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![]() | M2S060T-1FGG676I | Microchip Technology | 数据表 | 2494 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | 微芯片技术 | - | - | 166 MHz | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 387 | Tray | M2S060 | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | 活跃 | SQUARE | BGA | M2S060T-1FGG676I | 有 | 1.14 V | 40 | 1.2 V | BGA676,26X26,40 | PLASTIC/EPOXY | 3 | 网格排列 | FBGA-676 | SmartFusion2 | 40 | 4710 LAB | 有 | 56520 LE | 64 kB | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FG484I | Microchip Technology | 数据表 | 2929 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 1.2000 V | 267 | Tray | M2S090 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S090T-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VF256 | Microchip Technology | 数据表 | 2605 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VFG400 | Microchip Technology | 数据表 | 39 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 90 | 1007 LAB | 有 | 12084 LE | 64 kB | - | - | 166 MHz | SMD/SMT | Details | This product may require additional documentation to export from the United States. | 195 | Tray | M2S010 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VF400I | Microchip Technology | 数据表 | 2019 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FG676I | Microchip | 数据表 | 2600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | 425 | Tray | M2S090 | 活跃 | - | 166 MHz | 86316 LE | SMD/SMT | - | 64 kB | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FC1152I | Microchip | 数据表 | 2249 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Gold | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 15 | 微芯片技术 | 无 | M2S150T-1FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | Copper Alloy | PCT (Polychlorinated Terphenyl) | Solder | 直角 | 1.2 V | 1.14 V | 1.26 V | 574 | Tray | M2S150 | 活跃 | 有 | - | 166 MHz | 146124 LE | 1.234218 oz | 24 | SMD/SMT | 12177 LAB | Microchip | Microchip Technology / Atmel | N | - | 64 kB | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | -55 to 125 °C | Tray | SmartFusion®2 | e0 | D-Subminiature | Tin/Lead (Sn/Pb) | Receptacle | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 574 | 不合格 | 15 POS | 1.2 V | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | SoC FPGA | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1VFG400I | Microchip | 数据表 | 2310 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 有 | 通孔 | 207 | Tray | M2S025 | 活跃 | - | 166 MHz | 27696 LE | SMD/SMT | - | 64 kB | Eighth-Brick | -40 to 125 °C | SmartFusion®2 | Step Down | 8 | 1 | 3.3 V | 166MHz | 64KB | 20 A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 66 W | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | 36 to 75 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-VFG400 | Microchip | 数据表 | 78 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 65nm | 1.26(V) | 1.2(V) | 无 | 1.14(V) | 0C | 有 | 56340 | 表面贴装 | 207 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | + 85 C | 0 C | SMD/SMT | - | 64 kB | SMARTFUSION2 | 85C | COMMERCIALC | VFBGA | 0C to 85C | 207 | 56340 | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | 400 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FG484I | Microchip | 数据表 | 2571 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | Tray | M2S090 | 活跃 | - | 166 MHz | 86316 LE | SMD/SMT | - | 64 kB | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-1FGG484I | Microchip | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 6060 LE | SMD/SMT | - | 64 kB | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S005-1FGG484I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.79 | 1.2000 V | MSL 3 - 168 hours | 209 | Tray | M2S005 | 活跃 | - | 166 MHz | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | 现场可编程门阵列 | 191Kbit | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-TQ144 | Microchip | 数据表 | 2679 In Stock | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | Tray | Obsolete | TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S005-TQ144 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.85 | 84 | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-VFG256I | Microchip | 数据表 | 164 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 有 | - | 166 MHz | 6060 LE | 119 | SMD/SMT | 505 LAB | Microchip | Microchip Technology / Atmel | Details | - | 64 kB | 161 | Tray | M2S005 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 有 | M2S005S-VFG256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 2.4 | 50 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | 8.06 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | 0.125 W | CMOS | BOTTOM | BALL | 250 | 0.8 mm | 通用型 | compliant | S-PBGA-B256 | 161 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | 现场可编程门阵列 | SoC FPGA | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | SoC