品牌是'Microchip' (5152)
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![]() | A3P125-VQG100T | Microchip | 数据表 | 361 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 1.5 V | 1.425 V | 125 °C | 有 | A3P125-VQG100T | 350 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 71 | Tray | 活跃 | A3P125 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 71 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 71 | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 125000 | AEC-Q100 | STD | 3072 | 3072 | 125000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2TQG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 144 | 1.319103 g | 144 | A54SX08-2TQG144I | 320 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | 113 | Compliant | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | e3 | 哑光锡 | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 320 MHz | S-PQFP-G144 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 1.6 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 8000 | 1.4 mm | 20 mm | 20 mm | 无 | |||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 无 | A54SX08A-2PQ208I | 313 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.31 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | e0 | Tin/Lead (Sn/Pb) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 0.9 ns | 768 | 768 | 12000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-1CQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.63 V | 5.27 | QFF, TPAK208,2.9SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK208,2.9SQ,20 | 3.3 V | 20 | 2.97 V | 70 °C | 无 | A54SX16-1CQ208 | 240 MHz | QFF | e0 | 锡铅 | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F208 | 172 | 不合格 | 3.3,5 V | COMMERCIAL | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | 现场可编程门阵列 | 0.9 ns | 1452 | 1452 | 16000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 7.67 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-VQG100 | 240 MHz | TFQFP | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 0.9 ns | 768 | 8000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN060V2-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 70 °C | 有 | AGLN060V2-VQG100 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.59 | 71 | Tray | AGLN060 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.2 V | 未说明 | 1.14 V | -20°C ~ 85°C (TJ) | IGLOO nano | e3 | Tin (Sn) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN060-Z2VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | 71 | Tray | A3PN060 | Obsolete | -20°C ~ 85°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 18432 | 60000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FFG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 167 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 2.5 V | 30 | 2.25 V | 70 °C | 无 | A54SX16A-FFG256 | TIN LEAD/TIN LEAD SILVER | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 180 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | 现场可编程门阵列 | 1.9 ns | 1452 | 1452 | 24000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-1PLG84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 6.777889 g | 84 | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.26 | 69 | Compliant | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-1PLG84 | 280 MHz | e3 | 哑光锡 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | 280 MHz | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150TS-FCSG536 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 微芯片技术 | Non-Compliant | 293 | Tray | M2GL150 | 活跃 | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 146124 | 5120000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060-1FCS325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | 网格排列 | PLASTIC/EPOXY | 1.2 V | 20 | 无 | M2GL060-1FCS325I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.26 | 200 | Tray | M2GL060 | 活跃 | 56520 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | BGA, | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 1.2 V | 现场可编程门阵列 | 56520 | 1869824 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN030V2-ZQNG48I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-1FGG256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 有 | A54SX16A-1FGG256M | 263 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.31 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -55 °C | 2.5 V | 40 | 2.25 V | 125 °C | e1 | 3A001.A.2.C | 锡银铜 | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 180 | 不合格 | 2.5,2.5/5 V | MILITARY | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | 现场可编程门阵列 | 1.2 ns | 1452 | 1452 | 24000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-FCS325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | 1.2 V | - 40 C | 1.2 V | SMD/SMT | 200 | Tray | M2GL060 | 活跃 | 56520 LE | + 100 C | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 2 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010S-TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 微芯片技术 | M2GL010 | 活跃 | 12084 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | 84 | Tray | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 12084 | 933888 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-1FCS325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 20 | 无 | M2GL025-1FCS325I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.27 | 180 | Tray | M2GL025 | 活跃 | 27696 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 278 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 40 | 2.25 V | 70 °C | 有 | A54SX08A-1PQG208 | e3 | 哑光锡 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 768 | 768 | 