N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

30

125 °C

无

A3P1000-1PQ208M

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

5.24

154 I/O

1.425 V

- 55 C

+ 125 C

ProASIC3

24

有

350 MHz

SMD/SMT

11000 LE

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3P1000

Obsolete

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

-55°C ~ 125°C (TJ)

Tray

A3P1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

70 I/O

2.3 V

- 40 C

+ 125 C

SMD/SMT

250 MHz

有

90

Actel

0.023175 oz

Tray

EX128

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

40

125 °C

有

EX128-TQG100A

250 MHz

-40°C ~ 125°C (TA)

Tray

eX128

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

AUTOMOTIVE

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

STD

1 ns

6000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

100 °C

有

AGL250V5-CSG196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

Details

3000 LE

143 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

250 MHz

有

348

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

-40 to 85 °C

Tray

AGL250V5

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

INDUSTRIAL

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.2 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

A3PE600-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.76

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

-40 to 85 °C

Tray

A3PE600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

270

不合格

1.5/3.3 V

INDUSTRIAL

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

AGL250V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.52

N

3000 LE

97 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

LBGA,

-40 to 85 °C

Tray

AGL250V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

INDUSTRIAL

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

AGL250V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.35

Details

3000 LE

97 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

有

160

36864 bit

IGLOOe

0.013369 oz

1.575 V

1.425 V

Tray

AGL250

活跃

1.575 V

LBGA,

-40°C ~ 85°C (TA)

Tray

AGL250V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.5 V

1.0989 GHz

33.8 kB

276480

1500000

1.0989 GHz

STD

38400

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

无铅

N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.5 V

310 MHz

18 kB

147456

1000000

310 MHz

2

24576

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

66 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.023175 oz

2.625 V

Tray

APA150

-40°C ~ 125°C (TJ)

Tray

APA150

2.5 V

36864

150000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

2.5 V

未说明

85 °C

无

APA300-FG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.62

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

-40°C ~ 85°C (TA)

Tray

APA300

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

未说明

1 mm

unknown

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

INDUSTRIAL

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

AX2000-FGG896

649 MHz

0°C ~ 70°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

21504

21504

0.99 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-2FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

30

100 °C

无

A3P1000-PQ208I

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

7.75

This product may require additional documentation to export from the United States.

N

11000 LE

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

0.225753 oz

1.575 V

Tray

A3P1000

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 100°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

微芯片技术

70 °C

有

A42MX16-PQG160

94 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.53

Details

608 LE

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

-

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

3.3 V

未说明

85 °C

有

A42MX16-PLG84I

94 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.51

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

16

Actel

0.239083 oz

3.3, 5 V

3 V

5.5 V

Tube

A42MX16

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

-40 to 85 °C

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

微芯片技术

1.5 V

未说明

85 °C

有

AGL125V5-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

Details

1500 LE

133 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

892.86 MHz

有

348

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0 to 70 °C

Tray

AGL125V5

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

85 °C

无

A40MX02-PL44I

80 MHz

QCCJ

SQUARE

Transferred

ACTEL CORP

5.82

N

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX02

Obsolete

PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC44,.7SQ

-40 °C

3.3 V

30

-40°C ~ 85°C (TA)

Tube

A40MX02

e0

Tin/Lead (Sn/Pb)

ALSO OPERATE AT 5.0V SUPPLY

CMOS

3.3 V, 5 V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

57

不合格

3.3/5 V

INDUSTRIAL

57

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

有

AX2000-1FGG896M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

40

125 °C

-55°C ~ 125°C (TA)

Tray

AX2000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

21504

1

21504

0.84 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

70 °C

有

A3PE3000-FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

84

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

40

0°C ~ 85°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

63 kB

25 mA

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

无铅

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

2.3 V

2.5000 V

2.7 V

Tray

APA075

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

FQFP

180 MHz

APA075-PQG208I

有

85 °C

40

2.5 V

-40 °C

QFP208,1.2SQ,20

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

FQFP, QFP208,1.2SQ,20

Details

-

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

27 kbit

27 kbit

180 MHz

有

-

24

27648 bit

ProASICPLUS

2.7 V

-40 to 85 °C

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

INDUSTRIAL

5 mA

158

75000 GATES

4.1 mm

现场可编程门阵列

27648

75000

STD

3072

75000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

AGLE3000V5-FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

60

IGLOOe

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

AGLE3000

活跃

BGA, BGA484,22X22,40

网格排列

-40°C ~ 85°C (TA)

Tray

AGLE3000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

40

85 °C

有

A3PN250-2VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.61

Details

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

-40 to 85 °C

Tray

A3PN250

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

AX2000-1FGG896I

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

21504

1

21504

0.84 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

ProASIC®3

85C

Commercial

VQFP

微芯片技术

60000

0C to 85C

71

60000

130NM

1.575(V)

1.5(V)

无

1.425(V)

0C

有

1536

表面贴装

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.49

N

71 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

0°C ~ 85°C (TJ)

Tray

A3P060

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

231(MHz)

S-PQFP-G100

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

79 MHz

有

24

Actel

5.25 V

Tray

A42MX36

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-FPQG208

44 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.25

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

79 MHz

1184

1822

3.8 ns

2438

5.25 V

3 V

54000

3.4 mm

28 mm

28 mm

无