对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

触点镀层

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

工作电源电流

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

无铅

MPF500TS-FC784M
MPF500TS-FC784M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

784-BBGA, FCBGA

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

970 mV/1.02 V

1

388

Tray

活跃

1.03 V/1.08 V

-55°C ~ 125°C (TJ)

Tray

MPF500TS

0.97V ~ 1.08V

1.05 V

481000

34603008

A3PN060-1VQ100
A3PN060-1VQ100
Microchip Technology 数据表

7 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

90

微芯片技术

ProASIC3 nano

1.575 V

Tray

A3PN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

A3PN060-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

-20°C ~ 85°C (TJ)

Tray

A3PN060

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

AFS600-2FGG256
AFS600-2FGG256
Microchip Technology 数据表

2672 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

1470.59 MHz

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

AFS600-2FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

AFS600-2FGG256I
AFS600-2FGG256I
Microchip Technology 数据表

2705 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

AFS600-2FGG256I

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

90

Fusion

-40°C ~ 100°C (TJ)

Tray

AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

MPF200TS-FCS325M
MPF200TS-FCS325M
Microchip Technology 数据表

180 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

325-TFBGA

325-BGA (11x11)

微芯片技术

+ 125 C

SMD/SMT

1

1.08 V

Tray

活跃

This product may require additional documentation to export from the United States.

192000 LE

170 I/O

0.97 V

- 55 C

-55°C ~ 125°C (TJ)

Tray

MPF200TS

0.97V ~ 1.08V

1.05 V

12.5 Gb/s

192000

13946061

4 Transceiver

MPF050TL-FCSG325E
MPF050TL-FCSG325E
Microchip Technology 数据表

103 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

0 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

0°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

A3P125-TQ144I
A3P125-TQ144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

N

100 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

60

ProASIC3

0.046530 oz

1.575 V

Tray

A3P125

Obsolete

-40°C ~ 100°C (TJ)

Tray

A3P125

1.425V ~ 1.575V

1.5 V

36864

125000

1.4 mm

20 mm

20 mm

M2GL090TS-1FGG676T2
M2GL090TS-1FGG676T2
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

200 MHz

40

2586 kbit

IGLOO2

1.2000 V

1.2 V

Tray

M2GL090

活跃

,

未说明

M2GL090TS-1FGG676T2

活跃

MICROSEMI CORP

2.4

This product may require additional documentation to export from the United States.

Details

86184 LE

425 I/O

1.2 V

- 40 C

+ 125 C

SMD/SMT

M2GL-EVAL-KIT

-40 to 125 °C

Tray

M2GL090TS

1.14V ~ 2.625V

未说明

compliant

1.2 V

3.125 Gb/s

现场可编程门阵列

86316

2648064

1

4 Transceiver

APA600-FGG256M
APA600-FGG256M
Microchip Technology 数据表

784 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

90

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

Details

186 I/O

-55°C ~ 125°C (TC)

Tray

APA600

125 °C

-55 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

21504

1.2 mm

17 mm

17 mm

eX128-PTQG100I
eX128-PTQG100I
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

90

Actel

微芯片技术

0.023175 oz

2.7 V

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

EX128-PTQG100I

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

70 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

eX128

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

0.7 ns

6000

1.4 mm

14 mm

14 mm

APA1000-FG896
APA1000-FG896
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

896-FBGA (31x31)

896

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

27

Actel

0.014110 oz

Tray

APA1000

活跃

2.7 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

2.5 V

30

70 °C

APA1000-FG896

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

642 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

642

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

31 mm

31 mm

AX1000-2FG484I
AX1000-2FG484I
Microchip Technology 数据表

506 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

870 MHz

微芯片技术

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

AX1000-2FG484I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

AX1000

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

AX1000-FG676
AX1000-FG676
Microchip Technology 数据表

514 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

AX1000-FG676

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

0°C ~ 70°C (TA)

Tray

AX1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

APA600-FG484A
APA600-FG484A
Microchip Technology 数据表

621 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

60

Actel

0.014110 oz

Tray

APA600

活跃

2.625 V

This product may require additional documentation to export from the United States.

N

370 I/O

-40°C ~ 125°C (TJ)

Tray

APA600

125 °C

-40 °C

2.375V ~ 2.625V

2.5 V

2.625 V

2.375 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

23 mm

23 mm

APA600-FG676
APA600-FG676
Microchip Technology 数据表

631 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

N

454 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

40

Actel

0.014110 oz

2.5000 V

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

APA600

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

27 mm

27 mm

APA750-BG456
APA750-BG456
Microchip Technology 数据表

806 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

24

Actel

2.7 V

Tray

APA750

活跃

This product may require additional documentation to export from the United States.

