品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 连接器类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 内存大小 | 电缆长度 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
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![]() | AT40K20-2DQI | Microchip Technology | 数据表 | 35 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 161 | -40°C~85°C TC | Tray | 1997 | AT40K/KLV | Obsolete | 3 (168 Hours) | 4.5V~5.5V | AT40K20 | 1024 | 8192 | 30000 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT40K40AL-1BQI | Microchip Technology | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-LQFP (20x20) | 114 | -40°C~85°C TC | Tray | 1997 | AT40KAL | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3V~3.6V | AT40K40 | 3.3V | 3.6V | 3V | 2.3kB | 2.3kB | 2304 | 18432 | 50000 | 100MHz | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT6002-4QC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 132-BQFP Bumpered | 132 | 132-BQFP (27.44x27.44) | 96 | 0°C~70°C TC | Tray | 1999 | AT6000(LV) | Obsolete | 3 (168 Hours) | 70°C | 0°C | 4.75V~5.25V | AT6002 | 5V | 1024 | 6000 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT40K10-2AQC | Microchip Technology | 数据表 | 144 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-TQFP (14x14) | 78 | 0°C~70°C TC | Tray | 1997 | AT40K/KLV | 活跃 | 3 (168 Hours) | 70°C | 0°C | 4.75V~5.25V | AT40K10 | 3.3V | 576B | 576B | 576 | 4608 | 20000 | 100MHz | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-9215602MYC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 51 | Non-Compliant | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Crimp | D-Sub | 125 °C | -55 °C | 5 V | 12 mm | 5.2 ns | 1 | 998 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF050TL-FCSG325E | Microchip Technology | 数据表 | 103 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCS-325 | 325-BGA (11x11) | 微芯片技术 | + 100 C | SMD/SMT | 500 MHz | 1 | 3.6 MB | 1.03 V/1.08 V | Tray | 活跃 | 48000 LE | 176 I/O | 970 mV/1.02 V | 0 C | 0°C ~ 100°C (TJ) | Tray | - | 0.97V ~ 1.08V | 1 V, 1.05 V | 3774874 | 48000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-TQ144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-144 | 144-TQFP (20x20) | 微芯片技术 | N | 100 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 231 MHz | 有 | 60 | ProASIC3 | 0.046530 oz | 1.575 V | Tray | A3P125 | Obsolete | -40°C ~ 100°C (TJ) | Tray | A3P125 | 1.425V ~ 1.575V | 1.5 V | 36864 | 125000 | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090TS-1FGG676T2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-676 | 676-FBGA (27x27) | 微芯片技术 | 40 | 2586 kbit | IGLOO2 | 1.2000 V | 1.2 V | Tray | M2GL090 | 活跃 | , | 未说明 | 有 | M2GL090TS-1FGG676T2 | 活跃 | MICROSEMI CORP | 2.4 | This product may require additional documentation to export from the United States. | Details | 86184 LE | 425 I/O | 1.2 V | - 40 C | + 125 C | SMD/SMT | M2GL-EVAL-KIT | 200 MHz | -40 to 125 °C | Tray | M2GL090TS | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 1.2 V | 3.125 Gb/s | 现场可编程门阵列 | 86316 | 2648064 | 1 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-FGG256M | Microchip Technology | 数据表 | 784 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | 微芯片技术 | - 55 C | + 125 C | SMD/SMT | 180 MHz | 有 | 90 | Actel | 0.014110 oz | 2.7 V | Tray | APA600 | 活跃 | This product may require additional documentation to export from the United States. | Details | 186 I/O | 2.3 V | -55°C ~ 125°C (TC) | Tray | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | 21504 | 1.2 mm | 17 mm | 17 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | eX128-PTQG100I | Microchip Technology | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 90 | Actel | 微芯片技术 | 0.023175 oz | 2.7 V | Tray | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 85 °C | 有 | EX128-PTQG100I | 357 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.59 | Details | 70 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 有 | -40°C ~ 85°C (TA) | Tray | eX128 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 0.7 ns | 6000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-FG896 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 896-FBGA (31x31) | 896 | + 70 C | SMD/SMT | 180 MHz | 有 | 微芯片技术 | 27 | Actel | 0.014110 oz | Tray | APA1000 | 活跃 | 2.7 V | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 2.5 V | 30 | 70 °C | 无 | APA1000-FG896 | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | N | 642 I/O | 2.3 V | 0 C | 0°C ~ 70°C (TA) | Tray | APA1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 642 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 642 | 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-2FG484I | Microchip Technology | 数据表 | 506 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 有 | 微芯片技术 | 60 | Actel | 0.014110 oz | Tray | AX1000 | 活跃 | 1.575 V | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 30 | 85 °C | 无 | AX1000-2FG484I | 870 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | N | 317 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 870 MHz | -40°C ~ 85°C (TA) | Tray | AX1000 | e0 | 锡铅 | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B484 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||
