N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

Obsolete

77

Tray

A3PN030

-20°C ~ 85°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

30000

N/A

-

N/A

-

N/A

-

N/A

-

YES

144

Obsolete

20

5.88

无

1.575 V

1.425 V

1.5 V

3

A2F060M3E-TQ144I

Microsemi Corporation

MICROSEMI CORP

80 MHz

PLASTIC/EPOXY

LFQFP

20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, TQFP-144

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

33

不合格

1.5,1.8,2.5,3.3 V

33

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

1536

1536

60000

20 mm

20 mm

N/A

-

YES

208

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

FQFP, QFP208,1.2SQ,20

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

40

5.81

有

1.575 V

1.425 V

1.5 V

350 MHz

MICROSEMI CORP

Microsemi Corporation

A3PE600-1PQG208I

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

N/A

-

YES

484

5.27

30

Obsolete

网格排列

SQUARE

BGA484,22X22,40

BGA, BGA484,22X22,40

BGA

PLASTIC/EPOXY

-40 °C

85 °C

3

A3P1000L-1FG484I

Microsemi Corporation

MICROSEMI CORP

350 MHz

1.2 V

1.14 V

1.575 V

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

144

125 °C

-55 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

40

5.6

有

3.6 V

3 V

3.3 V

240 MHz

MICROSEMI CORP

Microsemi Corporation

A54SX16P-TQG144M

3

e3

3A001.A.2.C

哑光锡

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

MILITARY

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.9 ns

1452

16000

20 mm

20 mm

N/A

-

N/A

-

YES

256

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

30

5.82

有

1.575 V

1.425 V

1.5 V

100 MHz

MICROSEMI CORP

Microsemi Corporation

A2F060M3E-1FGG256I

3

PLASTIC/EPOXY

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

66

1536 CLBS, 60000 GATES

1.7 mm

现场可编程门阵列

1536

1536

60000

17 mm

17 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

Obsolete

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

2.5 V

30

2.25 V

125 °C

无

A54SX16A-1TQ144M

263 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

113

Tray

A54SX16A

-55°C ~ 125°C (TC)

SX-A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

MILITARY

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

20 mm

20 mm

N/A

-

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

1.2 V

20

1.14 V

85 °C

无

M2GL005-1TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

84

Tray

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

748-FBGA

748-FBGA (23x23)

微芯片技术

Tray

活跃

56500 LE

+ 85 C

0 C

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 1.26V

56520

1869824

N/A

-

YES

1152

5.88

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

无

M2GL100-FC1152

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

,

3

有

M2S025S-1VFG400I

Microsemi Corporation

活跃

MICROSEMI CORP

5.78

compliant

现场可编程门阵列

N/A

-

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

784-BBGA, FCBGA

784-FCBGA (29x29)

微芯片技术

活跃

388

Tray

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

N/A

-

N/A

-

N/A

-

YES

100

3.3 V

40

3 V

85 °C

有

A54SX16-2VQG100I

320 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

0.7 ns

1452

16000

14 mm

14 mm

N/A

-

YES

144

BGA144,12X12,40

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX16A-1FG144I

263 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.32

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

e0

Tin/Lead/Silver (Sn/Pb/Ag)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.2 ns

1452

1452

24000

13 mm

13 mm