N/A

-

表面贴装

YES

84

84

QCCJ, LDCC84,1.2SQ

A1240A-PL84I

无

85 °C

72

Compliant

4.5 V

66 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.84

30

5 V

-40 °C

LDCC84,1.2SQ

PLASTIC/EPOXY

3

CHIP CARRIER

e0

EAR99

锡铅

85 °C

-40 °C

PLD EQUIVALENT GATES=10000

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

J BEND

225

1.27 mm

compliant

90 MHz

S-PQCC-J84

104

不合格

5 V

INDUSTRIAL

5 ns

5 ns

104

684 CLBS, 4000 GATES

4.572 mm

现场可编程门阵列

684

4000

684

568

5 ns

684

684

5.5 V

4.5 V

4000

29.3116 mm

29.3116 mm

无

N/A

-

表面贴装

YES

100

100

Obsolete

MICROSEMI CORP

5.5 V

5.84

83

Non-Compliant

PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

QFP100,.7X.9

-40 °C

5 V

30

4.5 V

85 °C

无

A1225A-PQ100I

75 MHz

QFP

RECTANGULAR

Microsemi Corporation

e0

EAR99

锡铅

85 °C

-40 °C

PLD EQUIVALENT GATES=6250

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

225

0.65 mm

unknown

110 MHz

R-PQFP-G100

83

不合格

5 V

INDUSTRIAL

5 ns

83

451 CLBS, 2500 GATES

3.4 mm

现场可编程门阵列

451

2500

451

5 ns

451

451

5.5 V

4.5 V

2500

20 mm

14 mm

N/A

-

YES

44

44

PLASTIC, LCC-44

CHIP CARRIER

PLASTIC/EPOXY

LDCC44,.7SQ

5 V

4.75 V

70 °C

无

A1010B-1PL44C

53 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.84

LCC

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

57

不合格

5 V

COMMERCIAL

57

547 CLBS, 2000 GATES

4.572 mm

现场可编程门阵列

3.8 ns

547

295

2000

16.5862 mm

16.5862 mm

N/A

-

表面贴装

YES

208

208

95

Compliant

QFF,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1AFS600-PQG208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

e3

哑光锡

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

QUAD

FLAT

245

0.5 mm

compliant

1.0989 GHz

R-PQFP-F208

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

600000

1.0989 GHz

13824

13824

1.575 V

1.425 V

600000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

16

3 V

SMD/SMT

-

Microchip

微芯片技术

Microchip Technology / Atmel

215 MHz

Actel

Details

Tray

A42MX09

活跃

1.54

MICROSEMI CORP

活跃

SQUARE

QCCJ

117 MHz

A42MX09-PLG84I

有

85 °C

未说明

3.3 V

-40 °C

PLASTIC/EPOXY

3

CHIP CARRIER

QCCJ,

有

336 LE

72 I/O

+ 85 C

5.5 V

0.239083 oz

- 40 C

-40°C ~ 85°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

可编程逻辑集成电路

CMOS

3.3 V, 5 V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

14000

STD

2.5 ns

684

14000

FPGA - Field Programmable Gate Array

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

YES

68

68

5.5 V

8.59

8542390000/8542390000/8542390000/8542390000/8542390000

57

Compliant

PLASTIC, MS-007-AD, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1010B-2PLG68I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

e3

Matte Tin (Sn)

85 °C

-40 °C

MAX 57 I/OS

8542.39.00.01

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

3.4 ns

3.4 ns

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

1200

295

2

147

3.4 ns

295

1200

24.13 mm

24.13 mm

无

N/A

-

表面贴装

YES

132

132

84

Compliant

HVBCC,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

1.5 V

30

1.425 V

85 °C

有

A3P125-QNG132

350 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

7.57

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BUTT

260

0.5 mm

compliant

231 MHz

S-XBCC-B132

不合格

COMMERCIAL

4.5 kB

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

125000

3072

3072

1.575 V

1.425 V

125000

8 mm

8 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.2000 V

1.14 V

1.26 V

620

Tray

A3PE3000

活跃

Compliant

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

70 °C

无

A3PE3000L-FG896

0 to 70 °C

ProASIC3L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

COMMERCIAL

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

1.26 V

1.14 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

YES

44

44

5.5 V

5.79

8542390000/8542390000/8542390000/8542390000/8542390000

34

Compliant

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1020B-PLG44I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

e3

Tin (Sn)

85 °C

-40 °C

MAX 34 I/OS

8542.39.00.01

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

48 MHz

S-PQCC-J44

不合格

INDUSTRIAL

4.5 ns

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

547

2000

547

273

4.5 ns

547

5.5 V

4.5 V

2000

16.51 mm

16.51 mm

无

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

240789-100003

Pepperl Fuchs

Details

PolarFire

Microchip Technology / Atmel

SMD/SMT

0.97 V

1

- 40 C

9.210472 oz

1.08 V

+ 100 C

512 I/O

20.6 Mbit

300000 LE

This product may require additional documentation to export from the United States.