![]() | AX1000-FG676 | Microchip Technology | 数据表 | 514 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.5 V | 30 | 70 °C | 无 | AX1000-FG676 | 649 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | This product may require additional documentation to export from the United States. | N | 418 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 649 MHz | 有 | 0°C ~ 70°C (TA) | Tray | AX1000 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||
![]() | APA600-FG484A | Microchip Technology | 数据表 | 621 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | 微芯片技术 | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 60 | Actel | 0.014110 oz | Tray | APA600 | 活跃 | 2.625 V | This product may require additional documentation to export from the United States. | N | 370 I/O | 2.375 V | -40°C ~ 125°C (TJ) | Tray | APA600 | 125 °C | -40 °C | 2.375V ~ 2.625V | 2.5 V | 2.625 V | 2.375 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-FG676 | Microchip Technology | 数据表 | 631 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 676 | 676-FBGA (27x27) | 400.011771 mg | 微芯片技术 | 454 I/O | 2.3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 40 | Actel | 0.014110 oz | 2.5000 V | 2.7 V | Tray | APA600 | 活跃 | This product may require additional documentation to export from the United States. | N | 0 to 70 °C | Tray | APA600 | 70 °C | 0 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-BG456 | Microchip Technology | 数据表 | 806 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | BGA-456 | 456 | 456-PBGA (35x35) | 微芯片技术 | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | 2.7 V | Tray | APA750 | 活跃 | This product may require additional documentation to export from the United States. | N | 356 I/O | 2.3 V | 0°C ~ 70°C (TA) | Tray | APA750 | 70 °C | 0 °C | 2.3V ~ 2.7V | 2.5 V | 2.7 V | 2.3 V | 18 kB | 147456 | 750000 | 180 MHz | STD | 32768 | 1.73 mm | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA450-FG256A | Microchip Technology | 数据表 | 2653 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | Actel | 0.014110 oz | 2.625 V | Tray | APA450 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | PLASTIC/EPOXY | BGA256,16X16,40 | 无 | APA450-FG256A | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.61 | This product may require additional documentation to export from the United States. | N | 186 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 90 | -40°C ~ 125°C (TJ) | Tray | APA450 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | 186 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | 186 | 现场可编程门阵列 | 110592 | 450000 | STD | 12288 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-BG456I | Microchip Technology | 数据表 | 868 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | BGA-456 | YES | 456 | 456-PBGA (35x35) | 456 | SMD/SMT | 180 MHz | 有 | 微芯片技术 | 24 | Actel | 2.5000 V | 2.3 V | 2.7 V | 2.7 V | Tray | APA750 | 活跃 | BGA, BGA456,26X26,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA456,26X26,50 | -40 °C | 2.5 V | 30 | 85 °C | 无 | APA750-BG456I | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | N | 356 I/O | 2.3 V | - 40 C | + 85 C | -40 to 85 °C | Tray | APA750 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180 MHz | 456 | S-PBGA-B456 | 356 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 18 kB | 356 | 750000 GATES | 2.54 mm | 现场可编程门阵列 | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 750000 | 1.73 mm | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | APA450-FG144 | Microchip Technology | 数据表 | 2951 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | + 70 C | SMD/SMT | 180 MHz | 有 | 微芯片技术 | 160 | Actel | 0.014110 oz | 2.7 V | Tray | APA450 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 30 | 70 °C | 无 | APA450-FG144 | 180 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | N | 100 I/O | 2.3 V | 0 C | 0°C ~ 70°C (TA) | Tray | APA450 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | 100 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 