~ 85°C (TJ)

Tray

M1AFS600

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

无