N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

- 55 C

+ 125 C

SMD/SMT

180 MHz

微芯片技术

有

160

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

2.5 V

40

125 °C

有

APA300-FGG144M

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

-55°C ~ 125°C (TC)

Tray

APA300

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

MILITARY

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

8192

300000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

+ 125 C

SMD/SMT

250 MHz

微芯片技术

有

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

2.5 V

20

125 °C

无

A54SX72A-1CQ208B

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

-55°C ~ 125°C (TJ)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5,3.3/5 V

MILITARY

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

MIL-STD-883 Class B

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

-

160

Actel

0.014110 oz

2.625 V

Tray

APA075

活跃

BGA, BGA144,12X12,40

网格排列

PLASTIC/EPOXY

BGA144,12X12,40

无

APA075-FG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

N

-

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

-40°C ~ 125°C (TJ)

Tray

APA075

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

100

现场可编程门阵列

27648

75000

STD

3072

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

90

Fusion

0.014110 oz

活跃

AFS250

Tray

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AFS250-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

0°C ~ 85°C (TJ)

Tray

AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

1.575 V

1.425 V

250000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.5 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

90

Actel

0.014110 oz

Tray

APA450

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

APA450-FG256

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

0 C

0°C ~ 70°C (TA)

Tray

APA450

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

COMMERCIAL

186

450000 GATES

1.8 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

90

Actel

0.014110 oz

2.7 V

Tray

APA300

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

APA300-FGG256

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

0 C

0°C ~ 70°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

COMMERCIAL

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

表面贴装

CQFP

YES

208

208-CQFP (75x75)

10.567001 g

208

微芯片技术

有

1

Actel

0.372740 oz

3.6 V

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

3.3 V

20

125 °C

无

A54SX32-CQ208M

205 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

174 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

205 MHz

-55°C ~ 125°C (TC)

A54SX32

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

FLAT

225

0.5 mm

unknown

205 MHz

S-CQFP-F208

246

不合格

3.3,5 V

MILITARY

1 ns

1 ns

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

2880

48000

205 MHz

2880

2880

1080

1 ns

2880

2880

5.5 V

4.5 V

32000

2.8 mm

29.21 mm

29.21 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

24

27648 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA075

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

APA075-PQG208

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

1000 LE

0 to 70 °C

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

5 mA

-

158

75000 GATES

4.1 mm

现场可编程门阵列

27648

75000

STD

-

3072

75000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

Actel

0.014110 oz

Tray

APA450

活跃

2.625 V

BGA, BGA144,12X12,40

网格排列

PLASTIC/EPOXY

BGA144,12X12,40

无

APA450-FG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

N

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

160

-40°C ~ 125°C (TJ)

Tray

APA450

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

100

现场可编程门阵列

110592

450000

STD

12288

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

N

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.5 V

1.0989 GHz

13.5 kB

110592

600000

1.0989 GHz

STD

13824

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

AX1000-FGG484

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

151 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

24

36864 bit

ProASIC3

0.198628 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0.76

Details

3000 LE

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

3 mA

-

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

STD

-

6144

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

Details

96 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

0°C ~ 85°C (TJ)

Tray

A3P060

1.5 V

18432

60000

1

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS1500-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

60

-40°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

有

微芯片技术

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

有

A54SX32-2BGG329

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

320 MHz

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

240 MHz

微芯片技术

有

24

Actel

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

3.3 V

40

125 °C

有

A54SX32-PQG208M

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

174 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

Tray

A54SX32

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

240 MHz

S-PQFP-G208

174

不合格

3.3,5 V

MILITARY

900 ps

900 ps

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

5.5 V

4.5 V

32000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

LGA-624

YES

624

624-CLGA (32.5x32.5)

624

微芯片技术

Tray

APA1000

活跃

BGA,

网格排列

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

未说明

2.3 V

125 °C

无

APA1000-LG624M

BGA

SQUARE

活跃

MICROSEMI CORP

2.7 V

5.26

Military grade

This product may require additional documentation to export from the United States.

N

440 I/O

- 55 C

+ 125 C

SMD/SMT

150 MHz

有

1

Actel

-55°C ~ 125°C (TC)

APA1000

3A001.A.2.C

125 °C

-55 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

未说明

compliant

S-CBGA-B624

不合格

MILITARY

24.8 kB

5 mA

1000000 GATES

现场可编程门阵列

202752

1000000

150 MHz

MIL-STD-883 Class B

56320

1000000

无

N/A

-

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA450

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

40

70 °C

有

APA450-BGG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

344 I/O

2.3 V

0 to 70 °C

Tray

APA450

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

245

1.27 mm

compliant

S-PBGA-B456

344

不合格

2.5,2.5/3.3 V

COMMERCIAL

344

450000 GATES

2.54 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

Details

356 I/O

-40 to 85 °C

Tray

APA600

85 °C

-40 °C

2.5 V

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

有

微芯片技术

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

有

A54SX32-1BGG329

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.28205 GHz

1

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

有

微芯片技术

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

2.5 V

40

70 °C

有

A54SX32A-2BGG329

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

313 MHz

有

微芯片技术

27

Actel

2.75 V

Tray

A54SX32

活跃

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

2.5 V

40

85 °C

有

A54SX32A-2BGG329I

Details

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5,3.3/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-1PQG160

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

101 I/O

3 V

0 C

+ 70 C

SMD/SMT

247 MHz

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm