品牌是'Microchip' (5152)
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![]() | A3P250-VQ100I | Microchip | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | VQFP-100 | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Tray | A3P250 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P250-VQ100I | 350 MHz | TFQFP | SQUARE | 活跃 | FPGA - Field Programmable Gate Array ProASIC3 | MICROSEMI CORP | 1.48 | 1.5000 V | 1.425 V | 1.575 V | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | 68 | Non-Compliant | 有 | 3000 LE | + 100 C | 1.575 V | 0.017813 oz | - 40 C | 90 | -40 to 85 °C | Tray | A3P250 | e0 | TIN/LEAD (SN/PB) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 231 MHz | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 231 MHz | STD | - | 6144 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | 无 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025T-1FG484M | Microchip | 数据表 | 2021 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | + 125 C | 1.26 V | 0.396232 oz | - 55 C | 60 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | N | Tray | M2GL025 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 27696 LE | 267 I/O | -55°C ~ 125°C (TJ) | Tray | M2GL025T | 100 ppm/K | 43.2 kOhm | 可编程逻辑集成电路 | 0.1 W | 1.14V ~ 2.625V | 通用型 | 1.2 V | 667 Mb/s | 27696 | FPGA - Field Programmable Gate Array | 1130496 | 4 Transceiver | 1 | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-2PQG208I | Microchip | 数据表 | 1 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Tray | A3P600 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P600-2PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 1.5000 V | 1.425 V | 1.575 V | 154 | Compliant | 有 | 7000 LE | + 100 C | 1.575 V | 1.230085 oz | - 40 C | 24 | 1.425 V | SMD/SMT | Microchip | -40 to 85 °C | Tray | A3P600 | e3 | 100 ppm/K | 63.4 kOhm | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | 0.0625 W | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | 通用型 | compliant | 310 MHz | S-PQFP-G208 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | - | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 110592 | 600000 | 310 MHz | 2 | - | 1 | 13824 | 13824 | 600000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050T-1FG484I | Microchip | 数据表 | 2396 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | M2GL050 | 活跃 | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 1.14 V | 无 | M2GL050T-1FG484I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.29 | 267 | Tray | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | 100 ppm/K | 33.2 Ohm | Tin/Lead (Sn/Pb) | 现场可编程门阵列 | 0.125 W | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | 通用型 | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 267 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 1 | 1 | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | - 55 C | 60 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | N | Tray | M2GL090 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 86316 | 267 I/O | + 125 C | 1.26 V | -55°C ~ 125°C (TJ) | Tray | M2GL090T | 可编程逻辑集成电路 | 1.14V ~ 2.625V | 1.2 V | 667 Mb/s | 86184 | SoC FPGA | 2648064 | 4 Transceiver | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P400-FGG256I | Microchip | 数据表 | 1807 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 1.575 V | 0.014110 oz | 微芯片技术 | - 40 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P400-FGG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | 500 V | 1.5000 V | 1.425 V | 1.575 V | 178 | Tray | A3P400 | 活跃 | 有 | 5000 LE | + 100 C | -40 to 85 °C | Tray | ProASIC3 | e1 | 3A001.A.7.B | 100 ppm/°C | 150 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | 250 mW | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | 厚膜 | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | - | 9216 CLBS, 400000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 55296 | 400000 | STD | - | 1 | 9216 | 400000 | FPGA - Field Programmable Gate Array | 3.2 mm | 1.6 mm | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A3P600-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | 154 | Compliant | Tray | A3P600 | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 不合格 | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 110592 | 600000 | 231 MHz | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-PQG208I | Microchip | 数据表 | 