品牌是'Microchip' (873)

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生命周期状态

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包装/外壳

表面安装

供应商器件包装

终端数量

Core

厂商

操作温度

包装

系列

JESD-609代码

温度系数

类型

电阻

端子表面处理

性别

附加功能

HTS代码

子类别

额定功率

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

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Reach合规守则

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引脚数量

JESD-30代码

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负载电容

端口的数量

速度

内存大小

输出电流

核心处理器

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建筑学

输入数量

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座位高度-最大

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产品类别

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速度等级

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主要属性

逻辑块数量

逻辑单元数

核数量

等效门数

输出电平

闪光大小

输入电压

产品类别

长度

宽度

M2S060T-1FGG676I
M2S060T-1FGG676I
Microchip Technology 数据表

2494 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

微芯片技术

-

-

166 MHz

Details

This product may require additional documentation to export from the United States.

1.2000 V

387

Tray

M2S060

活跃

MICROSEMI CORP

1.26 V

5.8

活跃

SQUARE

BGA

M2S060T-1FGG676I

1.14 V

40

1.2 V

BGA676,26X26,40

PLASTIC/EPOXY

3

网格排列

FBGA-676

SmartFusion2

40

4710 LAB

56520 LE

64 kB

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

387

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

1

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

M2S090T-1FG484I
M2S090T-1FG484I
Microchip Technology 数据表

2929 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

-

-

64 kB

86316 LE

7193 LAB

60

1.2000 V

267

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S090T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S025TS-VF256
M2S025TS-VF256
Microchip Technology 数据表

2605 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

-

64 kB

27696 LE

2308 LAB

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010TS-1VFG400
M2S010TS-1VFG400
Microchip Technology 数据表

39 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

90

1007 LAB

12084 LE

64 kB

-

-

166 MHz

SMD/SMT

Details

This product may require additional documentation to export from the United States.

195

Tray

M2S010

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S025TS-VF400I
M2S025TS-VF400I
Microchip Technology 数据表

2019 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S090-1FG676I
M2S090-1FG676I
Microchip 数据表

2600 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

微芯片技术

425

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

M2S150T-1FC1152I
M2S150T-1FC1152I
Microchip 数据表

2249 In Stock

-

最小起订量: 1

最小包装量: 1

Gold

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

15

微芯片技术

M2S150T-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

Copper Alloy

PCT (Polychlorinated Terphenyl)

Solder

直角

1.2 V

1.14 V

1.26 V

574

Tray

M2S150

活跃

-

166 MHz

146124 LE

1.234218 oz

24

SMD/SMT

12177 LAB

Microchip

Microchip Technology / Atmel

N

-

64 kB

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

-55 to 125 °C

Tray

SmartFusion®2

e0

D-Subminiature

Tin/Lead (Sn/Pb)

Receptacle

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

1152

S-PBGA-B1152

574

不合格

15 POS

1.2 V

1

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

SoC FPGA

1

FPGA - 150K Logic Modules

146124

1 Core

512KB

SoC FPGA

35 mm

35 mm

M2S025T-1VFG400I
M2S025T-1VFG400I
Microchip 数据表

2310 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

通孔

207

Tray

M2S025

活跃

-

166 MHz

27696 LE

SMD/SMT

-

64 kB

Eighth-Brick

-40 to 125 °C

SmartFusion®2

Step Down

8

1

3.3 V

166MHz

64KB

20 A

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

66 W

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

36 to 75 V

M2S050-VFG400
M2S050-VFG400
Microchip 数据表

78 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

65nm

1.26(V)

1.2(V)

1.14(V)

0C

56340

表面贴装

207

Tray

M2S050

活跃

-

166 MHz

56340 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

SMARTFUSION2

85C

COMMERCIALC

VFBGA

0C to 85C

207

56340

0°C ~ 85°C (TJ)

Tray

SmartFusion®2

400

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

M2S090-1FG484I
M2S090-1FG484I
Microchip 数据表

2571 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

267

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

M2S005-1FGG484I
M2S005-1FGG484I
Microchip 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

6060 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S005-1FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.79