N

356 I/O

0°C ~ 70°C (TA)

Tray

APA750

70 °C

0 °C

2.3V ~ 2.7V

2.5 V

2.7 V

2.3 V

18 kB

147456

750000

180 MHz

STD

32768

1.73 mm

35 mm

35 mm

APA450-FG256A
APA450-FG256A
Microchip Technology 数据表

2653 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

90

Actel

0.014110 oz

2.625 V

Tray

APA450

活跃

BGA, BGA256,16X16,40

网格排列

PLASTIC/EPOXY

BGA256,16X16,40

APA450-FG256A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

N

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

-40°C ~ 125°C (TJ)

Tray

APA450

8542.39.00.01

CMOS

2.375V ~ 2.625V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

186

现场可编程门阵列

110592

450000

STD

12288

1.2 mm

17 mm

17 mm

APA750-BG456I
APA750-BG456I
Microchip Technology 数据表

868 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

Lead, Silver, Tin

表面贴装

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

+ 85 C

SMD/SMT

180 MHz

微芯片技术

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA750

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-40 °C

2.5 V

30

85 °C

APA750-BG456I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 40 C

-40 to 85 °C

Tray

APA750

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1.27 mm

unknown

180 MHz

456

S-PBGA-B456

356

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

18 kB

356

750000 GATES

2.54 mm

现场可编程门阵列

147456

750000

180 MHz

STD

32768

32768

750000

1.73 mm

35 mm

35 mm

APA450-FG144
APA450-FG144
Microchip Technology 数据表

2951 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

160

Actel

0.014110 oz

2.7 V

Tray

APA450

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

30

70 °C

APA450-FG144

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA450

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

100

450000 GATES

1.55 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.05 mm

13 mm

13 mm

APA300-CQ208B
APA300-CQ208B
Microchip Technology 数据表

593 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

- 55 C

+ 125 C

SMD/SMT

5 MHz

微芯片技术

1

Actel

2.5 V

Tray

APA300

活跃

GQFF, TPAK208,2.9SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

2.5 V

20

125 °C

APA300-CQ208B

180 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.29

Military grade

This product may require additional documentation to export from the United States.

N

158 I/O

2.5 V

-55°C ~ 125°C (TJ)

Bulk

APA300

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

158

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

158

300000 GATES

3.3 mm

现场可编程门阵列

73728

300000

MIL-STD-883 Class B

8192

300000

29.21 mm

29.21 mm

AX1000-1FG676M
AX1000-1FG676M
Microchip Technology 数据表

520 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

SMD/SMT

763 MHz

微芯片技术

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-55 °C

1.5 V

30

125 °C

AX1000-1FG676M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

- 55 C

+ 125 C

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

20.3 kB

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

含铅

A42MX36-CQ256B
A42MX36-CQ256B
Microchip Technology 数据表

647 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

1

微芯片技术

Actel

Tray

A42MX36

活跃

3.3 V

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

A42MX36-CQ256B

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

Military grade

This product may require additional documentation to export from the United States.

N

202 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TJ)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

256

S-CQFP-F256

不合格

3.3 V

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

2560

54000

MIL-STD-883

1822

2.7 ns

2438

54000

36 mm

36 mm

A42MX36-1CQ256B
A42MX36-1CQ256B
Microchip Technology 数据表

553 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

1

微芯片技术

Actel

3.3 V

Tray

A42MX36

活跃

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

A42MX36-1CQ256B

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

Military grade

This product may require additional documentation to export from the United States.

N

202 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TJ)

A42MX36

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

256

S-CQFP-F256

不合格

3.3 V

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

2560

54000

MIL-STD-883

1

1822

2.3 ns

2438

54000

36 mm

36 mm

APA150-FG144I
APA150-FG144I
Microchip Technology 数据表

2588 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

180 MHz

微芯片技术

160

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

5.26

MICROSEMI CORP

活跃

SQUARE

LBGA

180 MHz

APA150-FG144I

85 °C

30

2.5 V

-40 °C

BGA144,12X12,40

PLASTIC/EPOXY

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

APA150

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

not_compliant

180 MHz

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

4.5 kB

100

150000 GATES

1.55 mm

现场可编程门阵列

36864

150000

180 MHz

6144

6144

150000

1.05 mm

13 mm

13 mm

含铅

AX2000-2FG896
AX2000-2FG896
Microchip Technology 数据表

819 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

896

896-FBGA (31x31)

400.011771 mg

微芯片技术

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

This product may require additional documentation to export from the United States.

N

586 I/O

0°C ~ 70°C (TA)

Tray

AX2000

70 °C

0 °C

1.425V ~ 1.575V

870 MHz

1.5 V

1.575 V

1.425 V

36 kB

740 ps

740 ps

21504

294912

2000000

870 MHz

32256

21504

2

21504

1.73 mm

31 mm

31 mm