FPGA | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-FGG484 | Microchip | 数据表 | 42 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | SMD/SMT | - | 64 kB | 1.2000 V | 1.14 V | 1.26 V | 233 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | + 85 C | 0 C | 0 to 85 °C | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1VFG256I | Microchip | 数据表 | 223 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 161 | Tray | M2S005 | 活跃 | - | 166 MHz | 6060 LE | SMD/SMT | - | 64 kB | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-VFG400 | Microchip | 数据表 | 38 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | - | 166 MHz | 6060 LE | + 85 C | 0 C | SMD/SMT | - | 64 kB | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S005-VFG400 | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.28 | 2.5, 3.3 V | 169 | Tray | M2S005 | 活跃 | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | 现场可编程门阵列 | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FGG484I | Microchip | 数据表 | 2018 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 有 | A2F500M3G-FGG484I | 80 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.22 | 有 | - | 80 MHz | 6000 LE | 204 I/O | + 100 C | 0.062696 oz | - 40 C | 60 | SMD/SMT | - | Microchip | Microchip Technology / Atmel | SmartFusion | Details | - | 64 kB | Tray | A2F500 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | -40°C ~ 100°C (TJ) | Tray | A2F500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | 不合格 | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | 现场可编程门阵列 | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-VFG400 | Microchip | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 活跃 | - | 166 MHz | 27696 LE | - | 64 kB | 207 | Tray | M2S025 | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1FGG484 | Microchip | 数据表 | 2990 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | A2F500M3G-1FGG484 | 100 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 1.36 | 1.5000 V | 1.425 V | 1.575 V | MCU - 41, FPGA - 128 | Tray | A2F500 | 活跃 | 有 | - | 100 MHz | 6000 LE | + 85 C | 0.534969 oz | 0 C | 60 | SMD/SMT | - | Microchip | Microchip Technology / Atmel | SmartFusion | Details | - | 64 kB | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 0 to 85 °C | Tray | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | 不合格 | 1.5 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | 现场可编程门阵列 | SoC FPGA | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-FGG484 | Microchip | 数据表 | 121 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 166 MHz | 27696 LE | + 85 C | 0 C | SMD/SMT | - | 64 kB | 25 V | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S025 | 活跃 | - | 0 to 85 °C | SmartFusion®2 | 200 ppm/°C | 6.8 | 0.05 W | 通用型 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-FGG484 | Microchip | 数据表 | 22 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 166 MHz | 12084 LE | + 85 C | 0 C | SMD/SMT | - | 64 kB | 233 | Tray | M2S010 | 活跃 | - | 0°C ~ 85°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VFG256I | Microchip | 数据表 | 137 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | 256-FPBGA (17x17) | 微芯片技术 | Microchip | Microchip Technology / Atmel | - | 64 kB | 138 | Tray | M2S010 | 活跃 | Compliant | 有 | This product may require additional documentation to export from the United States. | - | 166 MHz | 12084 LE | 119 | SMD/SMT | 1007 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FGG484 | Microchip | 数据表 | 2299 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | SmartFusion | 微芯片技术 | Details | - | 64 kB | Tray | A2F500 | 活跃 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | A2F500M3G-FGG484 | 80 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 1.37 | ±2.8(20th) ppm/Year | 40 MHz | 40 MHz | 表面贴装 | 1.5000 V | 1.425 V | 500000 | 500000 | 1.575 V | 有 | This product may require additional documentation to export from the United States. | - | 80 MHz | 6000 LE | 204 I/O | + 85 C | 0 C | 60 | SMD/SMT | - | Microchip | Microchip Technology / Atmel | -20 to 70 °C | Tray | A2F500 | e1 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 4.6 ppm | 10 | S-PBGA-B484 | 128 | 不合格 | 3.0000 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 10 pF | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | 现场可编程门阵列 | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 削波正弦波 | 512KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010S-1TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | Tray | Obsolete | 84 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-FCS325 | Microchip | 数据表 | 2919 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | M2S050 | 活跃 | - | 166 MHz | 56340 LE | - | 64 kB | Non-Compliant | 200 | Tray | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB |
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