N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

Details

2880 LE

174 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

238 MHz

有

-

Actel

24

2.75 V

Tray

A54SX32

活跃

-40°C ~ 85°C (TA)

Tray

A54SX32A

2.5 V

900 uA

48000

2880

STD

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

3

FLATPACK, LOW PROFILE, FINE PITCH

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

0.023175 oz

Actel

90

有

167 MHz

SMD/SMT

+ 70 C

0 C

2.25 V

81 I/O

Details

Tray

A54SX16

活跃

2.75 V

70 °C

有

A54SX16A-FTQG100

167 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

40

2.5 V

TQFP100,.63SQ

PLASTIC/EPOXY

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

180

不合格

2.5,3.3/5 V

COMMERCIAL

180

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.9 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

APA300-FGG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

0.014110 oz

Actel

90

有

180 MHz

SMD/SMT

+ 85 C

- 40 C

2.3 V

186 I/O

Details

This product may require additional documentation to export from the United States.

2.7 V

Tray

APA300

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

有

-40°C ~ 85°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

INDUSTRIAL

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

3

网格排列

BGA, BGA896,30X30,40

0.014110 oz

Actel

27

有

180 MHz

SMD/SMT

+ 85 C

- 40 C

2.3 V

642 I/O

Details

This product may require additional documentation to export from the United States.

Tray

APA1000

活跃

2.7 V

5.26

MICROSEMI CORP

活跃

SQUARE

BGA

180 MHz

APA1000-FGG896I

有

85 °C

30

2.5 V

-40 °C

BGA896,30X30,40

PLASTIC/EPOXY

-40°C ~ 85°C (TA)

Tray

APA1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

245

1 mm

compliant

180 MHz

S-PBGA-B896

642

不合格

2.5,2.5/3.3 V

INDUSTRIAL

24.8 kB

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

2.7 V

2.3 V

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

A3P1000-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

PLASTIC/EPOXY

3

网格排列

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P1000

活跃

1.575 V

1.5 V

40

85 °C

有

0 to 70 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

微芯片技术

活跃

MICROSEMI CORP

5.24

Actel

40

有

320 MHz

SMD/SMT

+ 85 C

- 40 C

3 V

147 I/O

Details

3.6 V

Tray

A54SX16

活跃

LFQFP, QFP176,1.0SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-2TQG176I

320 MHz

LFQFP

SQUARE

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3,3.3/5 V

INDUSTRIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

5.23

Details

5000 LE

151 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

有

24

ProASIC3

1.575 V

Tray

A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0°C ~ 85°C (TJ)

Tray

A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

-

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

-

9216

400000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

84

微芯片技术

5.25 V

Tube

A42MX09

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-PLG84

117 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.54

Commercial grade

Details

336 LE

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

16

Actel

0.239863 oz

336

PLCC

3.3, 5 V

3 V

14000

72

14000

5.25 V

表面贴装

0 to 70 °C

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

-

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

Commercial

STD

-

516

2.5 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

活跃

MICROSEMI CORP

5.24

Details

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

156 MHz

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

40

70 °C

有

A54SX72A-FFGG484

156 MHz

BGA

SQUARE

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

2 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

Tray

APA1000

活跃

2.7 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

APA1000-PQG208

0 to 70 °C

Tray

APA1000

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

2.7 V

2.3 V

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

活跃

MICROSEMI CORP

5.24

Details

91 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.046530 oz

1.5000 V

1.575 V

Tray

A3P060

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P060-1TQG144

350 MHz

LFQFP

SQUARE

0 to 70 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

174 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

24

Actel

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

2.5 V

40

125 °C

有

A54SX32A-1PQG208M

278 MHz

-55°C ~ 125°C (TC)

Tray

A54SX32A

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5,3.3/5 V

MILITARY

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

5.24

Details

175 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

有

24

Actel

Tray

A54SX16

活跃

3.6 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

有

A54SX16P-1PQG208

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3,3.3/5 V

COMMERCIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AFS1500-2FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

223 I/O

0°C ~ 85°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

OTHER

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

Tray

A3P060

活跃

Details

91 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.046530 oz

1.5000 V

1.425 V

1.575 V

1.575 V

-40 to 85 °C

Tray

A3P060

1.5 V

18432

60000

1

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

133 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P125

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-1PQG208

350 MHz

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

1

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

85 °C

有

APA1000-PQG208I

180 MHz

FQFP

SQUARE

活跃

IC FPGA 158 I/O 208QFP

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.3 V

2.7 V

8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85

2.7 V

Tray

APA1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

-40°C ~ 85°C (TA)

Tray

APA1000

e3

3A001.A.7.A

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

INDUSTRIAL

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

2.7 V

2.3 V

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

144

有

180 MHz

PROASICPLUS

85C

Industrial

微芯片技术

FBGA

300000

-40C to 85C

100

300000

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

-40C

有

8192

表面贴装

2.7 V

Tray

APA300

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

2.5 V

40

85 °C

有

APA300-FGG144I

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

0.014110 oz

Actel

160

-40°C ~ 85°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

180(MHz)

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

INDUSTRIAL

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

有

A42MX24-PQG208I

91.8 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.27

Details

912 LE

176 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

24

Actel

3.748176 oz

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A42MX24

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

-40 to 85 °C

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

-

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

-

1410

2.5 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

微芯片技术

3.3 V

- 55 C

+ 125 C

SMD/SMT

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-256

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-1CQ256M

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

This product may require additional documentation to export from the United States.

N

202 I/O

-55°C ~ 125°C (TC)

A42MX36

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F256

不合格

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1

1822

2.3 ns

2438

5.5 V

3 V

54000

36 mm

36 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

APA150-FGG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tray

APA150

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

INDUSTRIAL

186

150000 GATES

1.8 mm

现场可编程门阵列

36864

150000

STD

6144

150000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA750

活跃

-40 to 85 °C

Tray

APA750

85 °C

-40 °C

2.5 V

180 MHz

18 kB

147456

750000

180 MHz

STD

32768

2.7 V

2.3 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

85 °C

有

A54SX32A-2PQG208I

313 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.39

Details

174 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

24

Actel

2.5000 V

2.25 V

2.75 V

Tray

A54SX32

活跃

2.75 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

-40 to 85 °C

Tray

A54SX32A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5,3.3/5 V

INDUSTRIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

2

0.9 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

活跃

MICROSEMI CORP

5.24

N

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

2.5 V

30

85 °C

无

A54SX32A-1BG329I

278 MHz

BGA

SQUARE

-40°C ~ 85°C (TA)

Tray

A54SX32A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5,3.3/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

A3P1000-1FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

-40°C ~ 100°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

1.2 mm

17 mm

17 mm