N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

Details

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

Details

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090TS

1.2 V

86184

2648064

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

Tray

M2GL025

活跃

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL025T-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

27696

1130496

1

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

60

IGLOO2

微芯片技术

1.2000 V

1.14 V

1.26 V

Tray

M2GL025

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL025T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

-40 to 100 °C

Tray

M2GL025T

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

无

M2GL060-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

现场可编程门阵列

56520

1869824

N/A

-

表面贴装

VFBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

活跃

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL005-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

Details

6060 LE

161 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.26 V

Tray

M2GL005

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B256

667 Mb/s

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL010TS-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B256

1.56 mm

现场可编程门阵列

12084

933888

1

2 Transceiver

14 mm

14 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

N

56520 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060TS-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

24

ProASIC3

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

-40 to 85 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

有

84

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

A3PE3000

活跃

1.26 V

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.2 V

30

70 °C

无

A3PE3000L-1FG324

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

221 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

0 to 70 °C

Tray

A3PE3000L

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.2/1.5,1.2/3.3 V

COMMERCIAL

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

1.26 V

1.14 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE3000-1FGG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

84

0 to 70 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

不合格

COMMERCIAL

63 kB

25 mA

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS600-2FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

0°C ~ 85°C (TJ)

Tray

M1AFS600

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

11000 LE

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

A3P1000L-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

有

90

ProASIC3

1.5000 V

微芯片技术

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-2VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P600L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

-40 to 85 °C

Tray

M1A3P600L

e0

锡铅银

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL600V2-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

1.575 V

Tray

0°C ~ 70°C (TA)

Tray

M1AGL600V2

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.14 V

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

0 C

+ 70 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

微芯片技术

FBGA

1.5000 V

1.425 V

600000

97

600000

1.575 V

表面贴装

Tray

M1AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AGL600V5-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Commercial grade

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 to 70 °C

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

Commercial

STD

13824

13824

1.575 V

1.425 V

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P600L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 to 70 °C

Tray

M1A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

0.014110 oz

微芯片技术

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL600V2-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

0 to 70 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.14 V

600000

1.2 mm

17 mm

17 mm

无铅

N/A

-

表面贴装

CSP

YES

281-CSP (10x10)

281

有

184

微芯片技术

IGLOOe

Tray

AGL1000

活跃

1.575 V

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL1000V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

11000 LE

215 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

250 MHz

0°C ~ 70°C (TA)

Tray

AGL1000V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

不合格

OTHER

44 uA

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

11000 LE

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

A3P1000L-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

1.5000 V

1.575 V

Tray

A3PE3000

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

ProASIC3

84

有

310 MHz

0 to 70 °C

Tray

A3PE3000

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

不合格

COMMERCIAL

63 kB

25 mA

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

1.575 V

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

Tray

M1AFS1500

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

272 MHz

有

40

ProASIC3

微芯片技术

0.014110 oz

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

M1A3PE1500-1FG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm