Microchip的片上系统（SoC）_正品采购_价格信息

品牌是'Microchip' (873)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量			Core																		厂商																																																操作温度	包装	系列	JESD-609代码	端子表面处理	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)
M2S010S-1TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	- 40 C	+ 100 C	400 kbit	60	1007 LAB	1.2000 V	1.14 V	1.26 V	Tray	M2S010	活跃				-40 to 100 °C	Tray	SmartFusion2																			1.2 V				166MHz	64KB	ARM® Cortex®-M3	-		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									1		FPGA - 10K Logic Modules		1 Core	256KB
M2S010S-TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	+ 100 C	400 kbit	1007 LAB	60	Tray	M2S010	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	- 40 C	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																			1.2 V				166MHz	64KB	ARM® Cortex®-M3	-		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 10K Logic Modules		1 Core	256KB
PIC32CX1025SG41100-I/E5X	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-100	微芯片技术	120 MHz	PIC32CX	81 I/O	3.63 V	1.71 V					Details	- 40 C		+ 85 C	CAN, Ethernet, USB	SMD/SMT	1000	Tray	活跃	EV06X38A		Tray	-																			1.71 V to 3.63 V								Flash	1 MB							- 40 C to + 85 C					32 Channel
MPFS025T-FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCVG-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术	16 kB, 4 x 32 kB	4 x 32 kB	-	23000 LE	108 I/O	0 C	+ 100 C	1	MSL 3 - 168 hours	Tray	活跃				SMD/SMT	667 MHz, 667 MHz	-40°C ~ 100°C	Tray	-																			1 V				-	230.4KB	RISC-V	DMA, PCI, PWM		-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							1843.2Kbit				FPGA - 23K Logic Modules		5 Core	128KB
A2F500M3G-FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	Tray	A2F500	活跃				This product may require additional documentation to export from the United States.	N	80 MHz	-	-	64 kB	6000 LE	有	-	60	SmartFusion	MCU - 41, FPGA - 128	-55°C ~ 125°C (TJ)	Tray	A2F500			125 °C	-55 °C									80 MHz									EBI/EMI, Ethernet, I2C, SPI, UART, USART	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA						ARM					ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		1 Core	512KB
M2S025-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 25K Logic Modules		1 Core	256KB
M2S005-VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	5.78		Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	169 I/O	- 40 C	+ 100 C	有	505 LAB	90	0.346560 oz	Tray	M2S005	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	有	M2S005-VFG400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	171	不合格	1.2 V	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		171	1.51 mm	现场可编程门阵列				STD		FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S005-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	-	-	166 MHz	N	169	Tray	M2S005	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S005-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		0.356867 oz	90	505 LAB	有	6060 LE	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	171	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		171	1.51 mm	现场可编程门阵列						FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S005-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	微芯片技术	5.79		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119	161	Tray	M2S005	活跃	MSL 3 - 168 hours	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S005-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B256	161	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	-		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		161	1.56 mm	现场可编程门阵列		191Kbit				FPGA - 5K Logic Modules	6060	1 Core	128KB	14 mm	14 mm
A2F500M3G-FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	Tray	A2F500	活跃				This product may require additional documentation to export from the United States.	Details	80 MHz	-	-	64 kB	6000 LE	有	-	60	SmartFusion	MCU - 41, FPGA - 128	-55°C ~ 125°C (TJ)	Tray	A2F500																							80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA											ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		1 Core	512KB
M2S150T-1FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	84	273	Tray	M2S150	活跃		-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 150K Logic Modules		1 Core	512KB
M2S090TS-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	SMARTFUSION2	100C	INDUSTRIALC	FCBGA	-40C to 100C	180	86184	65nm	1.26(V)	1.2(V)	无	1.14(V)	-40C	有	86184	表面贴装	180	Tray	M2S090	活跃		-40°C ~ 100°C (TJ)	Tray	SmartFusion2															325								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								1		FPGA - 90K Logic Modules		1 Core	512KB
M2S150TS-1FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 150K Logic Modules		1 Core	512KB
M2S090TS-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术	Tray	M2S090	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 90K Logic Modules		1 Core	512KB
M2S090T-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	1.14 V	1.26 V	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	1.14 V	有	M2S090T-1FGG484I	BGA	SQUARE	活跃	FPGA - Field Programmable Gate Array M2S090T-1FGG484I	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		40		S-PBGA-B484	267	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列				1		FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S060T-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S060T-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	267	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列						FPGA - 60K Logic Modules	56520	1 Core	256KB	23 mm	23 mm
M2S010TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 10K Logic Modules		1 Core	256KB
M2S050TS-1FGG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	377	Tray	M2S050	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 50K Logic Modules		1 Core	256KB
M2S060TS-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	Tray	M2S060	活跃	Industrial grade			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	1	CAN/Ethernet/Serial I2C/SPI/UART/USB	有	表面贴装	200	-40 to 100 °C	Tray	SmartFusion2															325				1.2 V			CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit							Industrial			FPGA - 60K Logic Modules		1 Core	256KB
M2S060-VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	56520 LE	有	4710 LAB	90	SmartFusion2	1.2000 V	1.14 V	1.26 V	207	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	-40 to 100 °C	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									STD		FPGA - 60K Logic Modules		1 Core	256KB
M2S025-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S025-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	180	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.01 mm	现场可编程门阵列						FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S010-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	12084 LE	64 kB	-	-	166 MHz	SMD/SMT	N	This product may require additional documentation to export from the United States.	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃				90	1007 LAB	有	0 to 85 °C	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									STD		FPGA - 10K Logic Modules		1 Core	256KB
M2S090-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	3	GRID ARRAY, THIN PROFILE, FINE PITCH	TFBGA, BGA325,21X21,20		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	1.2000 V	1.14 V	1.26 V	180	Tray	M2S090	活跃	5.78	1.26 V	MICROSEMI CORP	活跃	RECTANGULAR	TFBGA	M2S090-1FCSG325I	有	1.14 V	40	1.2 V	BGA325,21X21,20	PLASTIC/EPOXY	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant				R-PBGA-B325	180	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列				1		FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S050T-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	1.26 V	5.76	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	2.5, 3.3 V	1.14 V	1.26 V	200	Tray	M2S050	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S050T-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant				S-PBGA-B325	200	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列				STD		FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S005S-1TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	505 LAB	60	0.046530 oz	活跃	M2S005	Tray	84				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	-		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 5K Logic Modules		1 Core	128KB