N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

30

125 °C

无

A3P1000-1PQ208M

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

11000 LE

154 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

24

ProASIC3

1.575 V

Tray

A3P1000

Obsolete

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

-55°C ~ 125°C (TJ)

Tray

A3P1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

70 I/O

2.3 V

- 40 C

+ 125 C

SMD/SMT

250 MHz

有

90

Actel

0.023175 oz

Tray

EX128

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

40

125 °C

有

EX128-TQG100A

250 MHz

-40°C ~ 125°C (TA)

Tray

eX128

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

AUTOMOTIVE

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

STD

1 ns

6000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

100 °C

有

AGL250V5-CSG196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

Details

3000 LE

143 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

250 MHz

有

348

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

-40 to 85 °C

Tray

AGL250V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

1.5 V

INDUSTRIAL

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.2 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

A3PE600-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.76

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

-40 to 85 °C

Tray

A3PE600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

270

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

AGL250V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.52

N

3000 LE

97 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

LBGA,

-40 to 85 °C

Tray

AGL250V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

1.35

活跃

SQUARE

LBGA

108 MHz

AGL250V5-FGG144I

有

100 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA,

Details

3000 LE

97 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

有

160

36864 bit

IGLOOe

0.013369 oz

1.425 V

1.575 V

Tray

AGL250

活跃

1.575 V

MICROSEMI CORP

-40°C ~ 85°C (TA)

Tray

AGL250V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.0989 GHz

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.0989 GHz

STD

38400

1.2 mm

17 mm

17 mm

无

无铅

N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.575 V

活跃

M7A3P1000

Tray

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

66 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.023175 oz

2.625 V

Tray

APA150

-40°C ~ 125°C (TJ)

Tray

APA150

2.375V ~ 2.625V

2.5 V

36864

150000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

2.5 V

未说明

85 °C

无

APA300-FG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.62

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

-40°C ~ 85°C (TA)

Tray

APA300

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

未说明

1 mm

unknown

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

AX2000-FGG896

649 MHz

0°C ~ 70°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

21504

21504

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-2FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

微芯片技术

70 °C

有

A42MX16-PQG160

94 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.53

Details

608 LE

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

-

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

30

100 °C

无

A3P1000-PQ208I

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

7.75

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

0.225753 oz

- 40 C

1.425 V

154 I/O

11000 LE

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3P1000

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 100°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

3.3 V

未说明

85 °C

有

A42MX16-PLG84I

94 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.51

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

16

Actel

0.239083 oz

3.3, 5 V

3 V

5.5 V

Tube

A42MX16

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

-40 to 85 °C

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

微芯片技术

1.5 V

未说明

85 °C

有

AGL125V5-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

Details

1500 LE

133 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

892.86 MHz

有

348

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0 to 70 °C

Tray

AGL125V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

1.5 V

OTHER

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

85 °C

无

A40MX02-PL44I

80 MHz

QCCJ

SQUARE

Transferred

ACTEL CORP

5.82

N

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX02

Obsolete

PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC44,.7SQ

-40 °C

3.3 V

30

-40°C ~ 85°C (TA)

Tube

A40MX02

e0

Tin/Lead (Sn/Pb)

ALSO OPERATE AT 5.0V SUPPLY

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

57

不合格

3.3 V, 5 V

3.3/5 V

INDUSTRIAL

57

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

有

AX2000-1FGG896M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

有

27

763 MHz

SMD/SMT

+ 125 C

- 55 C

1.425 V

586 I/O

Details

This product may require additional documentation to export from the United States.

0.014110 oz

Actel

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

40

125 °C

-55°C ~ 125°C (TA)

Tray

AX2000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

21504

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

70 °C

有

A3PE3000-FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

84

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

40

0°C ~ 85°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B324

221

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

25 mA

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

无铅

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

2.3 V

2.7 V

2.7 V

Tray

APA075

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

有

APA075-PQG208I

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

-

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

27 kbit

27 kbit

180 MHz

有

-

24

27648 bit

ProASICPLUS

2.5000 V

-40 to 85 °C

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

5 mA

158

75000 GATES

4.1 mm

现场可编程门阵列

27648

75000

STD

3072

75000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

AGLE3000V5-FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

60

IGLOOe

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

AGLE3000

活跃

BGA, BGA484,22X22,40

网格排列

-40°C ~ 85°C (TA)

Tray

AGLE3000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

40

85 °C

有

A3PN250-2VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.61

Details

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

-40 to 85 °C

Tray

A3PN250

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

1.5 V

-40 °C

BGA896,30X30,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA896,30X30,40

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

5.25

MICROSEMI CORP

活跃

SQUARE

BGA

763 MHz

AX2000-1FGG896I

有

85 °C

40

-40°C ~ 85°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

21504

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

ProASIC3

ProASIC®3

85C

Commercial

VQFP

微芯片技术

60000

0C to 85C

71

60000

130NM

1.575(V)

1.5(V)

无

1.425(V)

0C

有

1536

表面贴装

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.49

N

71 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

0°C ~ 85°C (TJ)

Tray

A3P060

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

231(MHz)

100

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

79 MHz

有

24

Actel

5.25 V

活跃

A42MX36

Tray

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-FPQG208

44 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.25

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

79 MHz

1184

1822

3.8 ns

2438

54000

3.4 mm

28 mm

28 mm

无