有

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

160

微芯片技术

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

101

Tray

A42MX09

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX09-3PQ160I

161 MHz

QFP

SQUARE

Microsemi Corporation

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

1.6 ns

684

14000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

SQUARE

BGA

350 MHz

235

Compliant

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

A3P600-FGG484I

1.35

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

-40°C ~ 100°C (TJ)

ProASIC3

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

231 MHz

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13.5 kB

45 mA

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

6500

110592

600000

231 MHz

STD

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

YES

729

729-PBGA (35x35)

729

微芯片技术

AX1000-2BG729

870 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

1.5000 V

1.425 V

1.575 V

516

Compliant

Tray

AX1000

活跃

BGA, BGA729,27X27,50

网格排列

3

PLASTIC/EPOXY

BGA729,27X27,50

1.5 V

30

1.425 V

70 °C

无

0 to 70 °C

Axcelerator

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.5 V

BOTTOM

BALL

225

1.27 mm

unknown

870 MHz

S-PBGA-B729

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.54 mm

现场可编程门阵列

12096

165888

1e+06

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

35 mm

35 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

APA450

活跃

2.5000 V

2.3 V

2.7 V

344

Compliant

Tray

-40 to 85 °C

ProASICPLUS

85 °C

-40 °C

2.5 V

180 MHz

13.5 kB

110592

450000

180 MHz

STD

12288

2.7 V

2.3 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

A54SX08-2FG144I

320 MHz

LBGA

SQUARE

Microsemi Corporation

GRID ARRAY, LOW PROFILE

LBGA, BGA144,12X12,40

活跃

MICROSEMI CORP

3.6 V

5.24

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

111

Tray

A54SX08

活跃

Compliant

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

3.3 V

30

3 V

85 °C

无

-40 to 85 °C

SX

e0

锡铅银

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

320 MHz

S-PBGA-B144

111

不合格

3.3,5 V

INDUSTRIAL

700 ps

700 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

320 MHz

768

768

2

256

0.7 ns

768

768

5.5 V

4.5 V

8000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

A3P400

活跃

有

54 kbit

5000 LE

55296 bit

54 kbit

+ 100 C

1.575 V

微芯片技术

- 40 C

24

1.425 V

SMD/SMT

-

Microchip

Microchip Technology / Atmel

231 MHz

ProASIC3

Details

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-PQG208I

350 MHz

FQFP

SQUARE

活跃

FPGA ProASICu00ae3 Family 400K Gates 231MHz 130nm Technology 1.5V 208-Pin PQFP Tray

MICROSEMI CORP

1.34

1.5000 V

151

Tray

-40 to 85 °C

Tray

ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

30 mA

-

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

55296

400000

STD

-

9216

400000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

244 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

8 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

300

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Non-Compliant

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

388 I/O

+ 100 C

1.08 V

2.842997 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300T

可编程逻辑集成电路

1.05 V

不适用

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094.4Kbit

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

Non-Compliant

1.08 V

1.627244 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7782.4Kbit

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

109000 LE

284 I/O

7.6 Mbit

+ 100 C

1.08 V

5.762942 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

活跃

MPF100

Tray

-40°C ~ 100°C (TJ)

Tray

MPF100T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7782.4Kbit

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

有

1500 LE

36864 bit

97 I/O

+ 85 C

1.575 V

1.304431 oz

微芯片技术

0 C

160

1.425 V

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.32

7413CWBK

Arrow-Hart

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

2 mA

-

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

125000

STD

-

3072

125000

FPGA - Field Programmable Gate Array

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Tray

A3P125

活跃

有

1500 LE

36864 bit

+ 85 C

微芯片技术

1.575 V

0.183425 oz

0 C

24

1.425 V

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.36

Miscellaneous

1.5000 V

1.425 V

1.575 V

133

0 to 70 °C

Tray

ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

2 mA

-

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

125000

STD

-

3072

125000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

1.425 V

1.575 V

252

Compliant

Tray

AFS1500

活跃

Miscellaneous

1.5000 V

-40 to 85 °C

Fusion®

85 °C

-40 °C

1.5 V

33.8 kB

276480

1.5e+06

1.47059 GHz

2

38400

1.575 V

1.425 V

1.73 mm

27 mm

27 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

484

400.011771 mg

484

MS3101A18-08S

Amphenol

235

Non-Compliant

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

108 MHz

BGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.86

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

600000

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm