N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

N

3000 LE

143 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

250 MHz

有

348

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

5.3

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

100 °C

无

AGL250V2-CS196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

AGL250V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

INDUSTRIAL

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

0.7 mm

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

215

1.5 V

Tray

M1AGL600

活跃

10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

100 °C

有

M1AGL600V2-CSG281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

1.2 V

有

184

IGLOOe

1.2, 1.5 V

1.2 V

1.5 V

-40 to 85 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B281

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

160

IGLOOe

1.575 V

1.475 V

1.5000 V

Tray

M1AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

0 to 70 °C

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

OTHER

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN250-1VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1282.05 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

1

38400

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VQFP-176

YES

176-VQFP (20x20)

176

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

60

IGLOO PLUS

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGLP060

活跃

1.575 V

TFQFP, TQFP176,.87SQ,16

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP176,.87SQ,16

1.5 V

未说明

70 °C

有

AGLP060V2-VQG176

160 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

137 I/O

0 to 70 °C

Tray

AGLP060V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G176

137

不合格

1.2/1.5 V

COMMERCIAL

20 uA

137

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

20 mm

20 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-1FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0°C ~ 85°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

33.8 kB

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

1.26 V

1.26 V

Tray

M1A3P600

活跃

This product may require additional documentation to export from the United States.

Details

235 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

0 to 70 °C

Tray

M1A3P600L

1.2 V

110592

600000

1

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

SMD/SMT

250 MHz

微芯片技术

有

160

IGLOOe

Tray

M1AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1AGL1000V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

5.26

MICROSEMI CORP

活跃

SQUARE

TFQFP

A3PN125-VQ100I

无

N

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

M1A3PE3000L-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PN250

活跃

30

1.5 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE, FINE PITCH

TFQFP,

85 °C

无

A3PN250-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

Details

3000 LE

143 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

348

36864 bit

IGLOOe

0.260886 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

未说明

85 °C

有

AGL250V5-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

AGL250V5

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

20 uA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

Tray

M1A3P1000

活跃

1.575 V

5.23

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

M1A3P1000-FGG144M

有

125 °C

40

1.5 V

-55 °C

BGA144,12X12,40

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA, BGA144,12X12,40

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e1

3A001.A.2.C

锡银铜

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN250-2VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP

YES

196-CSP (8x8)

196

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

348

IGLOOe

1.575 V

1.14 V

1.2, 1.5 V

1.575 V

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL400V2-CS196

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

143 I/O

1.14 V

0 to 70 °C

Tray

AGL400V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

OTHER

27 uA

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN250-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

- 20 C

1.425 V

微芯片技术

71 I/O

Details

Tray

A3PN060

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN060-2VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

ProASIC3 nano

90

有

350 MHz

SMD/SMT

+ 70 C

-20°C ~ 85°C (TJ)

Tray

A3PN060

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

+ 100 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

1.575 V

Tray

AGLN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

85 °C

无

AGLN060V2-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

700 LE

71 I/O

1.14 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

AGLN060V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.2 V to 1.5 V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

-

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

60

ProASIC3

微芯片技术

0.014110 oz

35000 LE

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

A3PE3000L-1FG484M

250 MHz

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3 Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology

MICROSEMI CORP

5.29

341 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

63 kB

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

-

75264

75264

75264

1.575 V

1.14 V

3000000

23 mm

23 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

N

微芯片技术

This product may require additional documentation to export from the United States.

90

IGLOOe

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

有

250 MHz

SMD/SMT

+ 70 C

0 C

177 I/O

11000 LE

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

0.017637 oz

1.575 V

Tray

A3PN060

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PN060-VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.4

Details

700 LE

71 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

A3PN060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425 V to 1.575 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

-

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver