N/A

-

表面贴装

FBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.2 V

667 Mb/s

56520

1869824

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090T-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

FCBGA-484

YES

484-BGA

484

微芯片技术

84

IGLOO2

1.26 V

Tray

M2GL150

活跃

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

有

M2GL150-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

5.27

Details

146124 LE

248 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

667 Mb/s

3.15 mm

现场可编程门阵列

146124

5120000

4 Transceiver

19 mm

19 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

233 I/O

1.14 V

- 55 C

微芯片技术

+ 125 C

SMD/SMT

有

60

IGLOO2

0.761080 oz

1.26 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

20

125 °C

无

M2GL010T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

-55°C ~ 125°C (TJ)

Tray

M2GL010T

3A001.A.2.C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

MILITARY

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.2 V

有

M2GL060T-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

+ 85 C

SMD/SMT

有

90

IGLOO2

3 oz

1.26 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL010T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.14 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

114 kB

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL010

活跃

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL010T

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

活跃

M2GL025

Tray

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

有

M2GL025TS-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

5.27

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL010-FG484I

无

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

23 X 23 MM, 1 MM PITCH, FBGA-484

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

12084

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

85 °C

无

M2GL025-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

27696

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

有

SMD/SMT

+ 85 C

0 C

1.2 V

267 I/O

60

IGLOO2

1.2 V

活跃

M2GL060

Tray

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

60

IGLOO2

0.336343 oz

1.26 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL010-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

IGLOO2

60

Tray

M2GL010

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010TS

1.2 V

12084

933888

4 Transceiver

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL010

活跃

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

1.2 V

12084

933888

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

1.73

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL025-1FG484I

无

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL025

e0

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

有

90

IGLOO2

1.2 V

活跃

M2GL010

Tray

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL010TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.14 V

1.26 V

1.2000 V

1.2 V

-40 to 100 °C

Tray

M2GL060

1.2 V

56520

1869824

1

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL025TS-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

138 I/O

27696 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

27696

1130496

1

2 Transceiver

14 mm

14 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

SMD/SMT

有

176

IGLOO2

Tray

M2GL060

活跃

1.2 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

85 °C

有

M2GL025-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL025

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

OTHER

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

1

27696

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

IGLOO2

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090T-1FCSG325

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

0°C ~ 85°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

+ 85 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL090

活跃

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL090-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

STD

86316

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

+ 100 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL025

活跃

1.2 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL025T-VFG400I

LFBGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 27696 Cells 1.2V 400-Pin VFBGA Tray

MICROSEMI CORP

1.52

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

Tray

M2GL025

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL025T

1.2 V

27696

1130496

2 Transceiver