1.2000 V

MSL 3 - 168 hours

209

Tray

M2S005

活跃

-

166 MHz

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

209

2.44 mm

现场可编程门阵列

191Kbit

1

FPGA - 5K Logic Modules

6060

1 Core

128KB

23 mm

23 mm

M2S005-TQ144
M2S005-TQ144
Microchip 数据表

2679 In Stock

-

最小起订量: 1

最小包装量: 1

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

Tray

Obsolete

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.2 V

30

1.14 V

85 °C

M2S005-TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.85

84

0°C ~ 85°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

240

0.5 mm

not_compliant

S-PQFP-G144

84

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

84

1.6 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

128KB

20 mm

20 mm

M2S005S-VFG256I
M2S005S-VFG256I
Microchip 数据表

164 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

-

166 MHz

6060 LE

119

SMD/SMT

505 LAB

Microchip

Microchip Technology / Atmel

Details

-

64 kB

161

Tray

M2S005

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

M2S005S-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

2.4

50 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

8.06

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

SOC - Systems on a Chip

0.125 W

CMOS

BOTTOM

BALL

250

0.8 mm

通用型

compliant

S-PBGA-B256

161

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

SoC FPGA

1

FPGA - 5K Logic Modules

6060

1 Core

128KB

SoC FPGA

14 mm

14 mm

M2S010-FGG484
M2S010-FGG484
Microchip 数据表

42 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

SMD/SMT

-

64 kB

1.2000 V

1.14 V

1.26 V

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

+ 85 C

0 C

0 to 85 °C

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S005S-1VFG256I
M2S005S-1VFG256I
Microchip 数据表

223 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

161

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S005-VFG400
M2S005-VFG400
Microchip 数据表

38 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

-

166 MHz

6060 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

85 °C

M2S005-VFG400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.28

2.5, 3.3 V

169

Tray

M2S005

活跃

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

STD

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

A2F500M3G-FGG484I
A2F500M3G-FGG484I
Microchip 数据表

2018 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

A2F500M3G-FGG484I

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.22

-

80 MHz

6000 LE

204 I/O

+ 100 C

0.062696 oz

- 40 C

60

SMD/SMT

-

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

-40°C ~ 100°C (TJ)

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

SoC FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

M2S025-VFG400
M2S025-VFG400
Microchip 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

活跃

-

166 MHz

27696 LE

-

64 kB

207

Tray

M2S025

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

A2F500M3G-1FGG484
A2F500M3G-1FGG484
Microchip 数据表

2990 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.5 V

40

1.425 V

85 °C

A2F500M3G-1FGG484

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.36

1.5000 V

1.425 V

1.575 V

MCU - 41, FPGA - 128

Tray

A2F500

活跃

-

100 MHz

6000 LE

+ 85 C

0.534969 oz

0 C

60

SMD/SMT

-

Microchip

Microchip Technology / Atmel

SmartFusion

Details

-

64 kB

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

0 to 85 °C

Tray

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

SoC FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

M2S025-FGG484
M2S025-FGG484
Microchip 数据表

121 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

166 MHz

27696 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

25 V

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

-

0 to 85 °C

SmartFusion®2

200 ppm/°C

6.8

0.05 W

通用型

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

1

FPGA - 25K Logic Modules

1 Core

256KB

M2S010T-FGG484
M2S010T-FGG484
Microchip 数据表

22 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

166 MHz

12084 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

233

Tray

M2S010

活跃

-

0°C ~ 85°C (TJ)

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S010TS-1VFG256I
M2S010TS-1VFG256I
Microchip 数据表

137 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-256

256-FPBGA (17x17)

微芯片技术

Microchip

Microchip Technology / Atmel

-

64 kB

138

Tray

M2S010

活跃

Compliant

This product may require additional documentation to export from the United States.

-

166 MHz

12084 LE

119

SMD/SMT

1007 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

SOC - Systems on a Chip

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

FPGA - 10K Logic Modules

1 Core

256KB

SoC FPGA

A2F500M3G-FGG484
A2F500M3G-FGG484
Microchip 数据表

2299 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

SmartFusion

微芯片技术

Details

-

64 kB

Tray

A2F500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

40

1.425 V

85 °C

A2F500M3G-FGG484

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.37

±2.8(20th) ppm/Year

40 MHz

40 MHz

表面贴装

1.5000 V

1.425 V

500000

500000

1.575 V

This product may require additional documentation to export from the United States.

-

80 MHz

6000 LE

204 I/O

+ 85 C

0 C

60

SMD/SMT

-

Microchip

Microchip Technology / Atmel

-20 to 70 °C

Tray

A2F500

e1

Temperature Compensated Crystal Oscillator (TCXO)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

4.6 ppm

10

S-PBGA-B484

128

不合格

3.0000 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

10 pF

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

SoC FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

削波正弦波

512KB

SoC FPGA

23 mm

23 mm

M2S010S-1TQ144I
M2S010S-1TQ144I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

144-LQFP

144-TQFP (20x20)

微芯片技术

Tray

Obsolete

84

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

256KB

M2S050TS-FCS325
M2S050TS-FCS325
Microchip 数据表

2919 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

M2S050

活跃

-

166 MHz

56340 LE

-

64 kB

Non-Compliant

200

Tray

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB