31 In Stock

-

表面贴装

208-BFQFP

208-PQFP (28x28)

161

-40°C~85°C TC

Tray

1997

AT40K/KLV

Obsolete

3 (168 Hours)

4.5V~5.5V

AT40K20

1024

8192

30000

Non-RoHS Compliant

含铅

1000 In Stock

-

表面贴装

表面贴装

144-LQFP

144

144-LQFP (20x20)

114

-40°C~85°C TC

Tray

1997

AT40KAL

活跃

3 (168 Hours)

85°C

-40°C

3.3V

AT40K40

2.3kB

2.3kB

2304

18432

50000

100MHz

3.6V

3V

Non-RoHS Compliant

含铅

N/A

-

表面贴装

表面贴装

132-BQFP Bumpered

132

132-BQFP (27.44x27.44)

96

0°C~70°C TC

Tray

1999

AT6000(LV)

Obsolete

3 (168 Hours)

70°C

0°C

4.75V~5.25V

AT6002

1024

6000

Non-RoHS Compliant

含铅

144 In Stock

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

78

0°C~70°C TC

Tray

1997

AT40K/KLV

活跃

3 (168 Hours)

70°C

0°C

3.3V

AT40K10

576B

576B

576

4608

20000

100MHz

Non-RoHS Compliant

含铅

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

MPF100

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

PolarFire

1

有

7.6 Mbit

1.03 V/1.08 V

244

Tray

0°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

MPF100

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

170

Tray

0°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

MPF100

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

244

Tray

-40°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

活跃

1.03 V/1.08 V

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

284

Tray

MPF100

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

176

IGLOO2

微芯片技术

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

ProASIC3

300

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

11000 LE

有

60

-55°C ~ 125°C (TJ)

Tray

A3P1000

125 °C

-55 °C

1.425V ~ 1.575V

18 kB

147456

1e+06

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

60

IGLOO2

微芯片技术

267

Tray

M2GL050

活跃

5.27

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL050TS-1FGG484

有

85 °C

1.14 V

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

Details

有

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

176

IGLOO2

微芯片技术

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

24

IGLOO2

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

无

M2GL150-1FC1152I

BGA

SQUARE

活跃

IC FPGA 574 I/O 1152FCBGA

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

27

IGLOO2

微芯片技术

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

M2GL050T-1FG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

1

56340

31 mm

31 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

24

IGLOO2

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150T-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

100-VQFP (14x14)

微芯片技术

ProASIC3

68

Tray

A3P250

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

1.425V ~ 1.575V

4.5 kB

36864

250000

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

IGLOO2

60

有

1.14 V

Details

This product may require additional documentation to export from the United States.

1.26 V

209

Tray

M2GL005

活跃

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

176

IGLOO2

200

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

N

有

-40°C ~ 100°C (TJ)

Tray

M2GL050

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

90

IGLOO2

293

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

293

Tray

M2GL150

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-FCSG536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

IGLOO2

90

有

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

IGLOO2

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

无

M2GL150TS-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

27

IGLOO2

微芯片技术

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

无

M2GL050-FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

有

24

IGLOO2

微芯片技术

1.2000 V

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

1.14 V

85 °C

有

M2GL150T-FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

0 to 85 °C

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL005S-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

IGLOO2

微芯片技术

293

Tray

M2GL150

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150-FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000