N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

70 °C

有

EX256-TQG100

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

512 LE

81 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

-

90

Actel

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

0°C ~ 70°C (TA)

Tray

EX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

COMMERCIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

1 ns

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

A54SX32-1BGG329I

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

280 MHz

有

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

1.5000 V

Tray

A3P125

活跃

1.575 V

Details

-

100 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

60

ProASIC3

0.046530 oz

-40 to 85 °C

Tray

A3P125

1.5 V

36864

125000

1

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

MICROSEMI CORP

1.63

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

AFS1500-FGG484I

BGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

AFS1500

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

1.0989 GHz

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.0989 GHz

STD

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

APA600

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

370 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

2.5000 V

2.3 V

2.7 V

Tray

-40 to 85 °C

Tray

APA600

85 °C

-40 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-100

YES

100

100-PQFP (20x14)

100

247 MHz

有

66

Actel

0.062040 oz

42MX

85C

INDUSTRIALC

PQFP

微芯片技术

14000

-40C to 85C

83

14000

336

0.45UM

5.5(V)

3.3/5(V)

无

3(V)

-40C

有

336

516

表面贴装

5.5 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-1PQG100I

135 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

1.55

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

148/247(MHz)

R-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

2.3 V

2.7 V

Tray

APA450

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

344 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

-40 to 85 °C

Tray

APA450

2.5 V

110592

450000

STD

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

A54SX72A-2FG484

294 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

30

70 °C

无

0°C ~ 70°C (TA)

Tray

A54SX72A

e0

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

360

不合格

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

24

-

有

180 MHz

126 kbit

126 kbit

SMD/SMT

+ 85 C

- 40 C

2.3 V

158 I/O

7000 LE

Details

2.5000 V

2.3 V

2.7 V

Tray

APA600

活跃

2.7 V

ProASICPLUS

129024 bit

-40 to 85 °C

Tray

APA600

2.5 V

5 mA

-

129024

600000

STD

-

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

70 °C

有

APA300-FGG144

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.7 V

Tray

APA300

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

40

0°C ~ 70°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

COMMERCIAL

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS600-2FG484I

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

85 °C

有

A54SX72A-2FGG256I

294 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

294 MHz

有

90

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

-40°C ~ 85°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,3.3/5 V

INDUSTRIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

85 °C

有

A3P1000-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

0°C ~ 85°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

A54SX32A-2FGG256

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

90

Actel

0.014110 oz

Tray

A54SX32

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

Copper, Silver, Tin

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

APA450

70 °C

0 °C

2.5 V

180 MHz

13.5 kB

110592

450000

180 MHz

STD

12288

2.7 V

2.3 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

微芯片技术

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

147 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

有

40

Actel

3.6 V

Tray

A54SX16

活跃

LFQFP, QFP176,1.0SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

40

70 °C

有

A54SX16P-TQG176

240 MHz

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3,3.3/5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.9 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

198 MHz

有

16

Actel

0.239083 oz

5.25 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-1PLG84

108 MHz

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

40

85 °C

有

A3P400-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.34

Details

5000 LE

151 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

有

24

55296 bit

ProASIC3

0.183425 oz

1.5000 V

Tray

A3P400

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

0 to 70 °C

Tray

A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

3 mA

-

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

STD

-

9216

400000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

AFS250-1FGG256I

-40°C ~ 100°C (TJ)

Tray

AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

1.575 V

1.425 V

250000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

A54SX32-2PQG208I

320 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

320 MHz

有

24

Actel

Tray

A54SX32

活跃

3.6 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3,5 V

INDUSTRIAL

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-100

100

100-TQFP (14x14)

657.000198 mg

微芯片技术

238 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX32

活跃

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A54SX32A

70 °C

0 °C

2.5 V

238 MHz

1.2 ns

1.2 ns

1800

48000

238 MHz

2880

2880

1980

2.75 V

2.25 V

1.4 mm

14 mm

14 mm

无

无铅

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

A40MX02-1PLG44I

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

Tray

M7A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7A3P1000-1FGG144

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

85 °C

有

A54SX32A-1FGG256I

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

90

Actel

0.014110 oz

Tray

A54SX32

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

40

-40°C ~ 85°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,2.5/5 V

INDUSTRIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm