N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF200TLS

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF200TL

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TLS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

388

Tray

MPF500

活跃

1.03 V/1.08 V

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF500T

0.97V ~ 1.08V

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF500TL

0.97V ~ 1.08V

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF500TS

0.97V ~ 1.08V

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

284

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF200TS

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

21094.4Kbit

8 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF200TS

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TLS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

284

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF200TL

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF300TL

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL150-FCV484I

FBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL150-1FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

STD

17 mm

17 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

1.26 V

169

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-VFG400I

LFBGA

SQUARE

活跃

IC FPGA 169 I/O 400VFBGA

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

90

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

6060

719872

STD

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

SMD/SMT

+ 85 C

0 C

微芯片技术

1.2 V

207 I/O

56520 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

IGLOO2

90

有

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

N/A

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

Tray

293

16 X 16 MM, 0.50 MM PITCH, FBGA-536

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150T-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

活跃

M2GL150

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

1

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

IGLOO2

90

有

微芯片技术

SMD/SMT

+ 100 C

- 40 C

1.2 V

195 I/O

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL010TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

12084 LE

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

195

不合格

1.2 V

1.2 V

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-1FCSG536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

IGLOO2

90

有

Details

293

Tray

M2GL150

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

138 I/O

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

活跃

M2GL010

Tray

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL010TS-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

323.3 kB

86316

2648064

STD

4 Transceiver