N/A

-

YES

176

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

5.5 V

5.85

ARNI-889F-TOSH

Toshiba

1.40 MM HEIGHT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

30

4.5 V

85 °C

无

100 MHz

e0

锡铅

MAX 151 I/OS

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

不合格

INDUSTRIAL

848 CLBS, 6000 GATES

1.6 mm

现场可编程门阵列

3 ns

848

6000

24 mm

24 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060-FCSG325

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.54

200

Tray

M2GL060

活跃

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

BGA,

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

1.2 V

OTHER

667 Mb/s

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

154

Tray

M1A3P1000

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P1000-2PQ208

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

1000000

28 mm

28 mm

N/A

-

Resilient Mount

Open

G101

Marathon Electric

HVAC

轧钢

1,725 RPM

3

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

VFBGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.31

Miscellaneous

66

Tray

AGLN030

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.5 V

未说明

1.425 V

70 °C

有

AGLN030V5-ZCSG81

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

768

30000

5 mm

5 mm

N/A

-

YES

313

Obsolete

MICROSEMI CORP

3.6 V

5.88

PLASTIC, BGA-313

网格排列

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A14V100A-BG313C

75 MHz

BGA

SQUARE

Microsemi Corporation

e0

锡铅

MAX 228 I/OS

8542.39.00.01

CMOS

BOTTOM

BALL

225

1.27 mm

compliant

S-PBGA-B313

不合格

COMMERCIAL

1377 CLBS, 10000 GATES

2.52 mm

现场可编程门阵列

3.9 ns

1377

10000

35 mm

35 mm

N/A

-

Crouse-Hinds Industrial Produc

XJG24 SA

UL;CSA

Copper Free Aluminum

Threaded

N/A

-

YES

313

85 °C

3 V

30

3.3 V

-40 °C

BGA313,25X25,50

PLASTIC/EPOXY

3

Miscellaneous

BGA, BGA313,25X25,50

网格排列

5.24

3.6 V

MICROSEMI CORP

活跃

SQUARE

BGA

280 MHz

A54SX32-1BG313I

无

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B313

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.52 mm

现场可编程门阵列

0.8 ns

2880

2880

32000

35 mm

35 mm

N/A

-

Miscellaneous

N/A

-

HS35R20488372

CE

Hollowshaft

Hollow

Dynapar

有

-40 to 85 Degrees C

10 Pin Connector

5~26 VDC

Differential

5~26 VDC

有

IP67

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

MPF300

活跃

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

244 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

8 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

微芯片技术

284

Tray

MPF100

活跃

109000 LE

1.03 V/1.08 V

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

970 mV/1.02 V

SMD/SMT

300

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

PolarFire

Tray

MPF300

活跃

Non-Compliant

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

388 I/O

+ 100 C

1.08 V

2.842997 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

-40°C ~ 100°C (TJ)

Tray

MPF300T

可编程逻辑集成电路

0.97V ~ 1.08V

1.05 V

不适用

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094.4Kbit

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

微芯片技术

284

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

PolarFire

Tray

MPF100

活跃

Non-Compliant

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.08 V

1.627244 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

-40°C ~ 100°C (TJ)

Tray

MPF100T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7782.4Kbit

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

MPF100

活跃

有

109000 LE

284 I/O

7.6 Mbit

+ 100 C

1.08 V

5.762942 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

-40°C ~ 100°C (TJ)

Tray

MPF100T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7782.4Kbit

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

970 mV/1.02 V

SMD/SMT

300

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Cable

表面贴装

BGA-1152

1152-FCBGA (35x35)

Aluminium

Aluminium

微芯片技术

Non-Compliant

有

This product may require additional documentation to export from the United States.

481000 LE

584 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF500

活跃

0°C ~ 100°C (TJ)

Tray

MPF500T

Green

可编程逻辑集成电路

0.97V ~ 1.08V

Unshielded

MIL-DTL-38999

1 V, 1.05 V

Cadmium

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

24 Transceiver

44.704 mm

FPGA - Field Programmable Gate Array

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896-FBGA (31x31)

Metal

896

微芯片技术

MICROSEMI CORP

1.26 V

5.3

377

Compliant

Tray

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

1.14 V

有

M2GL050-1FGG896I

BGA

SQUARE

Microsemi Corporation

活跃

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B896

377

不合格

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

活跃

MICROSEMI CORP

1.26 V

5.3

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

1.14 V

有

M2GL150TS-1FCG1152I

BGA

SQUARE

Microsemi Corporation

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

387

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

56520

1869824