12000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-TQG64I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | 2.3 V | 85 °C | 有 | EX128-TQG64I | 250 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.29 | 活跃 | EX128 | Tray | 46 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | -40°C ~ 85°C (TA) | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 1 ns | 6000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA075-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | GRID ARRAY, LOW PROFILE | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 40 | 2.3 V | 70 °C | 有 | APA075-FGG144 | 180 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 1.45 | 2.5000 V | 2.3 V | 2.7 V | 100 | Tray | APA075 | 活跃 | LBGA, BGA144,12X12,40 | 0 to 70 °C | ProASICPLUS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 100 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 100 | 75000 GATES | 1.55 mm | 现场可编程门阵列 | 27648 | 75000 | STD | 3072 | 75000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | AGLP060V5-VQG176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-TQFP | YES | 176-VQFP (20x20) | 176 | FLATPACK, THIN PROFILE, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | TQFP176,.87SQ,16 | 1.5 V | 未说明 | 1.425 V | 70 °C | 有 | AGLP060V5-VQG176 | 250 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 0.9 | 1.5000 V | 1.425 V | 1.575 V | 137 | Tray | AGLP060 | 活跃 | TFQFP, TQFP176,.87SQ,16 | 0 to 70 °C | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.4 mm | compliant | S-PQFP-G176 | 137 | 不合格 | 1.5 V | COMMERCIAL | 137 | 1584 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 1584 | 18432 | 60000 | STD | 1584 | 1584 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | AGLP030V2-CS289I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 289-TFBGA, CSBGA | YES | 289-CSP (14x14) | 289 | 微芯片技术 | 1.425 V | 85 °C | 无 | AGLP030V2-CS289I | 160 MHz | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | 120 | Tray | AGLP030 | 活跃 | TFBGA, BGA289,17X17,32 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA289,17X17,32 | -40 °C | 1.5 V | 未说明 | -40°C ~ 100°C (TJ) | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | S-PBGA-B289 | 120 | 不合格 | 1.2/1.5 V | INDUSTRIAL | 120 | 792 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 792 | 30000 | STD | 792 | 792 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN125V2-ZVQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 70 °C | 无 | AGLN125V2-ZVQ100 | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.87 | 71 | Tray | AGLN125 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.2 V | 30 | 1.14 V | -20°C ~ 85°C (TJ) | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | 3072 | 125000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-2FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 无 | A54SX08A-2FG144I | 313 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 111 | 768 CLBS, 12000 GATES | 1.55 mm | 现场可编程门阵列 | 0.9 ns | 768 | 768 | 12000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLP030V2-CS201 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 201-VFBGA, CSBGA | YES | 201-CSP (8x8) | 201 | 微芯片技术 | 无 | AGLP030V2-CS201 | 160 MHz | VFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | 120 | Tray | AGLP030 | 活跃 | VFBGA, BGA201,15X15,20 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA201,15X15,20 | 1.5 V | 未说明 | 1.425 V | 70 °C | 0°C ~ 85°C (TJ) | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | unknown | S-PBGA-B201 | 120 | 不合格 | 1.2/1.5 V | COMMERCIAL | 120 | 792 CLBS, 30000 GATES | 0.99 mm | 现场可编程门阵列 | 792 | 30000 | STD | 792 | 792 | 30000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | 1.26 V | 1.388030 oz | - 40 C | 60 | 1.14 V | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL010 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 有 | M2GL010T-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | 有 | 12084 LE | 233 I/O | + 100 C | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 667 Mb/s | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | SoC FPGA | 933888 | STD | 4 Transceiver | 12084 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm |
A3P125-VQG100T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-2TQG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-1CQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN060V2-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PN060-Z2VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16A-FFG256
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-1PLG84
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL150TS-FCSG536
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060-1FCS325I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN030V2-ZQNG48I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16A-1FGG256M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060T-FCS325I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010S-TQG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025-1FCS325I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-1PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
EX128-TQG64I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA075-FGG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP060V5-VQG176
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP030V2-CS289I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN125V2-ZVQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-2FG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP030V2-CS201
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010T-FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
