品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 内存大小 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 速度等级 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 长度 | 宽度 | |||||||||||||||||||||||||
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![]() | A54SX16P-TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 70 °C | 无 | A54SX16P-TQ176 | 240 MHz | QFP | SQUARE | Microsemi Corporation | 终身购买 | MICROSEMI CORP | 5.84 | 有 | QFP, QFP176,1.0SQ,20 | FLATPACK | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G176 | 147 | 不合格 | 3.3,3.3/5 V | COMMERCIAL | 147 | 现场可编程门阵列 | 1452 | |||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-FPQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | 有 | 174 | Tray | A54SX32A | Obsolete | 0°C ~ 70°C (TA) | SX-A | 2.25V ~ 5.25V | 48000 | 2880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL1000V2-FGG256T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256 | 5.75 | 147456 | Compliant | 3 | 30 | 有 | AGL1000V2-FGG256T | Microsemi Corporation | 活跃 | MICROSEMI CORP | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 250 | compliant | 18 kB | 现场可编程门阵列 | 24576 | 1e+06 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-2TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 113 | Tray | A54SX32 | Obsolete | 1.40 MM HEIGHT, MO-136, TQFP-144 | 微芯片技术 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX32-2TQ144I | 320 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | -40°C ~ 85°C (TA) | SX | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G144 | 不合格 | INDUSTRIAL | 2880 CLBS, 32000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 0.7 ns | 2880 | 32000 | 20 mm | 20 mm | |||||||||||||||||
![]() | RT4G150-CGG1657E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | 活跃 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010S-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 144 | Tray | Obsolete | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL010S-1TQ144 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.57 | 84 | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | 现场可编程门阵列 | 12084 | 933888 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P1000L-FGG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||
![]() | M1A3P1000L-1FGG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | M1A3P1000L-1FGG484 | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | BGA, BGA484,22X22,40 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | COMMERCIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | M1A3P600L-1FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P600L-1FGG256I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.26 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||
![]() | M1A3P600L-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P600L-1PQG208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||
![]() | M1A3P400-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 100 °C | 有 | M1A3P400-1FGG484I | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | BGA, | 网格排列 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | 现场可编程门阵列 | 9216 | 400000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||
![]() | M1A3P600L-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P600L-PQG208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||
![]() | M1AFS250-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | MICROSEMI CORP | Obsolete | Microsemi Corporation | RECTANGULAR | QFF | M1AFS250-2PQG208I | 有 | 85 °C | 1.425 V | 40 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | FLATPACK | QFF, | 5.82 | 1.575 V | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 250000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | M1AFS600-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS600-1PQG208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | QFF, | FLATPACK | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | M1AFS250-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS250-1PQG208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | QFF, | FLATPACK | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 250000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | M1AFS250-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS250-2PQ208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | QFF, | FLATPACK | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 250000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | M1AFS600-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS600-1PQG208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | QFF, | FLATPACK | 3 | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||
![]() | M7AFS600-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | PLASTIC/EPOXY | 5.8 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | FQFP | M7AFS600-PQG208I | 有 | 85 °C | 1.425 V | 40 | 1.5 V | -40 °C | FQFP, | FLATPACK, FINE PITCH | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||
![]() | M2GL005S-TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | FLATPACK, LOW PROFILE, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 无 | M2GL005S-TQ144I | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.57 | 84 | Tray | Obsolete | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | 1.6 mm | 现场可编程门阵列 | 6060 | 719872 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||
![]() | M1A3P600L-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 30 | 1.14 V | 70 °C | 无 | M1A3P600L-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | COMMERCIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||
![]() | M1AFS600-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS600-1PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | QFF, | FLATPACK | 3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||
![]() | AGL060V2-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 71 | Tray | AGL060 | 活跃 | TFQFP, | 微芯片技术 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 未说明 | 1.14 V | 100 °C | 有 | AGL060V2-VQG100I | 108 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.61 | -40°C ~ 85°C (TA) | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 14 mm | 14 mm | |||||||||||||||||
![]() | AGLN020V5-QNG68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | Tray | AGLN020 | 活跃 | HVQCCN, | 微芯片技术 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | UNSPECIFIED | -20 °C | 1.5 V | 未说明 | 1.425 V | 70 °C | 有 | AGLN020V5-QNG68 | HVQCCN | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.47 | 49 | -20°C ~ 85°C (TJ) | IGLOO nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 无铅 | 未说明 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | OTHER | 520 CLBS, 20000 GATES | 1 mm | 现场可编程门阵列 | 520 | 20000 | STD | 520 | 20000 | 8 mm | 8 mm | |||||||||||||||||||||
![]() | A54SX16-2TQG176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-LQFP | YES | 176-TQFP (24x24) | 176 | 147 | Tray | A54SX16 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | 微芯片技术 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A54SX16-2TQG176I | 320 MHz | 5.24 | 3.6 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | LFQFP | -40°C ~ 85°C (TA) | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3,5 V | INDUSTRIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 2 | 0.7 ns | 1452 | 1452 | 16000 | 24 mm | 24 mm | ||||||||||
![]() | A54SX32A-2BG329I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 329-BBGA | YES | 329-PBGA (31x31) | 329 | 249 | Tray | A54SX32 | 活跃 | BGA, BGA329,23X23,50 | 微芯片技术 | 网格排列 | 3 | PLASTIC/EPOXY | BGA329,23X23,50 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX32A-2BG329I | 313 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.75 V | 1.57 | -40°C ~ 85°C (TA) | SX-A | e0 | 锡铅 | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | unknown | S-PBGA-B329 | 249 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 249 | 2880 CLBS, 48000 GATES | 2.7 mm | 现场可编程门阵列 | 48000 | 2880 | 2 | 0.9 ns | 2880 | 2880 | 48000 | 31 mm | 31 mm |
A54SX16P-TQ176
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-FPQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL1000V2-FGG256T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-2TQ144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
RT4G150-CGG1657E
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010S-1TQ144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-1FGG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-1FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-1PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P400-1FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-2PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-1PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-1PQG208I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-1PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7AFS600-PQG208I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-TQ144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-1PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL060V2-VQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN020V5-QNG68
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-2TQG176I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-2BG329I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