100 | 450000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 450000 | STD | 12288 | 450000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA300-CQ208B | Microchip Technology | 数据表 | 593 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-208 | YES | 208-CQFP (75x75) | 208 | + 125 C | SMD/SMT | 5 MHz | 有 | 微芯片技术 | 1 | Actel | 2.5 V | Tray | APA300 | 活跃 | GQFF, TPAK208,2.9SQ,20 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | TPAK208,2.9SQ,20 | -55 °C | 2.5 V | 20 | 125 °C | 无 | APA300-CQ208B | 180 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | Military grade | This product may require additional documentation to export from the United States. | N | 158 I/O | 2.5 V | - 55 C | -55°C ~ 125°C (TJ) | Bulk | APA300 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 158 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 158 | 300000 GATES | 3.3 mm | 现场可编程门阵列 | 73728 | 300000 | MIL-STD-883 Class B | 8192 | 300000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1FG676M | Microchip Technology | 数据表 | 520 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 763 MHz | 有 | 微芯片技术 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | -55 °C | 1.5 V | 30 | 125 °C | 无 | AX1000-1FG676M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | This product may require additional documentation to export from the United States. | N | 418 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | 含铅 | |||||||||||||||||||||||||||
![]() | A42MX36-CQ256B | Microchip Technology | 数据表 | 647 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-256 | YES | 256 | 256-CQFP (75x75) | 256 | 微芯片技术 | Actel | Tray | A42MX36 | 活跃 | 3.3 V | GQFF, | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 3.3 V | 20 | 125 °C | 无 | A42MX36-CQ256B | 73 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.19 | QFP | Military grade | This product may require additional documentation to export from the United States. | N | 202 I/O | 3.3 V | - 55 C | + 125 C | SMD/SMT | 有 | 1 | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 256 | S-CQFP-F256 | 不合格 | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 2560 | 54000 | MIL-STD-883 | 1822 | 2.7 ns | 2438 | 54000 | 36 mm | 36 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-1CQ256B | Microchip Technology | 数据表 | 553 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-256 | YES | 256 | 256-CQFP (75x75) | 256 | 微芯片技术 | Actel | 3.3 V | Tray | A42MX36 | 活跃 | GQFF, | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 3.3 V | 20 | 125 °C | 无 | A42MX36-1CQ256B | 83 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.19 | QFP | Military grade | This product may require additional documentation to export from the United States. | N | 202 I/O | 3.3 V | - 55 C | + 125 C | SMD/SMT | 有 | 1 | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 256 | S-CQFP-F256 | 不合格 | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 2560 | 54000 | MIL-STD-883 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 36 mm | 36 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-FG144I | Microchip Technology | 数据表 | 2588 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 有 | 微芯片技术 | 160 | Actel | 0.014110 oz | 2.7 V | Tray | APA150 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | 5.26 | MICROSEMI CORP | 活跃 | SQUARE | LBGA | 180 MHz | APA150-FG144I | 无 | 85 °C | 30 | 2.5 V | -40 °C | BGA144,12X12,40 | PLASTIC/EPOXY | This product may require additional documentation to export from the United States. | N | 100 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 180 MHz | -40°C ~ 85°C (TA) | Tray | APA150 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | not_compliant | 180 MHz | S-PBGA-B144 | 100 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 4.5 kB | 100 | 150000 GATES | 1.55 mm | 现场可编程门阵列 | 36864 | 150000 | 180 MHz | 6144 | 6144 | 150000 | 1.05 mm | 13 mm | 13 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||
![]() | AX2000-2FG896 | Microchip Technology | 数据表 | 819 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 896 | 896-FBGA (31x31) | 400.011771 mg | 微芯片技术 | 0 C | + 70 C | SMD/SMT | 870 MHz | 有 | 27 | Actel | 0.014110 oz | 1.575 V | Tray | AX2000 | 活跃 | This product may require additional documentation to export from the United States. | N | 586 I/O | 1.425 V | 0°C ~ 70°C (TA) | Tray | AX2000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 870 MHz | 1.5 V | 1.575 V | 1.425 V | 36 kB | 740 ps | 740 ps | 21504 | 294912 | 2000000 | 870 MHz | 32256 | 21504 | 2 | 21504 | 1.73 mm | 31 mm | 31 mm | 无 |
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