N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

5.24

Details

175 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

320 MHz

有

24

Actel

Tray

A54SX16

活跃

3.6 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-2PQG208I

320 MHz

FQFP

SQUARE

活跃

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX32A-2TQG144I

313 MHz

LFQFP

-40°C ~ 85°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

INDUSTRIAL

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

203 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

Details

-40°C ~ 125°C (TA)

Tray

A54SX32A

2.5 V

48000

2880

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

TQFP-100

YES

100

100-TQFP (14x14)

100

90

27648 bit

ProASICPLUS

0.023175 oz

PROASICPLUS

85C

INDUSTRIALC

微芯片技术

TQFP

75000

-40C to 85C

66

75000

0.22UM

2.7(V)

2.5(V)

2.3(V)

-40C

有

3072

表面贴装

2.7 V

Tray

APA075

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

有

APA075-TQG100I

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.56

Details

1000 LE

66 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

-

-40°C ~ 85°C (TA)

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

180(MHz)

S-PQFP-G100

66

不合格

2.5,2.5/3.3 V

INDUSTRIAL

5 mA

-

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

-

3072

75000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

-40 °C

1.5 V

40

100 °C

有

A3P1000-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

A3P1000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

Actel

0.014110 oz

Tray

APA600

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

This product may require additional documentation to export from the United States.

Details

370 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

活跃

APA600

Tray

2.7 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

2.5 V

40

70 °C

有

APA600-FGG484

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

0°C ~ 70°C (TA)

Tray

APA600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B484

370

不合格

2.5,2.5/3.3 V

COMMERCIAL

15.8 kB

370

600000 GATES

2.44 mm

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

2.7 V

2.3 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

A54SX08A-2TQG100

313 MHz

LFQFP

SQUARE

活跃

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

127

不合格

2.5,3.3/5 V

COMMERCIAL

127

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-1VQG100

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

LBGA,

有

AFS250-2FGG256

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

Tray

AFS250

活跃

0°C ~ 85°C (TJ)

Tray

AFS250

70 °C

0 °C

8542.39.00.01

1.5 V

compliant

4.5 kB

36864

250000

1.47059 GHz

2

6144

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS1500-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Industrial grade

Details

-

133 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

24

ProASIC3

PQFP

1.5000 V

125000

133

125000

表面贴装

1.575 V

Tray

A3P125

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

Industrial

1

3072

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-FCSG325

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010TS-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

Details

56340 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL050-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.59

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

256 kB

228.3 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

56340

1869824

400 MHz

72

STD

4 Transceiver

56340

17 mm

17 mm

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

A3P1000

活跃

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL025T-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

活跃

M2GL025

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL025-1FGG484I

1.56

MICROSEMI CORP

活跃

SQUARE

BGA

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL025

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

Details

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

1.2 V

114 kB

12084

933888

STD

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

活跃

FPGA - Field Programmable Gate Array M2GL010-VFG400

MICROSEMI CORP

1.6

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

0.236938 oz

Tray

M2GL010

活跃

1.2 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL010-VFG400

LFBGA

SQUARE

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

STD

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

M2GL-EVAL-KIT

200 MHz

60

1826 kbit

IGLOO2

1.2 V

Tray

M2GL060

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL060TS

1.2 V

5 Gb/s

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

1.2 V

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

-55°C ~ 125°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

TQFP-144

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010S

1.2 V

12084

933888