687 In Stock

• 1: ¥4,601.868691
• 10: ¥4,341.385555
• 100: ¥4,095.646750
• 500: ¥3,863.817689
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

YES

676

676-FBGA (27x27)

Polyamide

400.011771 mg

676

微芯片技术

-40 °C

1.5 V

40

1.425 V

85 °C

有

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

8 mm

8 mm

Straight

5316301

Round

Altech

Bushing Grip with Strain Relief

1.5000 V

252

Compliant

Tray

M1AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 to 85 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

Non-Metallic

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1.5e+06

1.47059 GHz

2

38400

38400

1500000

IP68

1.73 mm

27 mm

27 mm

无

2447 In Stock

• 1: ¥1,971.083029
• 10: ¥1,859.512294
• 100: ¥1,754.256878
• 500: ¥1,654.959323
查看所有的价格

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

Miscellaneous

1.5000 V

1.425 V

1.575 V

336

Tray

AX500

活跃

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

2904 In Stock

• 1: ¥1,861.846001
• 10: ¥1,756.458494
• 100: ¥1,657.036310
• 500: ¥1,563.241804
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

不锈钢

微芯片技术

(1) 120V Receptacle

P-D4R2-M5R3

Grace Technologies

1.5000 V

1.425 V

1.575 V

138

Tray

AX250

活跃

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

2

45 In Stock

• 1: ¥750.949480
• 10: ¥708.442905
• 100: ¥668.342364
• 500: ¥630.511660
查看所有的价格

-

表面贴装

80-TQFP

YES

80-VQFP (14x14)

Aluminum

80

3 V

微芯片技术

70 °C

有

48 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

3.6 V

5.26

(1) 120V Receptacle

P-D4R3-K3R3

Grace Technologies

3.3, 5 V

3 V

5.25 V

57

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

0 to 70 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

F

3.7 ns

295

3000

IP65

14 mm

14 mm

874 In Stock

• 1: ¥4,601.868691
• 10: ¥4,341.385555
• 100: ¥4,095.646750
• 500: ¥3,863.817689
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

1/4 NPT

2.5

25-400-60-psi/kPa

Lower Mount

0-60 psi

NOSHOK

1.5000 V

252

Compliant

Tray

AFS1500

活跃

-40 to 85 °C

Fusion®

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1.5e+06

1.47059 GHz

2

38400

1.73 mm

27 mm

27 mm

无

2057 In Stock

• 1: ¥1,200.945012
• 10: ¥1,132.966988
• 100: ¥1,068.836783
• 500: ¥1,008.336592
查看所有的价格

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

微芯片技术

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.61

1.2, 1.5 V

215

Tray

AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

100 °C

有

AGL600V2-CSG281I

108 MHz

-40 to 85 °C

IGLOO

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

281

S-PBGA-B281

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

10 mm

10 mm

2477 In Stock

• 1: ¥2,038.216775
• 10: ¥1,922.846011
• 100: ¥1,814.005675
• 500: ¥1,711.326104
查看所有的价格

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

无

微芯片技术

A3P1000L-FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.57

Greenlee

1.2000 V

177

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

30

1.14 V

85 °C

-40 to 85 °C

ProASIC3L

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

676

676-FBGA (27x27)

Aluminum

400.011771 mg

微芯片技术

1.575 V

252

Compliant

Tray

AFS1500

活跃

(1) Indian Receptacle

P-E5-M4RU0

Grace Technologies

1.5000 V

1.425 V

0 to 70 °C

Fusion®

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1.5e+06

1.47059 GHz

2

38400

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (27X27)

484

70 °C

无

微芯片技术

A54SX32A-FFG484

172 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

5.25

2.5000 V

2.25 V

2.75 V

249

Tray

A54SX32

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

30

2.25 V

0 to 70 °C

SX-A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

249

不合格

2.5,2.5/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.44 mm

现场可编程门阵列

48000

2880

F

1.7 ns

2880

2880

48000

27 mm

27 mm

2822 In Stock

• 1: ¥990.662016
• 10: ¥934.586806
• 100: ¥881.685665
• 500: ¥831.778933
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

70 °C

有

微芯片技术

M1A3P600L-FGG484

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

1.2000 V

1.14 V

1.26 V

235

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

0 to 70 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

235

不合格

1.5/3.3 V

COMMERCIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

23 mm

23 mm

2482 In Stock

• 1: ¥1,629.754531
• 10: ¥1,537.504274
• 100: ¥1,450.475731
• 500: ¥1,368.373333
查看所有的价格

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

100 °C

有

微芯片技术

AGL1000V2-CSG281I

108 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.28

1.2, 1.5 V

1.14 V

1.575 V

215

Tray

AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

-40 to 85 °C

IGLOO

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

281

S-PBGA-B281

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

10 mm

10 mm

2473 In Stock

• 1: ¥1,084.828479
• 10: ¥1,023.423096
• 100: ¥965.493485
• 500: ¥910.842906
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

144-LBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

2.5000 V

100

Compliant

Tray

APA075

活跃

0 to 70 °C

ProASICPLUS

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

3.4 kB

27648

75000

180 MHz

STD

3072

1.05 mm

13 mm

13 mm

无

2107 In Stock

• 1: ¥3,887.802172
• 10: ¥3,667.737900
• 100: ¥3,460.130093
• 500: ¥3,264.273672
查看所有的价格