600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 350 MHz | ProASIC3 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P600-PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | 154 | Tray | A3P600 | 活跃 | Compliant | 有 | 7000 LE | 110592 bit | + 100 C | 1.575 V | 1 oz | - 40 C | 24 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | - | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 6500 | FPGA - Field Programmable Gate Array | 110592 | 600000 | 231 MHz | STD | - | 13824 | 13824 | 600000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-VQG100I | Microchip | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | VQFP100 | + 100 C | 1.575 V | 微芯片技术 | 0.017637 oz | - 40 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | 2048 | FLASH | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P250-VQG100I | 350 MHz | TFQFP | SQUARE | 活跃 | FPGA - Field Programmable Gate Array ProASIC3 | MICROSEMI CORP | 1.29 | 1.5000 V | 1.425 V | 1.575 V | 68 | Tray | A3P250 | 活跃 | MSL 3 - 168 hours | 有 | 3000 LE | 36864 bit | -40 to 85 °C | Tray | ProASIC3 | e3 | 3A001.A.7.B | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 231 MHz | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 30 mA | 3 mA | 4.5 kB | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 231 MHz | STD | - | 6144 | 6144 | 100 °C | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | APA075-TQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | 100-TQFP (14x14) | 微芯片技术 | 66 | Tray | APA075 | Obsolete | 0°C ~ 70°C (TA) | ProASICPLUS | 2.3V ~ 2.7V | 27648 | 75000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-TQG100I | Microchip | 数据表 | 2802 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | Microchip Technology / Atmel | 180 MHz | Actel | Details | LFQFP, QFP100,.63SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | -40 °C | 2.5 V | 40 | 85 °C | 有 | APA150-TQG100I | 180 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.58 | 66 | Tray | APA150 | 活跃 | 有 | 2000 LE | + 85 C | 2.7 V | 0.023175 oz | - 40 C | 90 | 2.3 V | SMD/SMT | Microchip | -40°C ~ 85°C (TA) | Tray | ProASICPLUS | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 66 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | - | 66 | 150000 GATES | 1.6 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 4 | 36864 | 150000 | STD | - | 6144 | 75 | 150000 | FPGA - Field Programmable Gate Array | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-TQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 66 | Tray | APA150 | Obsolete | 0.50 MM PITCH, TQFP-100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | 2.5 V | 30 | 2.3 V | 70 °C | 无 | APA150-TQ100 | 180 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.32 | 0°C ~ 70°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G100 | 66 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 66 | 150000 GATES | 1.6 mm | 现场可编程门阵列 | 36864 | 150000 | 6144 | 150000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA075-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 107 | Tray | APA075 | Obsolete | 0.50 MM PITCH, TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 2.5 V | 30 | 2.3 V | 70 °C | 无 | APA075-TQ144 | 180 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.31 | 0°C ~ 70°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G144 | 107 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 107 | 75000 GATES | 1.6 mm | 现场可编程门阵列 | 27648 | 75000 | 3072 | 75000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V2-FGG144 | Microchip | 数据表 | 141 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | 有 | 3000 LE | 36864 bit | 97 I/O | + 85 C | 1.575 V | 微芯片技术 | 0.152790 oz | 0 C | 160 | 1.14 V | SMD/SMT | - | Microchip | Microchip Technology / Atmel | 526.32 MHz, 892.86 MHz | IGLOOe | Details | Tray | AGL250 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 85 °C | 有 | AGL250V2-FGG144 | 108 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.36 | ±3 ppm/Year | 48 MHz | Fundamental | 表面贴装 | 1.2, 1.5 V | 1.14 V | 1.575 V | -10 to 60 °C | Tray | AGL250V2 | e1 | Crystal | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 10 ppm | 4 | S-PBGA-B144 | 不合格 | 1.2 V to 1.5 V | OTHER | 18 pF | ±10 ppm | - | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V5-VQ100I | Microchip | 数据表 | 145 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 