品牌是'Microchip' (873)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 阀门数量 | 速度等级 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 等效门数 | 闪光大小 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||||||
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![]() | A2F500M3G-FG484 | Microchip Technology | 数据表 | 2140 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 500000 | 1.575 V | Tray | A2F500 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 80 MHz | - | - | 64 kB | 6000 LE | 204 I/O | 0 C | + 85 C | 有 | - | 60 | SmartFusion | 1.5000 V | 1.425 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FG256 | Microchip Technology | 数据表 | 2208 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-256 | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 500000 | 1.575 V | Tray | A2F500 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 80 MHz | - | - | 64 kB | 6000 LE | 117 I/O | 0 C | + 85 C | 有 | - | 90 | SmartFusion | 1.5000 V | 1.425 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1FGG484 | Microchip Technology | 数据表 | 2857 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | 267 | Tray | 微芯片技术 | M2S025 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S025TS-1FGG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | A2F200M3F-1CS288 | Microchip Technology | 数据表 | 46 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | ARM Cortex M3 | MCU - 31, FPGA - 78 | Tray | A2F200 | 微芯片技术 | 活跃 | TFBGA, BGA288,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 未说明 | 1.425 V | 85 °C | 无 | A2F200M3F-1CS288 | 100 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | SmartFusion | 176 | - | 有 | 2000 LE | 64 kB | - | - | 100 MHz | N | 0°C ~ 85°C (TJ) | Tray | A2F200 | e0 | 锡铅银 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B288 | 78 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | 现场可编程门阵列 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||
![]() | A2F500M3G-1CSG288 | Microchip Technology | 数据表 | 2421 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | ARM Cortex M3 | 微芯片技术 | 6000 LE | 有 | - | 176 | SmartFusion | MCU - 31, FPGA - 78 | Tray | A2F500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 100 MHz | - | - | 64 kB | 0°C ~ 85°C (TJ) | Tray | A2F500 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1VFG400I | Microchip Technology | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 12084 LE | 有 | 1007 LAB | 90 | 2.5, 3.3 V | 1.14 V | 微芯片技术 | 1.26 V | 195 | Tray | M2S010 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 有 | M2S010T-1VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||
![]() | M2S090-1FGG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 1.2000 V | 267 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1FG256 | Microchip Technology | 数据表 | 2808 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | ARM Cortex M3 | SMD/SMT | 100 MHz | - | - | 64 kB | 6000 LE | 117 I/O | 0 C | + 85 C | 有 | - | 微芯片技术 | 90 | SmartFusion | 1.5000 V | 1.425 V | 1.575 V | Tray | A2F500 | 活跃 | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A2F500M3G-1FG256 | 100 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | This product may require additional documentation to export from the United States. | N | 0 to 85 °C | Tray | A2F500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | 现场可编程门阵列 | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 17 mm | 17 mm | ||||||||||||
![]() | M2S060-1FCS325I | Microchip Technology | 数据表 | 2351 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | Tray | 微芯片技术 | M2S060 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 无 | M2S060-1FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | SmartFusion2 | 200 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||
![]() | A2F500M3G-1PQ208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208-PQFP (28x28) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 100 MHz | - | - | 64 kB | 6000 LE | 113 I/O | - 40 C | + 100 C | 有 | - | 24 | SmartFusion | 0.183425 oz | Tray | A2F500M3G | Obsolete | -40°C ~ 100°C (TJ) | Tray | A2F500 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1FGG484I | Microchip Technology | 数据表 | 2692 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 267 | Tray | 微芯片技术 | M2S050 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 1.14 V | 有 | M2S050T-1FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | 60 | 4695 LAB | 有 | 56340 LE | 64 kB | - | - | 166 MHz | SMD/SMT | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||
![]() | M2S050T-FGG896 | Microchip Technology | 数据表 | 2014 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | ARM Cortex M3 | 56340 LE | 377 I/O | 0 C | + 85 C | 有 | 4695 LAB | 微芯片技术 | 27 | 1.2000 V | Tray | M2S050 | 活跃 | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050T-FGG896 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 2.31 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | |||||||||||||||||||
![]() | M2S005S-1FGG484T2 | Microchip Technology | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 505 LAB | 60 | 1.2000 V | 活跃 | M2S005 | Tray | , | 40 | 有 | M2S005S-1FGG484T2 | 活跃 | MICROSEMI CORP | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 209 I/O | 0 C | + 85 C | 191 kbit | 有 | 0 to 85 °C | Tray | SmartFusion2 | e1 | 有 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1FGG484I | Microchip Technology | 数据表 | 2532 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 60 | 1.2000 V | 267 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1VFG400 | Microchip Technology | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 1007 LAB | 90 | 195 | Tray | 微芯片技术 | M2S010 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S010-1VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||
![]() | M2S050-1VFG400I | Microchip Technology | 数据表 | 2181 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | SMD/SMT | 207 | Tray | 微芯片技术 | M2S050 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 有 | M2S050-1VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | 90 | 4695 LAB | 有 | 56340 LE | 64 kB | - | - | 166 MHz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||
![]() | A2F500M3G-CS288 | Microchip Technology | 数据表 | 46 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | ARM Cortex M3 | 微芯片技术 | 6000 LE | 有 | - | 176 | SmartFusion | MCU - 31, FPGA - 78 | Tray | A2F500 | 活跃 | 64 kB | - | - | 80 MHz | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VF256I | Microchip Technology | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | Tray | 微芯片技术 | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 无 | M2S010TS-1VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | 138 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||
![]() | M2S005S-1VFG400T2 | Microchip Technology | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 171 I/O | 0 C | + 85 C | 191 kbit | 有 | 505 LAB | 90 | 0.652216 oz | 1.2000 V | Tray | M2S005 | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FCSG325 | Microchip Technology | 数据表 | 2248 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | SmartFusion2 | 200 | Tray | 微芯片技术 | M2S060 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S060T-1FCSG325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.82 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||
![]() | A2F500M3G-1CS288 | Microchip Technology | 数据表 | 48 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | ARM Cortex M3 | 176 | SmartFusion | MCU - 31, FPGA - 78 | Tray | 微芯片技术 | A2F500 | 活跃 | TFBGA, BGA288,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 未说明 | 1.425 V | 85 °C | 无 | A2F500M3G-1CS288 | 100 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | This product may require additional documentation to export from the United States. | N | 100 MHz | - | - | 64 kB | 6000 LE | 有 | - | 0°C ~ 85°C (TJ) | Tray | A2F500 | e0 | 锡铅银 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B288 | 78 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | 现场可编程门阵列 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 11 mm | 11 mm | ||||||||||||||||||||
![]() | A2F200M3F-1FG484I | Microchip Technology | 数据表 | 2709 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 100 MHz | - | - | 64 kB | 2000 LE | 161 I/O | - 40 C | + 100 C | 有 | - | 60 | SmartFusion | Tray | A2F200 | 活跃 | N | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FGG676I | Microchip Technology | 数据表 | 2638 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | 4710 LAB | 40 | SmartFusion2 | 387 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1FCS325I | Microchip Technology | 数据表 | 2251 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | Tray | 微芯片技术 | M2S025 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 无 | M2S025TS-1FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 180 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||
![]() | M2S025TS-FCS325I | Microchip Technology | 数据表 | 2551 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | 有 | 2308 LAB | 176 | 180 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB |
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