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

有

微芯片技术

M1AFS1500-FGG676I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.5000 V

1.425 V

1.575 V

252

Tray

M1AFS1500

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

-40 to 85 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

25 mm

25 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

有

A3PE3000L-1FGG324I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.2000 V

1.14 V

1.26 V

221

Compliant

Tray

A3PE3000

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.2 V

40

1.14 V

85 °C

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

25 mA

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

1859 In Stock

• 1: ¥473.245389
• 10: ¥446.457912
• 100: ¥421.186713
• 500: ¥397.345951
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

100 °C

有

微芯片技术

A3P400-FGG144I

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

1.5000 V

1.425 V

1.575 V

97

Tray

A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

-40 to 85 °C

ProASIC3

e1

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

STD

9216

400000

13 mm

13 mm

2874 In Stock

• 1: ¥2,559.372444
• 10: ¥2,414.502304
• 100: ¥2,277.832362
• 500: ¥2,148.898454
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

248

Tray

AX250

活跃

0°C ~ 70°C (TA)

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

STD

2508 In Stock

• 1: ¥2,019.185371
• 10: ¥1,904.891862
• 100: ¥1,797.067789
• 500: ¥1,695.346975
查看所有的价格

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

微芯片技术

2.5 V

40

2.3 V

85 °C

有

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.7 V

5.3

PDG52P1200P2WM

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

2.5000 V

2.3 V

2.7 V

107

Tray

APA075

活跃

LFQFP, QFP144,.87SQ,20

-40 to 85 °C

ProASICPLUS

e3

Matte Tin (Sn)

8542.39.00.01

现场可编程门阵列

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

1,200 A

S-PQFP-G144

107

不合格

2.5,2.5/3.3 V

INDUSTRIAL

107

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

3072

75000

20 mm

20 mm

2776 In Stock

• 1: ¥2,300.306060
• 10: ¥2,170.100060
• 100: ¥2,047.264205
• 500: ¥1,931.381322
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

Cutler Hammer, Div of Eaton Co

无

1.5000 V

1.425 V

1.575 V

252

Tray

AFS1500

活跃

LGC325039B22G

CE, CSA, IEC, UL

0 to 70 °C

Fusion®

70 °C

0 °C

1.425V ~ 1.575V

250 A

1.0989 GHz

1.5 V

1.575 V

1.425 V

33.8 kB

接地故障

276480

1.5e+06

1.0989 GHz

STD

38400

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

有

240 MHz

微芯片技术

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

3.3, 5 V

3.3 V

3 V

3.6 V

DIP12-1A75-11D

Meder Electric

2.97, 4.75 V

3.63, 5.25 V

81

Tray

A54SX16

活跃

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

40

70 °C

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

COMMERCIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

STD

0.9 ns

1452

1452

16000

14 mm

14 mm

45 In Stock

• 1: ¥588.377635
• 10: ¥555.073242
• 100: ¥523.654003
• 500: ¥494.013207
查看所有的价格

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

70 °C

微芯片技术

有

48 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

3.6 V

5.26

HS3502408310D

Hollowshaft

Hollow

Danaher Controls

3.3, 5 V

57

Tray

A40MX02

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

3 V

-40 to 70 Degrees C

MX

e3

10 ft Cable

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

5~26 VDC

单端

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

F

3.7 ns

295

3000

5~26 VDC

有

IP67

不包括

20 mm

14 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

ABB

1.5000 V

165

Tray

AGLE600

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

40

1.425 V

70 °C

有

AGLE600V5-FGG256

0 to 70 °C

IGLOOe

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

165

不合格

1.5 V

COMMERCIAL

165

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

13824

600000

17 mm

17 mm

2093 In Stock

• 1: ¥2,961.893549
• 10: ¥2,794.239196
• 100: ¥2,636.074713
• 500: ¥2,486.862941
查看所有的价格

-

表面贴装

256-BGA

256-FPBGA (17x17)

微芯片技术

2.75 V

203

Tray

A54SX32

活跃

UX04355

UL

Turck

TPE

Cat 5e

2.5000 V

2.25 V

-40 to 85 °C

SX-A

RJ45

Teal

2.25V ~ 5.25V

有

48000

2880

STD

无

190 Feet

2784 In Stock

• 1: ¥2,967.678983
• 10: ¥2,799.697151
• 100: ¥2,641.223730
• 500: ¥2,491.720497
查看所有的价格

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

微芯片技术

BGA1152,34X34,40

1.2 V

1.14 V

有

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

146124 LE

+ 100 C

- 40 C

SMD/SMT

1/4 NPT

2.5

25-410-30/60-psi/bar

Lower Mount

-30 Hg-60 psi

NOSHOK

1.26 V

1.14 V

1.2000 V

574

-40 to 100 °C

IGLOO2

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

667 Mb/s

574

2.9 mm

现场可编程门阵列

146124

5120000

1

16 Transceiver

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

896

896-FBGA (31x31)

400.011771 mg

微芯片技术

Tray

APA750

活跃

1/4 NPT

2.5

25-410-30-vac/bar

Lower Mount

-30 Hg-0 psi

NOSHOK

2.5000 V

2.3 V

2.7 V

562

Compliant

-40 to 85 °C

ProASICPLUS

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

896

2.5 V

2.7 V

2.3 V

18 kB

147456

750000

180 MHz

STD

32768

1.73 mm

31 mm

31 mm

无

45 In Stock

• 1: ¥147.540877
• 10: ¥139.189503
• 100: ¥131.310858
• 500: ¥123.878167
查看所有的价格

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

1.14 V

微芯片技术

85 °C

有

VFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

2.07

CR25-100

Clarostat-Honeywell

1.2, 1.5 V

1.14 V

1.575 V

60

Tray

AGLN060

活跃

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

-40 to 85 °C

IGLOO nano

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

5 mm

5 mm