892.86 MHz | IGLOOe | N | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | AGL250V5-VQ100I | 108 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 1.425 V | 1.575 V | 68 | Tray | AGL250 | 活跃 | 有 | 3000 LE | + 100 C | 1.575 V | 0.594778 oz | - 40 C | 90 | -40°C ~ 85°C (TA) | Tray | IGLOO | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-1PQ100I | Microchip | 数据表 | 46 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | 83 | Tray | A42MX16 | Obsolete | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-1PQ100I | 108 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.22 | QFP | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 100 | Tray | A3P125 | Obsolete | LFQFP, | 5.25 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | LFQFP | 350 MHz | A3P125-1TQ144 | 无 | 85 °C | 1.425 V | 30 | 1.5 V | PLASTIC/EPOXY | 3 | FLATPACK, LOW PROFILE, FINE PITCH | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.6 mm | 现场可编程门阵列 | 36864 | 125000 | 3072 | 125000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RT4G150-CGG1657V | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | CE, CSA, UL | PDG26M0035VFFL | Bulk | 活跃 | Panel | Cutler Hammer, Div of Eaton Corp | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 35 A | 151824 | 5325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P030-VQG100I | Microchip | 数据表 | 88 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P030 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P030-VQG100I | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.36 | Honeywell-Microswitch | 1.5000 V | 1.425 V | 1.575 V | 有 | 330 LE | 77 I/O | + 100 C | 1.575 V | - 40 C | 90 | 1.425 V | SMD/SMT | -40 to 85 °C | Tray | A3P030 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | 15 mA | - | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 30000 | STD | - | 768 | 30000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-1FGG676 | Microchip | 数据表 | 2036 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | Tray | AX500 | 活跃 | VH7441CT+3003B | Johnson Controls | 1.5000 V | 1.425 V | 1.575 V | 336 | 0 to 70 °C | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600-2FG256I | Microchip | 数据表 | 2591 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 5.29 | GE - General Electric | 1.5000 V | 1.425 V | 1.575 V | 165 | Tray | A3PE600 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A3PE600-2FG256I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | -40 to 85 °C | ProASIC3E | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLE600V2-FG256I | Microchip | 数据表 | 2018 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | U-92501 | Turck | 1.2, 1.5 V | 1.14 V | 1.575 V | 165 | Tray | AGLE600 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | 250 MHz | BGA | -40 to 85 °C | IGLOOe | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | 165 | 不合格 | 1.2/1.5 V | INDUSTRIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN010-2QNG48I | Microchip | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | 微芯片技术 | 3 | Miscellaneous | 1.5000 V | 1.425 V | 1.575 V | 34 | Tray | A3PN010 | 活跃 | 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48 | CHIP CARRIER, HEAT SINK/SLUG | 5.26 | 1.575 V | MICROSEMI CORP | 活跃 | SQUARE | HQCCN | A3PN010-2QNG48I | 有 | 85 °C | 1.425 V | 30 | 1.5 V | -40 °C | UNSPECIFIED | -40 to 85 °C | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 无铅 | 260 | 0.4 mm | compliant | S-XQCC-N48 | 不合格 | INDUSTRIAL | 260 CLBS, 10000 GATES | 现场可编程门阵列 | 10000 | 2 | 260 | 10000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-PQG208I | Microchip | 数据表 | 2882 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Momentary | 10250T30R | CE, CSA, UL | Cutler Hammer, Div of Eaton Co | 1.5000 V | 1.425 V | 1.575 V | 115 | Tray | AX500 | 活跃 | -40 to 85 °C | Axcelerator | 1.425V ~ 1.575V | Screw | 73728 | 500000 | 8064 | STD | 1NO, 1NC | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS1500-1FGG676I | Microchip | 数据表 | 638 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771 mg | 微芯片技术 | 1.5000 V | 1.425 V | 1.575 V | 252 | Compliant | Tray | M1AFS1500 | 活跃 | VH7441RT+3008D | Johnson Controls | -40 to 85 °C | Fusion® | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1.5e+06 | 1.28205 GHz | 1 | 38400 | 1.73 mm | 27 mm | 27 mm | 无 |
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