N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

20

1.14 V

85 °C

无

M2GL050-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

0 C

+ 85 C

SMD/SMT

有

微芯片技术

40

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL090

活跃

3

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

网格排列

BGA, BGA676,26X26,40

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

85 °C

有

M2GL090T-FGG676

This product may require additional documentation to export from the United States.

Details

86184 LE

425 I/O

1.2 V

0 to 85 °C

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

STD

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

Details

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

有

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

85 °C

无

M2GL025T-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

2 Transceiver

27696

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

有

M2GL150TS-1FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

3.45 V

1.14 V

625 kB

3.15 mm

现场可编程门阵列

146124

5120000

240

100 °C

3.15 mm

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

未说明

85 °C

无

M2GL025-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

BGA

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

0°C ~ 85°C (TJ)

Tray

M2GL025

无

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

未说明

0.8 mm

compliant

400

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

1.26 V

1.14 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

27696

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025TS-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

1.2 V

20

无

M2GL005S-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

169

Tray

M2GL005

活跃

1.26 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

6060

719872

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

IGLOO2

Tray

M2GL005

活跃

1.26 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL005-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

6060 LE

171 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

90

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

128 kB

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

6060

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

BGA896,30X30,40

1.2 V

20

1.14 V

无

M2GL050-1FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

27

IGLOO2

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

M2GL050

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

60

IGLOO2

267

Tray

M2GL050

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

1.14 V

85 °C

有

M2GL150-FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

1.2000 V

1.14 V

1.26 V

574

0 to 85 °C

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

有

微芯片技术

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL090TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

323.3 kB

86316

2648064

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

1.14 V

无

M2GL050TS-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

有

微芯片技术

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL010TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL005-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

1.14 V

有

60

IGLOO2

209

1.26 V

Tray

M2GL005

活跃

BGA, BGA484,22X22,40

网格排列

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

87.9 kB

209

2.44 mm

现场可编程门阵列

6060

719872

1

6060

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

N

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

574

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

N

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

1.2 V

20

无

M2GL005-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

This product may require additional documentation to export from the United States.

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

1.14V ~ 2.625V

56340

1869824

1

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000